JPS5275180A - Package for integrated circuits - Google Patents
Package for integrated circuitsInfo
- Publication number
- JPS5275180A JPS5275180A JP50150961A JP15096175A JPS5275180A JP S5275180 A JPS5275180 A JP S5275180A JP 50150961 A JP50150961 A JP 50150961A JP 15096175 A JP15096175 A JP 15096175A JP S5275180 A JPS5275180 A JP S5275180A
- Authority
- JP
- Japan
- Prior art keywords
- package
- integrated circuits
- elements
- porous plates
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50150961A JPS587064B2 (ja) | 1975-12-18 | 1975-12-18 | シユウセキカイロヨウパツケ−ジ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50150961A JPS587064B2 (ja) | 1975-12-18 | 1975-12-18 | シユウセキカイロヨウパツケ−ジ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5275180A true JPS5275180A (en) | 1977-06-23 |
JPS587064B2 JPS587064B2 (ja) | 1983-02-08 |
Family
ID=15508207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50150961A Expired JPS587064B2 (ja) | 1975-12-18 | 1975-12-18 | シユウセキカイロヨウパツケ−ジ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS587064B2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4395728A (en) * | 1979-08-24 | 1983-07-26 | Li Chou H | Temperature controlled apparatus |
US4989070A (en) * | 1988-11-10 | 1991-01-29 | Coriolis Corporation | Modular heat sink structure |
US5086026A (en) * | 1990-01-08 | 1992-02-04 | Ford Motor Company | Reduction catalyst with modified rhodium structure |
US5223741A (en) * | 1989-09-01 | 1993-06-29 | Tactical Fabs, Inc. | Package for an integrated circuit structure |
DE102007005233A1 (de) * | 2007-01-30 | 2008-08-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Leistungsmodul |
-
1975
- 1975-12-18 JP JP50150961A patent/JPS587064B2/ja not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4395728A (en) * | 1979-08-24 | 1983-07-26 | Li Chou H | Temperature controlled apparatus |
US4989070A (en) * | 1988-11-10 | 1991-01-29 | Coriolis Corporation | Modular heat sink structure |
US5223741A (en) * | 1989-09-01 | 1993-06-29 | Tactical Fabs, Inc. | Package for an integrated circuit structure |
US5086026A (en) * | 1990-01-08 | 1992-02-04 | Ford Motor Company | Reduction catalyst with modified rhodium structure |
DE102007005233A1 (de) * | 2007-01-30 | 2008-08-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Leistungsmodul |
DE102007005233B4 (de) | 2007-01-30 | 2021-09-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Leistungsmodul |
Also Published As
Publication number | Publication date |
---|---|
JPS587064B2 (ja) | 1983-02-08 |
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