JPS5132959B2 - - Google Patents

Info

Publication number
JPS5132959B2
JPS5132959B2 JP48132261A JP13226173A JPS5132959B2 JP S5132959 B2 JPS5132959 B2 JP S5132959B2 JP 48132261 A JP48132261 A JP 48132261A JP 13226173 A JP13226173 A JP 13226173A JP S5132959 B2 JPS5132959 B2 JP S5132959B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP48132261A
Other languages
Japanese (ja)
Other versions
JPS4998982A (
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4998982A publication Critical patent/JPS4998982A/ja
Publication of JPS5132959B2 publication Critical patent/JPS5132959B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/037—Diffusion-deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/117—Oxidation, selective
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/145—Shaped junctions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/151—Simultaneous diffusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/162—Testing steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP48132261A 1972-12-29 1973-11-27 Expired JPS5132959B2 ( )

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31912072A 1972-12-29 1972-12-29

Publications (2)

Publication Number Publication Date
JPS4998982A JPS4998982A ( ) 1974-09-19
JPS5132959B2 true JPS5132959B2 ( ) 1976-09-16

Family

ID=23240934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48132261A Expired JPS5132959B2 ( ) 1972-12-29 1973-11-27

Country Status (6)

Country Link
US (1) US3774088A ( )
JP (1) JPS5132959B2 ( )
CA (1) CA996280A ( )
FR (1) FR2212621B1 ( )
GB (1) GB1441800A ( )
IT (1) IT1001593B ( )

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61105028U ( ) * 1984-12-14 1986-07-03
JPS63115330U ( ) * 1987-01-22 1988-07-25
JPH0354B2 ( ) * 1980-12-12 1991-01-07 Hitachi Maxell

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2280203A1 (fr) * 1974-07-26 1976-02-20 Thomson Csf Procede d'ajustement de tension de seuil de transistors a effet de champ
US4078243A (en) * 1975-12-12 1978-03-07 International Business Machines Corporation Phototransistor array having uniform current response and method of manufacture
US4079408A (en) * 1975-12-31 1978-03-14 International Business Machines Corporation Semiconductor structure with annular collector/subcollector region
US4064527A (en) * 1976-09-20 1977-12-20 Intersil, Inc. Integrated circuit having a buried load device
JPS5793542A (en) * 1980-12-03 1982-06-10 Hitachi Ltd Semiconductor integrated circuit device
US4413271A (en) * 1981-03-30 1983-11-01 Sprague Electric Company Integrated circuit including test portion and method for making
JPS59123242A (ja) * 1982-12-29 1984-07-17 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション テスト・デバイスを有する半導体基板
US4542340A (en) * 1982-12-30 1985-09-17 Ibm Corporation Testing method and structure for leakage current characterization in the manufacture of dynamic RAM cells
US5101152A (en) * 1990-01-31 1992-03-31 Hewlett-Packard Company Integrated circuit transfer test device system utilizing lateral transistors
JP2530722Y2 (ja) * 1990-07-18 1997-03-26 日本電気株式会社 半導体装置
US5214657A (en) * 1990-09-21 1993-05-25 Micron Technology, Inc. Method for fabricating wafer-scale integration wafers and method for utilizing defective wafer-scale integration wafers
US5217907A (en) * 1992-01-28 1993-06-08 National Semiconductor Corporation Array spreading resistance probe (ASRP) method for profile extraction from semiconductor chips of cellular construction
KR100375177B1 (ko) * 1995-05-19 2003-05-09 마츠시타 덴끼 산교 가부시키가이샤 반도체 장치의 검사방법
IT1296624B1 (it) * 1997-12-10 1999-07-14 Sgs Thomson Microelectronics Struttura e metodo per la valutazione di un dispositivo elettronico integrato.
DE10014914C2 (de) * 2000-03-17 2003-07-24 Infineon Technologies Ag Verfahren zur Herstellung und Überprüfung von Strukturen elektronischer Schaltungen in einem Halbleitersubstrat
RU174463U1 (ru) * 2017-03-17 2017-10-16 Федеральное государственное унитарное предприятие "Ростовский-на-Дону научно-исследовательский институт радиосвязи" (ФГУП "РНИИРС") Тестовый полевой транзистор Шоттки

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3335340A (en) * 1964-02-24 1967-08-08 Ibm Combined transistor and testing structures and fabrication thereof
FR1064185A (fr) * 1967-05-23 1954-05-11 Philips Nv Procédé de fabrication d'un système d'électrodes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0354B2 ( ) * 1980-12-12 1991-01-07 Hitachi Maxell
JPS61105028U ( ) * 1984-12-14 1986-07-03
JPS63115330U ( ) * 1987-01-22 1988-07-25

Also Published As

Publication number Publication date
GB1441800A (en) 1976-07-07
JPS4998982A ( ) 1974-09-19
CA996280A (en) 1976-08-31
FR2212621B1 ( ) 1977-09-30
US3774088A (en) 1973-11-20
IT1001593B (it) 1976-04-30
FR2212621A1 ( ) 1974-07-26

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