JPS5273677A - Method of forming hermetic upper surface sealing body for electronic circuit - Google Patents

Method of forming hermetic upper surface sealing body for electronic circuit

Info

Publication number
JPS5273677A
JPS5273677A JP51144859A JP14485976A JPS5273677A JP S5273677 A JPS5273677 A JP S5273677A JP 51144859 A JP51144859 A JP 51144859A JP 14485976 A JP14485976 A JP 14485976A JP S5273677 A JPS5273677 A JP S5273677A
Authority
JP
Japan
Prior art keywords
electronic circuit
sealing body
surface sealing
forming hermetic
hermetic upper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP51144859A
Other languages
English (en)
Other versions
JPS5310428B2 (ja
Inventor
Bakosu Piitaa
Memisu Aabuingu
Reishiru Jiyon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5273677A publication Critical patent/JPS5273677A/ja
Publication of JPS5310428B2 publication Critical patent/JPS5310428B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31507—Of polycarbonate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31688—Next to aldehyde or ketone condensation product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y10T428/31696—Including polyene monomers [e.g., butadiene, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y10T428/31699—Ester, halide or nitrile of addition polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Paints Or Removers (AREA)
  • Casings For Electric Apparatus (AREA)
  • Formation Of Insulating Films (AREA)
  • Sealing Material Composition (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP51144859A 1975-12-15 1976-12-03 Method of forming hermetic upper surface sealing body for electronic circuit Granted JPS5273677A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/640,511 US4048356A (en) 1975-12-15 1975-12-15 Hermetic topsealant coating and process for its formation

Publications (2)

Publication Number Publication Date
JPS5273677A true JPS5273677A (en) 1977-06-20
JPS5310428B2 JPS5310428B2 (ja) 1978-04-13

Family

ID=24568553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51144859A Granted JPS5273677A (en) 1975-12-15 1976-12-03 Method of forming hermetic upper surface sealing body for electronic circuit

Country Status (7)

Country Link
US (1) US4048356A (ja)
JP (1) JPS5273677A (ja)
CA (1) CA1085984A (ja)
DE (1) DE2656139A1 (ja)
FR (1) FR2335574A1 (ja)
GB (1) GB1533472A (ja)
IT (1) IT1124785B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4205026A (en) * 1977-01-17 1980-05-27 Averyanov Sergei V Radiation curable polyborsiloxane polymer composition and method of using same to produce thermostable insulating materials
US4246038A (en) * 1978-05-01 1981-01-20 General Electric Company Silicone abrasion resistant coatings for plastics
US4163082A (en) * 1978-10-23 1979-07-31 Dow Corning Corporation U.V.-radiation method for decreasing surface tack of disposed organopolysiloxane greases and gels
US4230754A (en) * 1978-11-07 1980-10-28 Sprague Electric Company Bonding electronic component to molded package
US4243718A (en) * 1978-11-24 1981-01-06 Toshiba Silicone Co. Ltd. Primer compositions for Si-H-olefin platinum catalyzed silicone compositions
US4271425A (en) * 1979-11-02 1981-06-02 Western Electric Company, Inc. Encapsulated electronic devices and encapsulating compositions having crown ethers
US4278784A (en) * 1980-02-06 1981-07-14 Western Electric Company, Inc. Encapsulated electronic devices and encapsulating compositions
FR2506182A1 (fr) * 1981-05-22 1982-11-26 Commissariat Energie Atomique Dispositif pour appliquer un revetement sur une surface immergee
US4682964A (en) * 1983-12-27 1987-07-28 General Electric Company Ionization detector
US4759970A (en) * 1984-10-25 1988-07-26 Amoco Corporation Electronic carrier devices and methods of manufacture
US4946733A (en) * 1984-10-25 1990-08-07 Amoco Corporation Electric carrier devices and methods of manufacture
DE3442131A1 (de) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen
US4723978A (en) * 1985-10-31 1988-02-09 International Business Machines Corporation Method for a plasma-treated polysiloxane coating
JP2657249B2 (ja) * 1986-11-25 1997-09-24 東レ・ダウコーニング・シリコーン株式会社 密着性向上剤
JPH04234422A (ja) * 1990-10-31 1992-08-24 Internatl Business Mach Corp <Ibm> 二重硬化エポキシバックシール処方物
US5196251A (en) * 1991-04-30 1993-03-23 International Business Machines Corporation Ceramic substrate having a protective coating thereon and a method for protecting a ceramic substrate
US5510153A (en) * 1993-08-04 1996-04-23 At&T Ipm Corporation Method for encapsulating electronic conductors
KR0159986B1 (ko) * 1995-09-04 1998-12-01 아남산업주식회사 히트싱크 내장형 반도체 패키지의 제조방법 및 그 구조
GB9602873D0 (en) * 1996-02-13 1996-04-10 Dow Corning Sa Heating elements and process for manufacture thereof
US10526475B2 (en) 2014-09-24 2020-01-07 Bridgestone Americas Tire Operations, Llc Silica-containing rubber compositions containing specified coupling agents and related methods

