JPS5285935A - Peeling solution for copper plating - Google Patents

Peeling solution for copper plating

Info

Publication number
JPS5285935A
JPS5285935A JP266276A JP266276A JPS5285935A JP S5285935 A JPS5285935 A JP S5285935A JP 266276 A JP266276 A JP 266276A JP 266276 A JP266276 A JP 266276A JP S5285935 A JPS5285935 A JP S5285935A
Authority
JP
Japan
Prior art keywords
copper plating
peeling solution
peeling
solution
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP266276A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5515552B2 (enrdf_load_stackoverflow
Inventor
Kariho Inasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP266276A priority Critical patent/JPS5285935A/ja
Publication of JPS5285935A publication Critical patent/JPS5285935A/ja
Publication of JPS5515552B2 publication Critical patent/JPS5515552B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
JP266276A 1976-01-12 1976-01-12 Peeling solution for copper plating Granted JPS5285935A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP266276A JPS5285935A (en) 1976-01-12 1976-01-12 Peeling solution for copper plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP266276A JPS5285935A (en) 1976-01-12 1976-01-12 Peeling solution for copper plating

Publications (2)

Publication Number Publication Date
JPS5285935A true JPS5285935A (en) 1977-07-16
JPS5515552B2 JPS5515552B2 (enrdf_load_stackoverflow) 1980-04-24

Family

ID=11535532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP266276A Granted JPS5285935A (en) 1976-01-12 1976-01-12 Peeling solution for copper plating

Country Status (1)

Country Link
JP (1) JPS5285935A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002356788A (ja) * 2001-05-30 2002-12-13 Meltex Inc 鉄素地上の銅めっき剥離液
CN110997981A (zh) * 2017-07-14 2020-04-10 美录德有限公司 铜蚀刻液

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4827939A (enrdf_load_stackoverflow) * 1971-08-13 1973-04-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4827939A (enrdf_load_stackoverflow) * 1971-08-13 1973-04-13

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002356788A (ja) * 2001-05-30 2002-12-13 Meltex Inc 鉄素地上の銅めっき剥離液
CN110997981A (zh) * 2017-07-14 2020-04-10 美录德有限公司 铜蚀刻液

Also Published As

Publication number Publication date
JPS5515552B2 (enrdf_load_stackoverflow) 1980-04-24

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