JPS5128829B1 - - Google Patents

Info

Publication number
JPS5128829B1
JPS5128829B1 JP43076079A JP7607968A JPS5128829B1 JP S5128829 B1 JPS5128829 B1 JP S5128829B1 JP 43076079 A JP43076079 A JP 43076079A JP 7607968 A JP7607968 A JP 7607968A JP S5128829 B1 JPS5128829 B1 JP S5128829B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP43076079A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP43076079A priority Critical patent/JPS5128829B1/ja
Priority to GB50245/69A priority patent/GB1277254A/en
Priority to FR6935663A priority patent/FR2023323A1/fr
Priority to DE1952789A priority patent/DE1952789C3/de
Publication of JPS5128829B1 publication Critical patent/JPS5128829B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W76/153
    • H10W72/20
    • H10W70/655
    • H10W72/075
    • H10W72/5522
    • H10W72/5524
    • H10W90/754

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Casings For Electric Apparatus (AREA)
  • Thermistors And Varistors (AREA)
JP43076079A 1968-10-21 1968-10-21 Pending JPS5128829B1 (cg-RX-API-DMAC10.html)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP43076079A JPS5128829B1 (cg-RX-API-DMAC10.html) 1968-10-21 1968-10-21
GB50245/69A GB1277254A (en) 1968-10-21 1969-10-13 Hermetically sealed package for use in electronic components
FR6935663A FR2023323A1 (cg-RX-API-DMAC10.html) 1968-10-21 1969-10-17
DE1952789A DE1952789C3 (de) 1968-10-21 1969-10-20 Luftdichte Kapselung für elektronische Bauelemente

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP43076079A JPS5128829B1 (cg-RX-API-DMAC10.html) 1968-10-21 1968-10-21

Publications (1)

Publication Number Publication Date
JPS5128829B1 true JPS5128829B1 (cg-RX-API-DMAC10.html) 1976-08-21

Family

ID=13594790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP43076079A Pending JPS5128829B1 (cg-RX-API-DMAC10.html) 1968-10-21 1968-10-21

Country Status (4)

Country Link
JP (1) JPS5128829B1 (cg-RX-API-DMAC10.html)
DE (1) DE1952789C3 (cg-RX-API-DMAC10.html)
FR (1) FR2023323A1 (cg-RX-API-DMAC10.html)
GB (1) GB1277254A (cg-RX-API-DMAC10.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5615059U (cg-RX-API-DMAC10.html) * 1979-07-11 1981-02-09
JPS5651846A (en) * 1979-10-04 1981-05-09 Fujitsu Ltd Ic package
US4320438A (en) 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
DE3125360A1 (de) * 1981-06-27 1983-01-13 Robert Bosch Gmbh, 7000 Stuttgart "elektronisches bauelement"
DE3147790A1 (de) * 1981-12-03 1983-06-09 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungsmodul und verfahren zu seiner herstellung
DE3147789A1 (de) * 1981-12-03 1983-06-09 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungsmodul und verfahren zu seiner herstellung
JPS5987893A (ja) * 1982-11-12 1984-05-21 株式会社日立製作所 配線基板とその製造方法およびそれを用いた半導体装置
US4750092A (en) * 1985-11-20 1988-06-07 Kollmorgen Technologies Corporation Interconnection package suitable for electronic devices and methods for producing same
DE3703280A1 (de) * 1987-02-04 1988-08-18 Licentia Gmbh Schaltungsanordnung mit einem oder mehreren integrierten schaltkreisen
GB2209867B (en) * 1987-09-16 1990-12-19 Advanced Semiconductor Package Method of forming an integrated circuit chip carrier
US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
DE19548050A1 (de) * 1995-12-21 1997-06-26 Siemens Matsushita Components Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement -
CN113937067A (zh) * 2021-09-23 2022-01-14 中国电子科技集团公司第十三研究所 磁电阻随机存储器及其封装外壳和制备方法

Also Published As

Publication number Publication date
DE1952789A1 (de) 1970-04-30
FR2023323A1 (cg-RX-API-DMAC10.html) 1970-08-21
GB1277254A (en) 1972-06-07
DE1952789B2 (de) 1971-09-30
DE1952789C3 (de) 1974-04-18

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