JPS53108369A - Electronic components - Google Patents

Electronic components

Info

Publication number
JPS53108369A
JPS53108369A JP2270377A JP2270377A JPS53108369A JP S53108369 A JPS53108369 A JP S53108369A JP 2270377 A JP2270377 A JP 2270377A JP 2270377 A JP2270377 A JP 2270377A JP S53108369 A JPS53108369 A JP S53108369A
Authority
JP
Japan
Prior art keywords
electronic components
lead
glass
tthe
boundary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2270377A
Other languages
English (en)
Inventor
Eiji Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2270377A priority Critical patent/JPS53108369A/ja
Publication of JPS53108369A publication Critical patent/JPS53108369A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
JP2270377A 1977-03-04 1977-03-04 Electronic components Pending JPS53108369A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2270377A JPS53108369A (en) 1977-03-04 1977-03-04 Electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2270377A JPS53108369A (en) 1977-03-04 1977-03-04 Electronic components

Publications (1)

Publication Number Publication Date
JPS53108369A true JPS53108369A (en) 1978-09-21

Family

ID=12090212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2270377A Pending JPS53108369A (en) 1977-03-04 1977-03-04 Electronic components

Country Status (1)

Country Link
JP (1) JPS53108369A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57112057A (en) * 1980-12-29 1982-07-12 Fujitsu Ltd Semiconductor device
JPS58114444A (ja) * 1981-12-26 1983-07-07 Fujitsu Ltd 半導体装置
JPS58164255A (ja) * 1982-03-23 1983-09-29 Fujitsu Ltd 半導体装置
JPS58210650A (ja) * 1982-06-01 1983-12-07 Fujitsu Ltd 半導体装置
JPH0521495A (ja) * 1991-07-16 1993-01-29 Kyocera Corp 半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57112057A (en) * 1980-12-29 1982-07-12 Fujitsu Ltd Semiconductor device
JPS58114444A (ja) * 1981-12-26 1983-07-07 Fujitsu Ltd 半導体装置
JPS58164255A (ja) * 1982-03-23 1983-09-29 Fujitsu Ltd 半導体装置
JPS58210650A (ja) * 1982-06-01 1983-12-07 Fujitsu Ltd 半導体装置
JPH0521495A (ja) * 1991-07-16 1993-01-29 Kyocera Corp 半導体装置

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