JPS5323274A - Semiconductor - Google Patents

Semiconductor

Info

Publication number
JPS5323274A
JPS5323274A JP9653877A JP9653877A JPS5323274A JP S5323274 A JPS5323274 A JP S5323274A JP 9653877 A JP9653877 A JP 9653877A JP 9653877 A JP9653877 A JP 9653877A JP S5323274 A JPS5323274 A JP S5323274A
Authority
JP
Japan
Prior art keywords
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9653877A
Other languages
Japanese (ja)
Other versions
JPS6013308B2 (en
Inventor
Emaisu Raina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS5323274A publication Critical patent/JPS5323274A/en
Publication of JPS6013308B2 publication Critical patent/JPS6013308B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP9653877A 1976-08-13 1977-08-11 semiconductor equipment Expired JPS6013308B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2636629.0 1976-08-13
DE19762636629 DE2636629A1 (en) 1976-08-13 1976-08-13 SEMICONDUCTOR COMPONENT WITH DISC-SHAPED HOUSING

Publications (2)

Publication Number Publication Date
JPS5323274A true JPS5323274A (en) 1978-03-03
JPS6013308B2 JPS6013308B2 (en) 1985-04-06

Family

ID=5985435

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9653877A Expired JPS6013308B2 (en) 1976-08-13 1977-08-11 semiconductor equipment

Country Status (5)

Country Link
JP (1) JPS6013308B2 (en)
DE (1) DE2636629A1 (en)
FR (1) FR2361747A1 (en)
GB (1) GB1548109A (en)
IT (1) IT1085732B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4161746A (en) * 1978-03-28 1979-07-17 Westinghouse Electric Corp. Glass sealed diode
US5081327A (en) * 1990-03-28 1992-01-14 Cabot Corporation Sealing system for hermetic microchip packages
FR2660797A1 (en) * 1990-04-06 1991-10-11 Motorola Semiconducteurs IMPROVED ENCAPSULATING BOX FOR SEMICONDUCTOR DEVICE.
US5371386A (en) * 1992-04-28 1994-12-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of assembling the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR74228E (en) * 1957-09-30 1960-11-07 Gen Motors Corp Advanced transistor
DE1564665C3 (en) * 1966-07-18 1975-10-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Semiconductor component and method for its manufacture
DE2014289A1 (en) * 1970-03-25 1971-10-14 Semikron Gleichrichterbau Disc-shaped semiconductor component and method for its manufacture

Also Published As

Publication number Publication date
DE2636629A1 (en) 1978-02-16
GB1548109A (en) 1979-07-04
JPS6013308B2 (en) 1985-04-06
FR2361747A1 (en) 1978-03-10
IT1085732B (en) 1985-05-28

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