JPS511586A - Kariugomutokinzokutono setsuchakuhoho - Google Patents

Kariugomutokinzokutono setsuchakuhoho

Info

Publication number
JPS511586A
JPS511586A JP7350274A JP7350274A JPS511586A JP S511586 A JPS511586 A JP S511586A JP 7350274 A JP7350274 A JP 7350274A JP 7350274 A JP7350274 A JP 7350274A JP S511586 A JPS511586 A JP S511586A
Authority
JP
Japan
Prior art keywords
setsuchakuhoho
kariugomutokinzokutono
kariugomutokinzokutono setsuchakuhoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7350274A
Other languages
English (en)
Inventor
Tadashi Koda
Mikiro Chumu
Masao Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mazda Motor Corp
Original Assignee
Toyo Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Kogyo Co Ltd filed Critical Toyo Kogyo Co Ltd
Priority to JP7350274A priority Critical patent/JPS511586A/ja
Publication of JPS511586A publication Critical patent/JPS511586A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined

Landscapes

  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
JP7350274A 1974-06-26 1974-06-26 Kariugomutokinzokutono setsuchakuhoho Pending JPS511586A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7350274A JPS511586A (ja) 1974-06-26 1974-06-26 Kariugomutokinzokutono setsuchakuhoho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7350274A JPS511586A (ja) 1974-06-26 1974-06-26 Kariugomutokinzokutono setsuchakuhoho

Publications (1)

Publication Number Publication Date
JPS511586A true JPS511586A (ja) 1976-01-08

Family

ID=13520082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7350274A Pending JPS511586A (ja) 1974-06-26 1974-06-26 Kariugomutokinzokutono setsuchakuhoho

Country Status (1)

Country Link
JP (1) JPS511586A (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5142915B1 (ja) * 1970-10-14 1976-11-18
JPS5294781A (en) * 1976-02-04 1977-08-09 Philips Nv Method of producing semiconductor device
JPS5384555A (en) * 1976-12-29 1978-07-26 Nippon Precision Circuits Semiconductor
JPS53108278A (en) * 1977-11-14 1978-09-20 Nec Corp Manufacture of semiconductor device
JPS5416178A (en) * 1977-07-07 1979-02-06 Oki Electric Ind Co Ltd Forming method of electrode
JPS5771186A (en) * 1980-08-18 1982-05-01 Philips Nv Zener diode and method of producing same
JPS57102070A (en) * 1980-12-17 1982-06-24 Nec Corp Semiconductor device
JPS57180123A (en) * 1981-04-29 1982-11-06 Fujitsu Ltd Manufacture of semiconductor device
JPS59124717A (ja) * 1982-12-31 1984-07-18 Rohm Co Ltd ポリシリコン電極形成方法
JPS6273711A (ja) * 1985-09-27 1987-04-04 Nec Corp 半導体装置
JPS62115846A (ja) * 1985-11-15 1987-05-27 Mitsubishi Electric Corp 半導体装置及びその製造方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5142915B1 (ja) * 1970-10-14 1976-11-18
JPS5294781A (en) * 1976-02-04 1977-08-09 Philips Nv Method of producing semiconductor device
JPS5384555A (en) * 1976-12-29 1978-07-26 Nippon Precision Circuits Semiconductor
JPS5416178A (en) * 1977-07-07 1979-02-06 Oki Electric Ind Co Ltd Forming method of electrode
JPS53108278A (en) * 1977-11-14 1978-09-20 Nec Corp Manufacture of semiconductor device
JPS5771186A (en) * 1980-08-18 1982-05-01 Philips Nv Zener diode and method of producing same
JPS57102070A (en) * 1980-12-17 1982-06-24 Nec Corp Semiconductor device
JPS57180123A (en) * 1981-04-29 1982-11-06 Fujitsu Ltd Manufacture of semiconductor device
JPS59124717A (ja) * 1982-12-31 1984-07-18 Rohm Co Ltd ポリシリコン電極形成方法
JPS6273711A (ja) * 1985-09-27 1987-04-04 Nec Corp 半導体装置
JPS62115846A (ja) * 1985-11-15 1987-05-27 Mitsubishi Electric Corp 半導体装置及びその製造方法

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