IT1079228B - Dispositivo a semiconduttori con elementi di raffreddamento - Google Patents

Dispositivo a semiconduttori con elementi di raffreddamento

Info

Publication number
IT1079228B
IT1079228B IT24079/77A IT2407977A IT1079228B IT 1079228 B IT1079228 B IT 1079228B IT 24079/77 A IT24079/77 A IT 24079/77A IT 2407977 A IT2407977 A IT 2407977A IT 1079228 B IT1079228 B IT 1079228B
Authority
IT
Italy
Prior art keywords
semiconductor device
cooling elements
cooling
elements
semiconductor
Prior art date
Application number
IT24079/77A
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT1079228B publication Critical patent/IT1079228B/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736Metallic materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025Base discrete devices, e.g. presspack, disc-type transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075Mechanical elements
    • H01L2023/4081Compliant clamping elements not primarily serving heat-conduction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
IT24079/77A 1976-06-01 1977-05-27 Dispositivo a semiconduttori con elementi di raffreddamento IT1079228B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762624593 DE2624593A1 (de) 1976-06-01 1976-06-01 Halbleiteranordnung

Publications (1)

Publication Number Publication Date
IT1079228B true IT1079228B (it) 1985-05-08

Family

ID=5979539

Family Applications (1)

Application Number Title Priority Date Filing Date
IT24079/77A IT1079228B (it) 1976-06-01 1977-05-27 Dispositivo a semiconduttori con elementi di raffreddamento

Country Status (6)

Country Link
JP (1) JPS52147072A (it)
BE (1) BE855136A (it)
DE (1) DE2624593A1 (it)
FR (1) FR2353958A1 (it)
IT (1) IT1079228B (it)
SE (1) SE7706258L (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226816C2 (de) * 1992-08-13 1996-08-22 Licentia Gmbh Vorrichtung zur Wärmeableitung aus einem Gehäuse einer integrierten Schaltung
DE102005047547B4 (de) * 2005-09-30 2008-02-14 Siemens Ag Andrückkonzept für ein Substrat eines Leistungsmoduls und Leistungsmodul
DE102009030017A1 (de) 2009-06-23 2010-12-30 Bayerische Motoren Werke Aktiengesellschaft Vorrichtung zur Spannungsversorgung eines Kraftfahrzeugs mit einem Kühlerblock
DE102009030016A1 (de) 2009-06-23 2010-12-30 Bayerische Motoren Werke Aktiengesellschaft Vorrichtung zur Spannungsversorung eines Kraftfahrzeugs mit einem Kühlerblock

Also Published As

Publication number Publication date
BE855136A (fr) 1977-09-16
FR2353958A1 (fr) 1977-12-30
JPS52147072A (en) 1977-12-07
SE7706258L (sv) 1977-12-02
DE2624593A1 (de) 1977-12-08

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