JPS5227267A - Semiconductor manufacturing process - Google Patents
Semiconductor manufacturing processInfo
- Publication number
- JPS5227267A JPS5227267A JP10316075A JP10316075A JPS5227267A JP S5227267 A JPS5227267 A JP S5227267A JP 10316075 A JP10316075 A JP 10316075A JP 10316075 A JP10316075 A JP 10316075A JP S5227267 A JPS5227267 A JP S5227267A
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing process
- semiconductor manufacturing
- separation process
- easing
- stick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10316075A JPS5227267A (en) | 1975-08-25 | 1975-08-25 | Semiconductor manufacturing process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10316075A JPS5227267A (en) | 1975-08-25 | 1975-08-25 | Semiconductor manufacturing process |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5227267A true JPS5227267A (en) | 1977-03-01 |
Family
ID=14346740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10316075A Pending JPS5227267A (en) | 1975-08-25 | 1975-08-25 | Semiconductor manufacturing process |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5227267A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002134440A (ja) * | 2000-10-27 | 2002-05-10 | Tokuyama Corp | 基板の処理方法及びそれに用いるトレー |
JP2016093871A (ja) * | 2014-11-14 | 2016-05-26 | 株式会社東芝 | 処理装置およびノズル |
US9947571B2 (en) | 2014-11-14 | 2018-04-17 | Kabushiki Kaisha Toshiba | Processing apparatus, nozzle, and dicing apparatus |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4914081A (ja) * | 1972-05-16 | 1974-02-07 | ||
JPS4947709A (ja) * | 1972-04-10 | 1974-05-09 |
-
1975
- 1975-08-25 JP JP10316075A patent/JPS5227267A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4947709A (ja) * | 1972-04-10 | 1974-05-09 | ||
JPS4914081A (ja) * | 1972-05-16 | 1974-02-07 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002134440A (ja) * | 2000-10-27 | 2002-05-10 | Tokuyama Corp | 基板の処理方法及びそれに用いるトレー |
JP2016093871A (ja) * | 2014-11-14 | 2016-05-26 | 株式会社東芝 | 処理装置およびノズル |
US9947571B2 (en) | 2014-11-14 | 2018-04-17 | Kabushiki Kaisha Toshiba | Processing apparatus, nozzle, and dicing apparatus |
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