JPS5294777A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5294777A
JPS5294777A JP1199076A JP1199076A JPS5294777A JP S5294777 A JPS5294777 A JP S5294777A JP 1199076 A JP1199076 A JP 1199076A JP 1199076 A JP1199076 A JP 1199076A JP S5294777 A JPS5294777 A JP S5294777A
Authority
JP
Japan
Prior art keywords
semiconductor device
dischrger
airtightness
surround
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1199076A
Other languages
Japanese (ja)
Inventor
Akira Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP1199076A priority Critical patent/JPS5294777A/en
Publication of JPS5294777A publication Critical patent/JPS5294777A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: The soft ring-shaped rubber tube containing gas absorption sector is used to surround the area between copper heat dischrger unit pairs for flat-type silicon rectification stack. As a result, the airtightness can be increased to withstand use for a long period of time.
COPYRIGHT: (C)1977,JPO&Japio
JP1199076A 1976-02-05 1976-02-05 Semiconductor device Pending JPS5294777A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1199076A JPS5294777A (en) 1976-02-05 1976-02-05 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1199076A JPS5294777A (en) 1976-02-05 1976-02-05 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5294777A true JPS5294777A (en) 1977-08-09

Family

ID=11793013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1199076A Pending JPS5294777A (en) 1976-02-05 1976-02-05 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5294777A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133448U (en) * 1984-07-28 1986-02-28 東北金属工業株式会社 High power semiconductor heat dissipation device
JP2011233704A (en) * 2010-04-27 2011-11-17 Mitsubishi Electric Corp Pressure-contact type semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133448U (en) * 1984-07-28 1986-02-28 東北金属工業株式会社 High power semiconductor heat dissipation device
JP2011233704A (en) * 2010-04-27 2011-11-17 Mitsubishi Electric Corp Pressure-contact type semiconductor device

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