JPS52120683A - Method of making multiilayered metalic electrodes for semiconductor elements - Google Patents
Method of making multiilayered metalic electrodes for semiconductor elementsInfo
- Publication number
- JPS52120683A JPS52120683A JP3693877A JP3693877A JPS52120683A JP S52120683 A JPS52120683 A JP S52120683A JP 3693877 A JP3693877 A JP 3693877A JP 3693877 A JP3693877 A JP 3693877A JP S52120683 A JPS52120683 A JP S52120683A
- Authority
- JP
- Japan
- Prior art keywords
- multiilayered
- metalic
- electrodes
- making
- semiconductor elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2613759A DE2613759C3 (de) | 1976-03-31 | 1976-03-31 | Verfahren zum Herstellen eines mehrschichtigen MetaUanschluBkontaktes für ein Halbleiterbauelement |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52120683A true JPS52120683A (en) | 1977-10-11 |
Family
ID=5973995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3693877A Pending JPS52120683A (en) | 1976-03-31 | 1977-03-31 | Method of making multiilayered metalic electrodes for semiconductor elements |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS52120683A (de) |
DE (1) | DE2613759C3 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57198648A (en) * | 1981-06-01 | 1982-12-06 | Nec Corp | Manufacture of semiconductor device |
JPS607758A (ja) * | 1983-06-27 | 1985-01-16 | Nec Corp | 半導体装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4300149A (en) * | 1979-09-04 | 1981-11-10 | International Business Machines Corporation | Gold-tantalum-titanium/tungsten alloy contact for semiconductor devices and having a gold/tantalum intermetallic barrier region intermediate the gold and alloy elements |
DE3343362A1 (de) * | 1983-11-30 | 1985-06-05 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur galvanischen herstellung metallischer, hoeckerartiger anschlusskontakte |
JPS61274325A (ja) * | 1985-05-29 | 1986-12-04 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
-
1976
- 1976-03-31 DE DE2613759A patent/DE2613759C3/de not_active Expired
-
1977
- 1977-03-31 JP JP3693877A patent/JPS52120683A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57198648A (en) * | 1981-06-01 | 1982-12-06 | Nec Corp | Manufacture of semiconductor device |
JPS6248899B2 (de) * | 1981-06-01 | 1987-10-16 | Nippon Electric Co | |
JPS607758A (ja) * | 1983-06-27 | 1985-01-16 | Nec Corp | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
DE2613759A1 (de) | 1977-10-06 |
DE2613759C3 (de) | 1981-01-15 |
DE2613759B2 (de) | 1980-04-24 |
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