JPS5232280A - Semiconductor element using electrostatically bonded dielectric ion semiconductor substrate and method of producing same - Google Patents
Semiconductor element using electrostatically bonded dielectric ion semiconductor substrate and method of producing sameInfo
- Publication number
- JPS5232280A JPS5232280A JP51105092A JP10509276A JPS5232280A JP S5232280 A JPS5232280 A JP S5232280A JP 51105092 A JP51105092 A JP 51105092A JP 10509276 A JP10509276 A JP 10509276A JP S5232280 A JPS5232280 A JP S5232280A
- Authority
- JP
- Japan
- Prior art keywords
- producing same
- semiconductor substrate
- semiconductor element
- electrostatically bonded
- bonded dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 2
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/6684—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a ferroelectric gate insulator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/04—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements with semiconductor devices only
- H03F3/16—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements with semiconductor devices only with field-effect devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/610,364 US4047214A (en) | 1975-09-04 | 1975-09-04 | Electrostatically bonded dielectric-on-semiconductor device, and a method of making the same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5232280A true JPS5232280A (en) | 1977-03-11 |
Family
ID=24444720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51105092A Pending JPS5232280A (en) | 1975-09-04 | 1976-09-03 | Semiconductor element using electrostatically bonded dielectric ion semiconductor substrate and method of producing same |
Country Status (7)
Country | Link |
---|---|
US (1) | US4047214A (ja) |
JP (1) | JPS5232280A (ja) |
BE (1) | BE845471A (ja) |
CA (1) | CA1060573A (ja) |
DE (1) | DE2638405A1 (ja) |
FR (1) | FR2323228A1 (ja) |
GB (1) | GB1554302A (ja) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2348580A1 (fr) * | 1976-04-16 | 1977-11-10 | Thomson Csf | Dispositif de lecture electrique d'une image optique, utilisant l'effet piezo-resistif |
US4259365A (en) * | 1978-03-02 | 1981-03-31 | Wolfgang Ruppel | Method for creating a ferroelectric or pyroelectric body |
US4348611A (en) * | 1978-03-02 | 1982-09-07 | Wolfgang Ruppel | Ferroelectric or pyroelectric sensor utilizing a sodium nitrite layer |
JPS584485B2 (ja) * | 1978-06-06 | 1983-01-26 | クラリオン株式会社 | 周波数選択装置 |
GB2056810B (en) * | 1979-08-14 | 1984-02-22 | Clarion Co Ltd | Surface-acoustic-wave device |
US4378510A (en) * | 1980-07-17 | 1983-03-29 | Motorola Inc. | Miniaturized accelerometer with piezoelectric FET |
DD251851A1 (de) * | 1984-05-28 | 1987-11-25 | Akad Wissenschaften Ddr | Paste fuer die herstellung gedruckter kondensatoren |
US4639631A (en) * | 1985-07-01 | 1987-01-27 | Motorola, Inc. | Electrostatically sealed piezoelectric device |
US4767973A (en) * | 1987-07-06 | 1988-08-30 | Sarcos Incorporated | Systems and methods for sensing position and movement |
DE3910164A1 (de) * | 1989-03-29 | 1990-10-04 | Siemens Ag | Elektrostatischer wandler zur erzeugung von akustischen oberflaechenwellen auf nicht piezoelektrischem halbleitersubstrat |
DE3937073A1 (de) * | 1989-11-07 | 1991-05-08 | Siemens Ag | Integriertes akustoelektronisches bauelement mit gebondeter iii-v-halbleiterschicht |
FR2688090B1 (fr) * | 1992-02-27 | 1994-04-08 | Commissariat A Energie Atomique | Cellule memoire non volatile du type metal-ferroelectrique semi-conducteur. |
JPH06132579A (ja) * | 1992-09-01 | 1994-05-13 | Canon Inc | 変位素子及びそれを用いたプローブ、同プローブを有する機器 |
US5607453A (en) * | 1994-04-28 | 1997-03-04 | Furukawa Co., Ltd. | Composite medical treating device composed ferrodielectric substance and semiconductor |
