JPS5313696A - Solventless and curable composition - Google Patents

Solventless and curable composition

Info

Publication number
JPS5313696A
JPS5313696A JP8835376A JP8835376A JPS5313696A JP S5313696 A JPS5313696 A JP S5313696A JP 8835376 A JP8835376 A JP 8835376A JP 8835376 A JP8835376 A JP 8835376A JP S5313696 A JPS5313696 A JP S5313696A
Authority
JP
Japan
Prior art keywords
curable composition
solventless
compound
heat
hardening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8835376A
Other languages
English (en)
Other versions
JPS6125736B2 (ja
Inventor
Hajime Kakumaru
Masahiro Abo
Katsushige Tsukada
Nobuyuki Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP8835376A priority Critical patent/JPS5313696A/ja
Publication of JPS5313696A publication Critical patent/JPS5313696A/ja
Publication of JPS6125736B2 publication Critical patent/JPS6125736B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • ing And Chemical Polishing (AREA)
JP8835376A 1976-07-23 1976-07-23 Solventless and curable composition Granted JPS5313696A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8835376A JPS5313696A (en) 1976-07-23 1976-07-23 Solventless and curable composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8835376A JPS5313696A (en) 1976-07-23 1976-07-23 Solventless and curable composition

Publications (2)

Publication Number Publication Date
JPS5313696A true JPS5313696A (en) 1978-02-07
JPS6125736B2 JPS6125736B2 (ja) 1986-06-17

Family

ID=13940446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8835376A Granted JPS5313696A (en) 1976-07-23 1976-07-23 Solventless and curable composition

Country Status (1)

Country Link
JP (1) JPS5313696A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58162502A (ja) * 1982-03-09 1983-09-27 バイエル・アクチエンゲゼルシヤフト 殺虫剤組成物類
JP2013057049A (ja) * 2011-03-07 2013-03-28 Sanyo Chem Ind Ltd 感光性組成物
JP5181224B2 (ja) * 2008-04-28 2013-04-10 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法
US8460853B2 (en) 2008-06-02 2013-06-11 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method
JP2014056123A (ja) * 2012-09-12 2014-03-27 Sanyo Chem Ind Ltd 感光性組成物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2760863A (en) * 1951-08-20 1956-08-28 Du Pont Photographic preparation of relief images
JPS4851035A (ja) * 1971-10-30 1973-07-18

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2760863A (en) * 1951-08-20 1956-08-28 Du Pont Photographic preparation of relief images
JPS4851035A (ja) * 1971-10-30 1973-07-18

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58162502A (ja) * 1982-03-09 1983-09-27 バイエル・アクチエンゲゼルシヤフト 殺虫剤組成物類
JPH0524121B2 (ja) * 1982-03-09 1993-04-06 Bayer Ag
JP5181224B2 (ja) * 2008-04-28 2013-04-10 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法
US8460852B2 (en) 2008-04-28 2013-06-11 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board
US8460853B2 (en) 2008-06-02 2013-06-11 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method
JP2013057049A (ja) * 2011-03-07 2013-03-28 Sanyo Chem Ind Ltd 感光性組成物
JP2014056123A (ja) * 2012-09-12 2014-03-27 Sanyo Chem Ind Ltd 感光性組成物

Also Published As

Publication number Publication date
JPS6125736B2 (ja) 1986-06-17

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