JPS52147072A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS52147072A
JPS52147072A JP6459877A JP6459877A JPS52147072A JP S52147072 A JPS52147072 A JP S52147072A JP 6459877 A JP6459877 A JP 6459877A JP 6459877 A JP6459877 A JP 6459877A JP S52147072 A JPS52147072 A JP S52147072A
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6459877A
Other languages
English (en)
Japanese (ja)
Inventor
Poikeruto Hansu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS52147072A publication Critical patent/JPS52147072A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP6459877A 1976-06-01 1977-06-01 Semiconductor device Pending JPS52147072A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762624593 DE2624593A1 (de) 1976-06-01 1976-06-01 Halbleiteranordnung

Publications (1)

Publication Number Publication Date
JPS52147072A true JPS52147072A (en) 1977-12-07

Family

ID=5979539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6459877A Pending JPS52147072A (en) 1976-06-01 1977-06-01 Semiconductor device

Country Status (6)

Country Link
JP (1) JPS52147072A (de)
BE (1) BE855136A (de)
DE (1) DE2624593A1 (de)
FR (1) FR2353958A1 (de)
IT (1) IT1079228B (de)
SE (1) SE7706258L (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226816C2 (de) * 1992-08-13 1996-08-22 Licentia Gmbh Vorrichtung zur Wärmeableitung aus einem Gehäuse einer integrierten Schaltung
DE102005047547B4 (de) * 2005-09-30 2008-02-14 Siemens Ag Andrückkonzept für ein Substrat eines Leistungsmoduls und Leistungsmodul
DE102009030016A1 (de) 2009-06-23 2010-12-30 Bayerische Motoren Werke Aktiengesellschaft Vorrichtung zur Spannungsversorung eines Kraftfahrzeugs mit einem Kühlerblock
DE102009030017A1 (de) * 2009-06-23 2010-12-30 Bayerische Motoren Werke Aktiengesellschaft Vorrichtung zur Spannungsversorgung eines Kraftfahrzeugs mit einem Kühlerblock

Also Published As

Publication number Publication date
IT1079228B (it) 1985-05-08
DE2624593A1 (de) 1977-12-08
SE7706258L (sv) 1977-12-02
BE855136A (fr) 1977-09-16
FR2353958A1 (fr) 1977-12-30

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