JPS53100152A - Composite soldering material and manufacture thereof - Google Patents

Composite soldering material and manufacture thereof

Info

Publication number
JPS53100152A
JPS53100152A JP1513877A JP1513877A JPS53100152A JP S53100152 A JPS53100152 A JP S53100152A JP 1513877 A JP1513877 A JP 1513877A JP 1513877 A JP1513877 A JP 1513877A JP S53100152 A JPS53100152 A JP S53100152A
Authority
JP
Japan
Prior art keywords
manufacture
soldering material
composite soldering
solder
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1513877A
Other languages
English (en)
Inventor
Deiitoritsuhi.Eerushiyureegeru
Hideo Kono
Katsumi Nakada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP1513877A priority Critical patent/JPS53100152A/ja
Publication of JPS53100152A publication Critical patent/JPS53100152A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
JP1513877A 1977-02-15 1977-02-15 Composite soldering material and manufacture thereof Pending JPS53100152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1513877A JPS53100152A (en) 1977-02-15 1977-02-15 Composite soldering material and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1513877A JPS53100152A (en) 1977-02-15 1977-02-15 Composite soldering material and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS53100152A true JPS53100152A (en) 1978-09-01

Family

ID=11880450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1513877A Pending JPS53100152A (en) 1977-02-15 1977-02-15 Composite soldering material and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS53100152A (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02165893A (ja) * 1988-12-15 1990-06-26 Uchihashi Estec Co Ltd クリームはんだ
JPH0596395A (ja) * 1991-10-04 1993-04-20 Mitsubishi Electric Corp 接合材、接合方法および半導体装置
JP2008254010A (ja) * 2007-04-03 2008-10-23 Kanto Yakin Kogyo Co Ltd ろう付け方法
JP2009515711A (ja) * 2005-12-30 2009-04-16 インテル・コーポレーション ハンダ発泡体、ナノ多孔性ハンダ、チップパッケージが有する発泡ハンダバンプ、そのアセンブリ方法およびそれを含むシステム
CN104942476A (zh) * 2015-07-23 2015-09-30 徐鲁豫 一种自钎性钎料及其制备方法
CN107486651A (zh) * 2017-08-02 2017-12-19 中国电器科学研究院有限公司 一种低温焊料片的制备方法
WO2022127748A1 (zh) * 2020-12-16 2022-06-23 宁波施捷电子有限公司 一种超薄焊接垫片及制备方法、焊接方法与半导体器件

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50146555A (ja) * 1974-05-17 1975-11-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50146555A (ja) * 1974-05-17 1975-11-25

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02165893A (ja) * 1988-12-15 1990-06-26 Uchihashi Estec Co Ltd クリームはんだ
JPH0596395A (ja) * 1991-10-04 1993-04-20 Mitsubishi Electric Corp 接合材、接合方法および半導体装置
JP2009515711A (ja) * 2005-12-30 2009-04-16 インテル・コーポレーション ハンダ発泡体、ナノ多孔性ハンダ、チップパッケージが有する発泡ハンダバンプ、そのアセンブリ方法およびそれを含むシステム
JP2008254010A (ja) * 2007-04-03 2008-10-23 Kanto Yakin Kogyo Co Ltd ろう付け方法
CN104942476A (zh) * 2015-07-23 2015-09-30 徐鲁豫 一种自钎性钎料及其制备方法
CN107486651A (zh) * 2017-08-02 2017-12-19 中国电器科学研究院有限公司 一种低温焊料片的制备方法
WO2022127748A1 (zh) * 2020-12-16 2022-06-23 宁波施捷电子有限公司 一种超薄焊接垫片及制备方法、焊接方法与半导体器件

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