JPS5143675A - - Google Patents

Info

Publication number
JPS5143675A
JPS5143675A JP50077134A JP7713475A JPS5143675A JP S5143675 A JPS5143675 A JP S5143675A JP 50077134 A JP50077134 A JP 50077134A JP 7713475 A JP7713475 A JP 7713475A JP S5143675 A JPS5143675 A JP S5143675A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50077134A
Other languages
Japanese (ja)
Other versions
JPS547677B2 (en, 2012
Inventor
Esu Kaizaa Aran
Aaru Harisu Hyuu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JEIDO CORP ZA
Original Assignee
JEIDO CORP ZA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JEIDO CORP ZA filed Critical JEIDO CORP ZA
Publication of JPS5143675A publication Critical patent/JPS5143675A/ja
Publication of JPS547677B2 publication Critical patent/JPS547677B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
JP7713475A 1974-10-03 1975-06-24 Expired JPS547677B2 (en, 2012)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/511,835 US3949925A (en) 1974-10-03 1974-10-03 Outer lead bonder

Publications (2)

Publication Number Publication Date
JPS5143675A true JPS5143675A (en, 2012) 1976-04-14
JPS547677B2 JPS547677B2 (en, 2012) 1979-04-09

Family

ID=24036648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7713475A Expired JPS547677B2 (en, 2012) 1974-10-03 1975-06-24

Country Status (2)

Country Link
US (1) US3949925A (en, 2012)
JP (1) JPS547677B2 (en, 2012)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02205331A (ja) * 1989-02-03 1990-08-15 Toray Eng Co Ltd 半導体のボンディング方法
JPH06168983A (ja) * 1992-04-03 1994-06-14 Shibuya Kogyo Co Ltd ボンディングマシーンのチップステージｚ軸駆動機構

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4050618A (en) * 1975-06-19 1977-09-27 Angelucci Sr Thomas L Flexible lead bonding apparatus
US4099660A (en) * 1975-10-31 1978-07-11 National Semiconductor Corporation Apparatus for and method of shaping interconnect leads
US4166562A (en) * 1977-09-01 1979-09-04 The Jade Corporation Assembly system for microcomponent devices such as semiconductor devices
US4255851A (en) * 1978-12-06 1981-03-17 Western Electric Company, Inc. Method and apparatus for indelibly marking articles during a manufacturing process
FR2495836A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Machine automatique de cambrage des pattes de connexion de plaquettes de circuits integres
US4407440A (en) * 1981-02-23 1983-10-04 Mesa Technology Semiconductor die bonding machine
JPS5850572A (ja) * 1981-09-22 1983-03-25 株式会社東芝 デイスプレイ装置の製造方法
JPS5851530A (ja) * 1981-09-22 1983-03-26 Toshiba Corp 半導体ペレツト配列装置および方法
US4876791A (en) * 1986-04-22 1989-10-31 Kulicke & Soffa Industries, Inc. Apparatus for and methods of die bonding
US4765531A (en) * 1987-05-14 1988-08-23 Kulicke And Soffa Industries Inc. Quick change work station apparatus for automatic wire bonders
US5059559A (en) * 1987-11-02 1991-10-22 Hitachi, Ltd. Method of aligning and bonding tab inner leads
US5339939A (en) * 1992-08-31 1994-08-23 Cna Manufacturing Systems, Inc. Pocket tape feeder system
JP3178181B2 (ja) * 1993-09-06 2001-06-18 松下電器産業株式会社 アウターリードボンディング装置およびアウターリードボンディング方法
BE1007866A3 (nl) * 1993-12-10 1995-11-07 Koninkl Philips Electronics Nv Werkwijze voor het plaatsen van een onderdeel op een strookvormige drager alsmede inrichting voor het plaatsen van een onderdeel op een strookvormige drager.
JP3079501B2 (ja) * 1995-06-26 2000-08-21 株式会社新川 ダイ突き上げ装置の調整装置
JP3089392B2 (ja) * 1995-07-13 2000-09-18 株式会社新川 ボンデイング装置
US5971256A (en) 1997-02-05 1999-10-26 Micron Technology, Inc. Quick change precisor
EP0949662A3 (en) * 1998-03-27 2001-08-01 Supersensor (Proprietary) Limited Die transfer method and system
FR2926890B1 (fr) * 2008-01-30 2011-01-07 St Microelectronics Grenoble Procede et dispositif de transport de modules electroniques et equipements de manipulation et de test de modules electroniques
DE102008018886A1 (de) * 2008-04-14 2009-10-15 Marquardt Gmbh Bauelement und Verfahren zu dessen Herstellung

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4890475A (en, 2012) * 1972-02-14 1973-11-26

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3689991A (en) * 1968-03-01 1972-09-12 Gen Electric A method of manufacturing a semiconductor device utilizing a flexible carrier
US3698073A (en) * 1970-10-13 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
US3793714A (en) * 1971-05-27 1974-02-26 Texas Instruments Inc Integrated circuit assembly using etched metal patterns of flexible insulating film
US3859718A (en) * 1973-01-02 1975-01-14 Texas Instruments Inc Method and apparatus for the assembly of semiconductor devices

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4890475A (en, 2012) * 1972-02-14 1973-11-26

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02205331A (ja) * 1989-02-03 1990-08-15 Toray Eng Co Ltd 半導体のボンディング方法
JPH06168983A (ja) * 1992-04-03 1994-06-14 Shibuya Kogyo Co Ltd ボンディングマシーンのチップステージｚ軸駆動機構

Also Published As

Publication number Publication date
US3949925A (en) 1976-04-13
JPS547677B2 (en, 2012) 1979-04-09

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