JPS5515552B2 - - Google Patents
Info
- Publication number
- JPS5515552B2 JPS5515552B2 JP266276A JP266276A JPS5515552B2 JP S5515552 B2 JPS5515552 B2 JP S5515552B2 JP 266276 A JP266276 A JP 266276A JP 266276 A JP266276 A JP 266276A JP S5515552 B2 JPS5515552 B2 JP S5515552B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP266276A JPS5285935A (en) | 1976-01-12 | 1976-01-12 | Peeling solution for copper plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP266276A JPS5285935A (en) | 1976-01-12 | 1976-01-12 | Peeling solution for copper plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5285935A JPS5285935A (en) | 1977-07-16 |
| JPS5515552B2 true JPS5515552B2 (enrdf_load_stackoverflow) | 1980-04-24 |
Family
ID=11535532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP266276A Granted JPS5285935A (en) | 1976-01-12 | 1976-01-12 | Peeling solution for copper plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5285935A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019013160A1 (ja) * | 2017-07-14 | 2019-01-17 | メルテックス株式会社 | 銅エッチング液 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002356788A (ja) * | 2001-05-30 | 2002-12-13 | Meltex Inc | 鉄素地上の銅めっき剥離液 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4827939A (enrdf_load_stackoverflow) * | 1971-08-13 | 1973-04-13 |
-
1976
- 1976-01-12 JP JP266276A patent/JPS5285935A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019013160A1 (ja) * | 2017-07-14 | 2019-01-17 | メルテックス株式会社 | 銅エッチング液 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5285935A (en) | 1977-07-16 |