JPS5163702A - - Google Patents

Info

Publication number
JPS5163702A
JPS5163702A JP50121747A JP12174775A JPS5163702A JP S5163702 A JPS5163702 A JP S5163702A JP 50121747 A JP50121747 A JP 50121747A JP 12174775 A JP12174775 A JP 12174775A JP S5163702 A JPS5163702 A JP S5163702A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50121747A
Other languages
Japanese (ja)
Other versions
JPS5513341B2 (US06521211-20030218-C00004.png
Inventor
Denutsudo Furiiru Danieru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JPS5163702A publication Critical patent/JPS5163702A/ja
Publication of JPS5513341B2 publication Critical patent/JPS5513341B2/ja
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Laminated Bodies (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
JP12174775A 1974-10-08 1975-10-08 Expired JPS5513341B2 (US06521211-20030218-C00004.png)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51311274A 1974-10-08 1974-10-08
US56890475A 1975-04-17 1975-04-17

Publications (2)

Publication Number Publication Date
JPS5163702A true JPS5163702A (US06521211-20030218-C00004.png) 1976-06-02
JPS5513341B2 JPS5513341B2 (US06521211-20030218-C00004.png) 1980-04-08

Family

ID=27057750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12174775A Expired JPS5513341B2 (US06521211-20030218-C00004.png) 1974-10-08 1975-10-08

Country Status (5)

Country Link
JP (1) JPS5513341B2 (US06521211-20030218-C00004.png)
DE (1) DE2544553C2 (US06521211-20030218-C00004.png)
FR (1) FR2287714A1 (US06521211-20030218-C00004.png)
GB (1) GB1517302A (US06521211-20030218-C00004.png)
NL (1) NL7511714A (US06521211-20030218-C00004.png)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5369034A (en) * 1976-11-29 1978-06-20 Du Pont Liquid stacking method
JPS5489274A (en) * 1977-12-27 1979-07-16 Fujitsu Ltd Method of making printed board
JPS6252552A (ja) * 1985-08-30 1987-03-07 Hitachi Chem Co Ltd 減圧貼り合わせ方法及び装置
JPS63259559A (ja) * 1987-04-16 1988-10-26 Hitachi Condenser Co Ltd 印刷配線板のパタ−ン形成方法
JPH026960A (ja) * 1988-02-26 1990-01-11 Morton Thiokol Inc ドライフィルムフォトレジストおよびそれを印刷回路板などに適用する方法
JP2001249448A (ja) * 2000-01-14 2001-09-14 Shipley Co Llc 増加したフォトスピードを有するフォトレジスト
US7067226B2 (en) 2001-03-29 2006-06-27 Hitachi Chemical Co., Ltd. Photosensitive film for circuit formation and process for producing printed wiring board
US7645561B1 (en) 1997-09-19 2010-01-12 Hitachi Chemical Company, Ltd. Photosensitive film

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4289480A (en) * 1979-11-02 1981-09-15 E. I. Du Pont De Nemours And Company Process for heating thin surface layers
DE3342678C2 (de) * 1983-11-25 1995-08-31 Held Kurt Verfahren und Vorrichtung zur kontinuierlichen Herstellung metallkaschierter Laminate
DE3737945A1 (de) * 1987-11-07 1989-05-24 Anger Wolfgang Vakuum-laminator
NO890091L (no) * 1988-01-11 1989-07-12 Thiokol Morton Inc Fremgangsmaate og anordning for aa paafoere polymere materialer paa trykte kretser.
US4834821A (en) * 1988-01-11 1989-05-30 Morton Thiokol, Inc. Process for preparing polymeric materials for application to printed circuits
US5078820A (en) * 1988-03-25 1992-01-07 Somar Corporation Method and apparatus for pressure sticking a thin film to a base plate
US4927733A (en) * 1988-12-23 1990-05-22 E. I. Du Pont De Nemours And Company Conformation of vacuum - laminated solder mask coated printed circuit boards by fluid pressurizing
DE4018177A1 (de) * 1990-06-07 1991-12-12 Anger Electronic Gmbh Verfahren zum laminieren von platten und vorrichtung zur durchfuerhrung des verfahrens
DE4026802A1 (de) * 1990-08-24 1992-02-27 Anger Electronic Gmbh Vorrichtung zum kaschieren einer leiterplatte
DE4222262A1 (de) * 1991-09-03 1993-03-04 Anger Electronic Gmbh Vorrichtung zum laminieren von kunststoffprodukten, insbesondere leiterplatten, pvc-folien, polycarbonatfolien und dergleichen
DE9111708U1 (de) * 1991-09-19 1992-04-16 Anger Electronic Ges.m.b.H. Emco InnovationsCenter, Hallein Vorrichtung zum Kaschieren (Laminieren) von bedruckten und unbedruckten Folien
IT1274181B (it) * 1994-05-18 1997-07-15 Amedeo Candore Laminazione di pellicole fotosensibili per formare una maschera di saldatura su schede di circuito stampato
DE19609590A1 (de) * 1996-03-12 1997-09-18 Kontron Elektronik Verfahren und Vorrichtung zur Beschichtung von Substraten, vorzugsweise Leiterplatten
US8801887B2 (en) † 2005-12-23 2014-08-12 The Boeing Company Textured structure and method of making the textured structure
WO2011019886A1 (en) 2009-08-13 2011-02-17 Dow Global Technologies, Inc. A multi-layer laminate structure and manufacturing method
EP2652799A2 (en) 2010-12-17 2013-10-23 Dow Global Technologies LLC Improved photovoltaic device
CN113473709B (zh) * 2020-03-31 2022-05-31 竞华电子(深圳)有限公司 印制电路板加工方法及印制电路板

