JPS53105967A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS53105967A
JPS53105967A JP2123177A JP2123177A JPS53105967A JP S53105967 A JPS53105967 A JP S53105967A JP 2123177 A JP2123177 A JP 2123177A JP 2123177 A JP2123177 A JP 2123177A JP S53105967 A JPS53105967 A JP S53105967A
Authority
JP
Japan
Prior art keywords
semiconductor device
vamp
pellet
closest
avoid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2123177A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6114665B2 (en, 2012
Inventor
Takashi Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2123177A priority Critical patent/JPS53105967A/ja
Publication of JPS53105967A publication Critical patent/JPS53105967A/ja
Publication of JPS6114665B2 publication Critical patent/JPS6114665B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP2123177A 1977-02-28 1977-02-28 Semiconductor device Granted JPS53105967A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2123177A JPS53105967A (en) 1977-02-28 1977-02-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2123177A JPS53105967A (en) 1977-02-28 1977-02-28 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS53105967A true JPS53105967A (en) 1978-09-14
JPS6114665B2 JPS6114665B2 (en, 2012) 1986-04-19

Family

ID=12049246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2123177A Granted JPS53105967A (en) 1977-02-28 1977-02-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS53105967A (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5572062A (en) * 1978-11-27 1980-05-30 Nec Corp Semiconductor device and preparation thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5572062A (en) * 1978-11-27 1980-05-30 Nec Corp Semiconductor device and preparation thereof

Also Published As

Publication number Publication date
JPS6114665B2 (en, 2012) 1986-04-19

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