JPS52155057A - Glass sealed type semiconductor device - Google Patents

Glass sealed type semiconductor device

Info

Publication number
JPS52155057A
JPS52155057A JP7120676A JP7120676A JPS52155057A JP S52155057 A JPS52155057 A JP S52155057A JP 7120676 A JP7120676 A JP 7120676A JP 7120676 A JP7120676 A JP 7120676A JP S52155057 A JPS52155057 A JP S52155057A
Authority
JP
Japan
Prior art keywords
glass
semiconductor device
type semiconductor
sealed type
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7120676A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5514535B2 (enrdf_load_html_response
Inventor
Mitsusachi Matsuzaki
Kensuke Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7120676A priority Critical patent/JPS52155057A/ja
Publication of JPS52155057A publication Critical patent/JPS52155057A/ja
Publication of JPS5514535B2 publication Critical patent/JPS5514535B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP7120676A 1976-06-18 1976-06-18 Glass sealed type semiconductor device Granted JPS52155057A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7120676A JPS52155057A (en) 1976-06-18 1976-06-18 Glass sealed type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7120676A JPS52155057A (en) 1976-06-18 1976-06-18 Glass sealed type semiconductor device

Publications (2)

Publication Number Publication Date
JPS52155057A true JPS52155057A (en) 1977-12-23
JPS5514535B2 JPS5514535B2 (enrdf_load_html_response) 1980-04-17

Family

ID=13453963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7120676A Granted JPS52155057A (en) 1976-06-18 1976-06-18 Glass sealed type semiconductor device

Country Status (1)

Country Link
JP (1) JPS52155057A (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS552157U (enrdf_load_html_response) * 1978-06-21 1980-01-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS552157U (enrdf_load_html_response) * 1978-06-21 1980-01-09

Also Published As

Publication number Publication date
JPS5514535B2 (enrdf_load_html_response) 1980-04-17

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