JPS52119072A - Manufacture of resin-sealing semiconductor device - Google Patents

Manufacture of resin-sealing semiconductor device

Info

Publication number
JPS52119072A
JPS52119072A JP3531476A JP3531476A JPS52119072A JP S52119072 A JPS52119072 A JP S52119072A JP 3531476 A JP3531476 A JP 3531476A JP 3531476 A JP3531476 A JP 3531476A JP S52119072 A JPS52119072 A JP S52119072A
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
manufacture
sealing semiconductor
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3531476A
Other languages
Japanese (ja)
Inventor
Masahiro Yamane
Toshimi Watanabe
Keiji Itoga
Kiyoshi Ishibashi
Yutaka Morita
Isamu Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP3531476A priority Critical patent/JPS52119072A/en
Priority to DE2714145A priority patent/DE2714145C2/en
Priority to CA275,206A priority patent/CA1079868A/en
Publication of JPS52119072A publication Critical patent/JPS52119072A/en
Priority to US06/011,639 priority patent/US4283838A/en
Priority to CA344,749A priority patent/CA1108773A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain compact and lightweight resin-sealing-type semiconductor device which are free of aging in electric characteristics and excellent in mass-productivity in the same way as the metal container sealing type--by employing the prescribed method.
COPYRIGHT: (C)1977,JPO&Japio
JP3531476A 1976-03-31 1976-03-31 Manufacture of resin-sealing semiconductor device Pending JPS52119072A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP3531476A JPS52119072A (en) 1976-03-31 1976-03-31 Manufacture of resin-sealing semiconductor device
DE2714145A DE2714145C2 (en) 1976-03-31 1977-03-30 Stamped metal carrier plate for the production of plastic-coated semiconductor components
CA275,206A CA1079868A (en) 1976-03-31 1977-03-31 Plastic encapsulated semiconductor devices and method of making same
US06/011,639 US4283838A (en) 1976-03-31 1979-02-12 Method of making plastic encapsulated semiconductor devices
CA344,749A CA1108773A (en) 1976-03-31 1980-01-30 Plastic encapsulated semiconductor devices and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3531476A JPS52119072A (en) 1976-03-31 1976-03-31 Manufacture of resin-sealing semiconductor device

Publications (1)

Publication Number Publication Date
JPS52119072A true JPS52119072A (en) 1977-10-06

Family

ID=12438334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3531476A Pending JPS52119072A (en) 1976-03-31 1976-03-31 Manufacture of resin-sealing semiconductor device

Country Status (1)

Country Link
JP (1) JPS52119072A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4985961A (en) * 1972-12-22 1974-08-17
JPS4988476A (en) * 1972-12-26 1974-08-23

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4985961A (en) * 1972-12-22 1974-08-17
JPS4988476A (en) * 1972-12-26 1974-08-23

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