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3085908A (en) * 1959-05-26 1963-04-16 Union Carbide Corp Aminosilicon treated metals and methods of treatment and production
US3200031A (en) * 1959-05-27 1965-08-10 Union Carbide Corp Amino-organosilicon compounds and reaction products thereof with epoxides as bonding agents in composite articles and process for producing such composite articles
US3203919A (en) * 1962-09-19 1965-08-31 Du Pont Acrylic/siloxane copolymer, polysiloxane composition containing same, and article coated with the composition
US3398045A (en) * 1963-01-02 1968-08-20 Exxon Research Engineering Co Bonding rubbery polyolefins to organic materials
US3305504A (en) * 1965-01-12 1967-02-21 Union Carbide Corp Coating compositions containing organosilicon copolymers
US3667993A (en) * 1968-03-27 1972-06-06 Stauffer Wacker Silicone Corp Method for coating a substrate with a heat curable silicone rubber and resulting product
US3644166A (en) * 1968-03-28 1972-02-22 Westinghouse Electric Corp Oxide-free multilayer copper clad laminate
US3620895A (en) * 1969-01-03 1971-11-16 Polaroid Corp Corrugated micropermeable membrane
US3632440A (en) * 1969-01-13 1972-01-04 Essex International Inc Resinous composition for coating electric conductors
US3804919A (en) * 1972-04-20 1974-04-16 Dart Ind Inc Synergistic blends of modified polyolefins and unmodified polyolefins
US3928683A (en) * 1974-05-06 1975-12-23 Bell Telephone Labor Inc Corrosion inhibitor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
JPS6311780B2 (ja) * 1980-07-04 1988-03-16 Asahi Glass Co Ltd

Also Published As

Publication number Publication date
CA1085984A (en) 1980-09-16
DE2656139A1 (de) 1977-06-23
FR2335574B1 (ja) 1981-11-20
FR2335574A1 (fr) 1977-07-15
JPS5310428B2 (ja) 1978-04-13
IT1124785B (it) 1986-05-14
US4048356A (en) 1977-09-13
GB1533472A (en) 1978-11-22

Similar Documents

Publication Publication Date Title
JPS5273677A (en) Method of forming hermetic upper surface sealing body for electronic circuit
IL49061A (en) Package for hermetically sealing electronic circuits
JPS5230159A (en) Method of making semiconductor surface without blur
JPS5366565A (en) Method of sealing electronic parts
JPS5322363A (en) Method of sealing electronic parts
JPS52149348A (en) Method of sealing electronic parts
JPS5275173A (en) Method of making semiconductor devices
JPS5275174A (en) Method of making semiconductor devices
JPS51120669A (en) Package for electronic circuits and method of making the same
JPS5260068A (en) Method of making semiconductor devices
JPS56124223A (en) Method of forming electrode for electronic part
JPS52103677A (en) Method of sealing hybrid integrated circuit
JPS54152145A (en) Method of forming electrode for electronic component
JPS56129313A (en) Method of forming electrode of electronic component
JPS51121177A (en) Method of packing electronic parts
JPS5250570A (en) Method of producing circuit substrate
JPS51114673A (en) Method of sealing electric and electronic parts
JPS523160A (en) Method of connecting electronic circuits
JPS528466A (en) Resinous sealing of electronic parts
JPS51119970A (en) Method of connecting leadless electronic parts
JPS51147762A (en) Method of manufacturing hybrid integrated circuit substrate
JPS553150A (en) Method of sealing electronic part
JPS5252367A (en) Method of making semiconductor devices
JPS5221672A (en) Method of mounting electronic parts
JPS5676502A (en) Method of forming external electrode for electronic part