JPS53146574A - Etching method for semiconductor element - Google Patents

Etching method for semiconductor element

Info

Publication number
JPS53146574A
JPS53146574A JP6115277A JP6115277A JPS53146574A JP S53146574 A JPS53146574 A JP S53146574A JP 6115277 A JP6115277 A JP 6115277A JP 6115277 A JP6115277 A JP 6115277A JP S53146574 A JPS53146574 A JP S53146574A
Authority
JP
Japan
Prior art keywords
semiconductor element
etching method
nozzle
shorten
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6115277A
Other languages
Japanese (ja)
Inventor
Katsumi Akabane
Takeshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6115277A priority Critical patent/JPS53146574A/en
Publication of JPS53146574A publication Critical patent/JPS53146574A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To shorten the etching time as well as to ensure a high dielectric strength for the semiconductor element by providing plural pairs of the etching solution nozzle, the demineralized water nozzle and the drying nozzle respectively.
COPYRIGHT: (C)1978,JPO&Japio
JP6115277A 1977-05-27 1977-05-27 Etching method for semiconductor element Pending JPS53146574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6115277A JPS53146574A (en) 1977-05-27 1977-05-27 Etching method for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6115277A JPS53146574A (en) 1977-05-27 1977-05-27 Etching method for semiconductor element

Publications (1)

Publication Number Publication Date
JPS53146574A true JPS53146574A (en) 1978-12-20

Family

ID=13162852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6115277A Pending JPS53146574A (en) 1977-05-27 1977-05-27 Etching method for semiconductor element

Country Status (1)

Country Link
JP (1) JPS53146574A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4609575A (en) * 1984-07-02 1986-09-02 Fsi Corporation Method of apparatus for applying chemicals to substrates in an acid processing system

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5129090A (en) * 1974-09-06 1976-03-11 Hitachi Ltd HANDOTAISOSHINOETSUCHINGUHOHO

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5129090A (en) * 1974-09-06 1976-03-11 Hitachi Ltd HANDOTAISOSHINOETSUCHINGUHOHO

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4609575A (en) * 1984-07-02 1986-09-02 Fsi Corporation Method of apparatus for applying chemicals to substrates in an acid processing system

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