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305416A (en) * 1963-12-30 1967-02-21 Ibm Method for making printed circuits
US3329549A (en) * 1963-08-14 1967-07-04 Leonard J Vilutis Film laminating apparatus and method
JPS449363Y1 (US06521211-20030218-C00004.png) * 1968-08-05 1969-04-16
JPS4518324Y1 (US06521211-20030218-C00004.png) * 1966-12-19 1970-07-27
GB1314845A (en) * 1969-10-25 1973-04-26 Dornbusch Maschf Process for surface welding of heated webs in particular thermoplastic foils and an apparatus for carrying out this process
GB1321546A (en) * 1970-12-11 1973-06-27 Saint Gobain Process for producing laminated safety panes
JPS48100201A (US06521211-20030218-C00004.png) * 1972-04-04 1973-12-18
JPS4931401A (US06521211-20030218-C00004.png) * 1972-07-20 1974-03-20
JPS49103159A (US06521211-20030218-C00004.png) * 1973-02-08 1974-09-30
JPS49103167A (US06521211-20030218-C00004.png) * 1973-02-08 1974-09-30

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1293655B (US06521211-20030218-C00004.png) * 1969-04-24
US3042574A (en) * 1957-09-25 1962-07-03 Du Pont Method of making laminated structures
US3469982A (en) * 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3329549A (en) * 1963-08-14 1967-07-04 Leonard J Vilutis Film laminating apparatus and method
US3305416A (en) * 1963-12-30 1967-02-21 Ibm Method for making printed circuits
JPS4518324Y1 (US06521211-20030218-C00004.png) * 1966-12-19 1970-07-27
JPS449363Y1 (US06521211-20030218-C00004.png) * 1968-08-05 1969-04-16
GB1314845A (en) * 1969-10-25 1973-04-26 Dornbusch Maschf Process for surface welding of heated webs in particular thermoplastic foils and an apparatus for carrying out this process
GB1321546A (en) * 1970-12-11 1973-06-27 Saint Gobain Process for producing laminated safety panes
JPS48100201A (US06521211-20030218-C00004.png) * 1972-04-04 1973-12-18
JPS4931401A (US06521211-20030218-C00004.png) * 1972-07-20 1974-03-20
JPS49103159A (US06521211-20030218-C00004.png) * 1973-02-08 1974-09-30
JPS49103167A (US06521211-20030218-C00004.png) * 1973-02-08 1974-09-30

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5369034A (en) * 1976-11-29 1978-06-20 Du Pont Liquid stacking method
JPS5537738B2 (US06521211-20030218-C00004.png) * 1976-11-29 1980-09-30
JPS5489274A (en) * 1977-12-27 1979-07-16 Fujitsu Ltd Method of making printed board
JPS6252552A (ja) * 1985-08-30 1987-03-07 Hitachi Chem Co Ltd 減圧貼り合わせ方法及び装置
JPS63259559A (ja) * 1987-04-16 1988-10-26 Hitachi Condenser Co Ltd 印刷配線板のパタ−ン形成方法
JPH026960A (ja) * 1988-02-26 1990-01-11 Morton Thiokol Inc ドライフィルムフォトレジストおよびそれを印刷回路板などに適用する方法
US7645561B1 (en) 1997-09-19 2010-01-12 Hitachi Chemical Company, Ltd. Photosensitive film
US7687224B2 (en) 1997-09-19 2010-03-30 Hitachi Chemical Company, Ltd. Photosensitive film
JP2001249448A (ja) * 2000-01-14 2001-09-14 Shipley Co Llc 増加したフォトスピードを有するフォトレジスト
US7067226B2 (en) 2001-03-29 2006-06-27 Hitachi Chemical Co., Ltd. Photosensitive film for circuit formation and process for producing printed wiring board

Also Published As

Publication number Publication date
FR2287714A1 (fr) 1976-05-07
DE2544553A1 (de) 1976-04-22
JPS5513341B2 (US06521211-20030218-C00004.png) 1980-04-08
DE2544553C2 (de) 1983-08-04
NL7511714A (nl) 1976-04-12
GB1517302A (en) 1978-07-12
FR2287714B1 (US06521211-20030218-C00004.png) 1982-10-15

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