JPS5296867A - Semiconductor unit and its manufacture - Google Patents

Semiconductor unit and its manufacture

Info

Publication number
JPS5296867A
JPS5296867A JP1345076A JP1345076A JPS5296867A JP S5296867 A JPS5296867 A JP S5296867A JP 1345076 A JP1345076 A JP 1345076A JP 1345076 A JP1345076 A JP 1345076A JP S5296867 A JPS5296867 A JP S5296867A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor unit
layers
beam evaporation
electronic beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1345076A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5518049B2 (US07494231-20090224-C00006.png
Inventor
Hirotsugu Hattori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP1345076A priority Critical patent/JPS5296867A/ja
Publication of JPS5296867A publication Critical patent/JPS5296867A/ja
Publication of JPS5518049B2 publication Critical patent/JPS5518049B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/03—Manufacturing methods
    • H01L2224/034—Manufacturing methods by blanket deposition of the material of the bonding area
    • H01L2224/03444—Manufacturing methods by blanket deposition of the material of the bonding area in gaseous form
    • H01L2224/0345—Physical vapour deposition [PVD], e.g. evaporation, or sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
JP1345076A 1976-02-10 1976-02-10 Semiconductor unit and its manufacture Granted JPS5296867A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1345076A JPS5296867A (en) 1976-02-10 1976-02-10 Semiconductor unit and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1345076A JPS5296867A (en) 1976-02-10 1976-02-10 Semiconductor unit and its manufacture

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP14262579A Division JPS55108733A (en) 1979-11-01 1979-11-01 Method of manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5296867A true JPS5296867A (en) 1977-08-15
JPS5518049B2 JPS5518049B2 (US07494231-20090224-C00006.png) 1980-05-16

Family

ID=11833465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1345076A Granted JPS5296867A (en) 1976-02-10 1976-02-10 Semiconductor unit and its manufacture

Country Status (1)

Country Link
JP (1) JPS5296867A (US07494231-20090224-C00006.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172032U (US07494231-20090224-C00006.png) * 1986-03-25 1987-10-31

Also Published As

Publication number Publication date
JPS5518049B2 (US07494231-20090224-C00006.png) 1980-05-16

Similar Documents

Publication Publication Date Title
JPS5380966A (en) Manufacture of electrode fdr semiconductor device
JPS5394881A (en) Integrated circuit device
JPS53145562A (en) Electronic gun
JPS53115187A (en) Semiconductor device
JPS5296867A (en) Semiconductor unit and its manufacture
JPS52140269A (en) Formation of solder electrode
JPS5222789A (en) Transparent conductive film
JPS527675A (en) Semiconductor device
JPS5337378A (en) Manufacture ofr flat type electron tube
JPS51115764A (en) Manufacturing method of a magnetron
JPS5391684A (en) Semiconductor laser
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS51140565A (en) Semiconductor unit
JPS5228262A (en) Process for assembling semiconductor device
JPS5359366A (en) Semiconductor unit
JPS53139211A (en) Manufacturing of light alloy blade
JPS5383598A (en) Glass substrate
JPS5379461A (en) Semiconductor device and its manufacturing process
JPS52143186A (en) Taping device
JPS51117350A (en) Manufacturing method for heat conducting material for heat exchangers
JPS53142168A (en) Reproductive use of semiconductor substrate
JPS5419375A (en) Semiconductor device
JPS5414183A (en) Semiconductor laser element and its manufacture
JPS51142274A (en) Electrode lead for semiconductor device
JPS53118993A (en) Manufacture for semiconductor device