JPS5193171A - - Google Patents

Info

Publication number
JPS5193171A
JPS5193171A JP51000038A JP3876A JPS5193171A JP S5193171 A JPS5193171 A JP S5193171A JP 51000038 A JP51000038 A JP 51000038A JP 3876 A JP3876 A JP 3876A JP S5193171 A JPS5193171 A JP S5193171A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP51000038A
Other languages
Japanese (ja)
Other versions
JPS5625027B2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5193171A publication Critical patent/JPS5193171A/ja
Publication of JPS5625027B2 publication Critical patent/JPS5625027B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85Complementary IGFETs, e.g. CMOS
    • H10D84/854Complementary IGFETs, e.g. CMOS comprising arrangements for preventing bipolar actions between the different IGFET regions, e.g. arrangements for latchup prevention
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/112Constructional design considerations for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layers, e.g. by using channel stoppers

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
JP3876A 1974-12-30 1976-01-05 Expired JPS5625027B2 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/537,511 US3955210A (en) 1974-12-30 1974-12-30 Elimination of SCR structure

Publications (2)

Publication Number Publication Date
JPS5193171A true JPS5193171A (enExample) 1976-08-16
JPS5625027B2 JPS5625027B2 (enExample) 1981-06-10

Family

ID=24142953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3876A Expired JPS5625027B2 (enExample) 1974-12-30 1976-01-05

Country Status (7)

Country Link
US (1) US3955210A (enExample)
JP (1) JPS5625027B2 (enExample)
CA (1) CA1030664A (enExample)
DE (1) DE2554296C2 (enExample)
FR (1) FR2296938A1 (enExample)
GB (1) GB1502130A (enExample)
IT (1) IT1058321B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016455A (ja) * 1983-07-08 1985-01-28 Seiko Epson Corp 相補型mis半導体集積回路装置
JPS63132467A (ja) * 1986-11-24 1988-06-04 Mitsubishi Electric Corp 集積回路
JPH05152523A (ja) * 1992-05-18 1993-06-18 Seiko Epson Corp 相補型mis半導体集積回路装置

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4168442A (en) * 1975-07-18 1979-09-18 Tokyo Shibaura Electric Co., Ltd. CMOS FET device with abnormal current flow prevention
US4209713A (en) * 1975-07-18 1980-06-24 Tokyo Shibaura Electric Co., Ltd. Semiconductor integrated circuit device in which difficulties caused by parasitic transistors are eliminated
US4167747A (en) * 1975-07-18 1979-09-11 Tokyo Shibaura Electric Co., Ltd. Complementary mosfet device and method of manufacturing the same
US4149176A (en) * 1975-07-18 1979-04-10 Tokyo Shibaura Electric Co., Ltd. Complementary MOSFET device
GB1559583A (en) * 1975-07-18 1980-01-23 Tokyo Shibaura Electric Co Complementary mosfet device and method of manufacturing the same
US4143391A (en) * 1975-09-12 1979-03-06 Tokyo Shibaura Electric Co., Ltd. Integrated circuit device
GB1549130A (en) * 1977-06-01 1979-08-01 Hughes Microelectronics Ltd Cm Monolithic integrated circuit
JPS5591162A (en) * 1978-12-27 1980-07-10 Fujitsu Ltd Semiconductor device
JPS5618469A (en) * 1979-07-24 1981-02-21 Fujitsu Ltd Semiconductor device
JPS56162860A (en) * 1980-05-19 1981-12-15 Toshiba Corp Semiconductor device
US4458262A (en) * 1980-05-27 1984-07-03 Supertex, Inc. CMOS Device with ion-implanted channel-stop region and fabrication method therefor
DE3276981D1 (en) * 1981-10-09 1987-09-17 Toshiba Kk Semiconductor device having a fuse element
JPS5873147A (ja) * 1981-10-27 1983-05-02 Mitsubishi Electric Corp 半導体集積回路装置
US4797724A (en) * 1982-06-30 1989-01-10 Honeywell Inc. Reducing bipolar parasitic effects in IGFET devices
JPS59501766A (ja) * 1982-09-20 1984-10-18 セミ・プロセシ−ズ・インコ−ポレ−テッド ラッチアップ保護用のガ−ドバンドを持つcmos集積回路
JPH0828480B2 (ja) * 1983-09-30 1996-03-21 富士通株式会社 半導体集積回路装置
EP0160077A1 (en) * 1983-10-31 1985-11-06 Storage Technology Partners Cmos integrated circuit configuration for eliminating latchup
DE3435751A1 (de) * 1984-09-28 1986-04-10 Siemens AG, 1000 Berlin und 8000 München Integrierte halbleiterschaltung in komplementaerer schaltungstechnik mit ueberspannungsschutz-struktur
US4875151A (en) * 1986-08-11 1989-10-17 Ncr Corporation Two transistor full wave rectifier
EP0283046B1 (en) * 1987-03-18 1996-06-12 Nec Corporation Complementary integrated circuit device equipped with latch-up preventing means
FR2623016B1 (fr) * 1987-11-06 1991-06-14 Thomson Semiconducteurs Dispositif de fusion d'un fusible dans un circuit integre de type cmos
US5828110A (en) * 1995-06-05 1998-10-27 Advanced Micro Devices, Inc. Latchup-proof I/O circuit implementation
JP2002124580A (ja) * 2000-10-18 2002-04-26 Yamaha Corp 入力保護回路
JP2006013450A (ja) * 2004-05-27 2006-01-12 Renesas Technology Corp 半導体装置およびその製造方法
US8231056B2 (en) * 2005-04-08 2012-07-31 Authentec, Inc. System for and method of protecting an integrated circuit from over currents

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673428A (en) * 1970-09-18 1972-06-27 Rca Corp Input transient protection for complementary insulated gate field effect transistor integrated circuit device
US3798512A (en) * 1970-09-28 1974-03-19 Ibm Fet device with guard ring and fabrication method therefor
US3806371A (en) * 1971-07-28 1974-04-23 Motorola Inc Method of making complementary monolithic insulated gate field effect transistors having low threshold voltage and low leakage current
US3712995A (en) * 1972-03-27 1973-01-23 Rca Corp Input transient protection for complementary insulated gate field effect transistor integrated circuit device
US3916430A (en) * 1973-03-14 1975-10-28 Rca Corp System for eliminating substrate bias effect in field effect transistor circuits

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016455A (ja) * 1983-07-08 1985-01-28 Seiko Epson Corp 相補型mis半導体集積回路装置
JPS63132467A (ja) * 1986-11-24 1988-06-04 Mitsubishi Electric Corp 集積回路
JPH05152523A (ja) * 1992-05-18 1993-06-18 Seiko Epson Corp 相補型mis半導体集積回路装置

Also Published As

Publication number Publication date
GB1502130A (en) 1978-02-22
CA1030664A (en) 1978-05-02
US3955210A (en) 1976-05-04
DE2554296C2 (de) 1985-11-28
DE2554296A1 (de) 1976-07-08
IT1058321B (it) 1982-04-10
FR2296938A1 (fr) 1976-07-30
FR2296938B1 (enExample) 1979-04-27
JPS5625027B2 (enExample) 1981-06-10

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