JP2643833B2 (ja) * | 1994-05-30 | 1997-08-20 | 日本電気株式会社 | 半導体記憶装置及びその製造方法 |
JPH10284762A (ja) * | 1995-02-16 | 1998-10-23 | Asahi Chem Ind Co Ltd | 表面弾性波を増幅するための積層構造及び増幅器 |
US5907768A (en) * | 1996-08-16 | 1999-05-25 | Kobe Steel Usa Inc. | Methods for fabricating microelectronic structures including semiconductor islands |
US5874755A (en) * | 1996-11-07 | 1999-02-23 | Motorola, Inc. | Ferroelectric semiconductor device and method of manufacture |
AU2001283449A1 (en) * | 2000-08-18 | 2002-03-04 | The Government of the United States as represented by the Administrator of the National Aeronautics and Space Administration(NASA) | Piezoelectric composite device and method for making same |
AU2002251690A1 (en) * | 2000-12-13 | 2002-08-12 | Rochester Institute Of Technology | A method and system for electrostatic bonding |
WO2002073673A1 (en) | 2001-03-13 | 2002-09-19 | Rochester Institute Of Technology | A micro-electro-mechanical switch and a method of using and making thereof |
AU2002303933A1 (en) | 2001-05-31 | 2002-12-09 | Rochester Institute Of Technology | Fluidic valves, agitators, and pumps and methods thereof |
US7211923B2 (en) | 2001-10-26 | 2007-05-01 | Nth Tech Corporation | Rotational motion based, electrostatic power source and methods thereof |
US7378775B2 (en) | 2001-10-26 | 2008-05-27 | Nth Tech Corporation | Motion based, electrostatic power source and methods thereof |
DE10235814B3 (de) * | 2002-08-05 | 2004-03-11 | Infineon Technologies Ag | Verfahren zur lösbaren Montage eines zu prozessierenden Halbleitersubstrats auf einem Trägerwafer |
US7287328B2 (en) | 2003-08-29 | 2007-10-30 | Rochester Institute Of Technology | Methods for distributed electrode injection |
US7217582B2 (en) | 2003-08-29 | 2007-05-15 | Rochester Institute Of Technology | Method for non-damaging charge injection and a system thereof |
US20050082624A1 (en) * | 2003-10-20 | 2005-04-21 | Evgeni Gousev | Germanate gate dielectrics for semiconductor devices |
US8581308B2 (en) | 2004-02-19 | 2013-11-12 | Rochester Institute Of Technology | High temperature embedded charge devices and methods thereof |
TW201216363A (en) * | 2010-10-01 | 2012-04-16 | Univ Nat Chiao Tung | Dielectric structure, transistor and manufacturing method thereof with praseodymium oxide |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3479572A (en) * | 1967-07-06 | 1969-11-18 | Litton Precision Prod Inc | Acoustic surface wave device |
US3585415A (en) * | 1969-10-06 | 1971-06-15 | Univ California | Stress-strain transducer charge coupled to a piezoelectric material |
US3686579A (en) * | 1971-06-21 | 1972-08-22 | Zenith Radio Corp | Solid-state, acoustic-wave amplifiers |
US3868719A (en) * | 1973-04-02 | 1975-02-25 | Kulite Semiconductor Products | Thin ribbon-like glass backed transducers |
US3851280A (en) * | 1973-08-01 | 1974-11-26 | Texas Instruments Inc | Non-linear signal processing device using square law detection of surface elastic waves with insulated gate field effect transistor |
-
1975
- 1975-09-04 US US05/610,364 patent/US4047214A/en not_active Expired - Lifetime
-
1976
- 1976-08-13 CA CA259,093A patent/CA1060573A/en not_active Expired
- 1976-08-24 BE BE170038A patent/BE845471A/xx unknown
- 1976-08-24 FR FR7625638A patent/FR2323228A1/fr not_active Withdrawn
- 1976-08-26 DE DE19762638405 patent/DE2638405A1/de not_active Withdrawn
- 1976-09-02 GB GB36384/76A patent/GB1554302A/en not_active Expired
- 1976-09-03 JP JP51105092A patent/JPS5232280A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
BE845471A (fr) | 1977-02-24 |
DE2638405A1 (de) | 1977-03-17 |
CA1060573A (en) | 1979-08-14 |
GB1554302A (en) | 1979-10-17 |
US4047214A (en) | 1977-09-06 |
FR2323228A1 (fr) | 1977-04-01 |
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