JPS51144582A - Heat sink for thyristor - Google Patents

Heat sink for thyristor

Info

Publication number
JPS51144582A
JPS51144582A JP6105676A JP6105676A JPS51144582A JP S51144582 A JPS51144582 A JP S51144582A JP 6105676 A JP6105676 A JP 6105676A JP 6105676 A JP6105676 A JP 6105676A JP S51144582 A JPS51144582 A JP S51144582A
Authority
JP
Japan
Prior art keywords
thyristor
heat sink
sink
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6105676A
Other languages
English (en)
Japanese (ja)
Inventor
Saranki Chibooru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS51144582A publication Critical patent/JPS51144582A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP6105676A 1975-05-26 1976-05-26 Heat sink for thyristor Pending JPS51144582A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752523232 DE2523232C3 (de) 1975-05-26 1975-05-26 Kühldose für einen flussigkeitsgekfihlten Thyristor

Publications (1)

Publication Number Publication Date
JPS51144582A true JPS51144582A (en) 1976-12-11

Family

ID=5947434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6105676A Pending JPS51144582A (en) 1975-05-26 1976-05-26 Heat sink for thyristor

Country Status (5)

Country Link
JP (1) JPS51144582A (de)
BE (1) BE842143A (de)
DE (1) DE2523232C3 (de)
FR (1) FR2312858A1 (de)
SE (1) SE7602758L (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2617776A1 (de) * 1976-04-23 1977-10-27 Siemens Ag Kuehldose fuer einen thyristor
DE2640000C2 (de) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Zylindrische Kühldose mit gegenüberliegenden Ein- und Ausflußöffnungen für flüssigkeitsgekühlte Leistungshalbleiterbauelemente und Verfahren zur Herstellung derselben
DE2926342C2 (de) * 1979-06-29 1982-10-28 Siemens AG, 1000 Berlin und 8000 München Kühldose für scheibenförmige Halbleiterbauelemente
JPS5610948A (en) * 1979-07-06 1981-02-03 Hitachi Ltd Water cooling fin for semiconductor element
DE2934549A1 (de) * 1979-08-03 1981-02-19 Bbc Brown Boveri & Cie Kuehlkoerper, insbesondere fluessigkeitskuehlkoerper fuer hochleistungs- halbleiterelemente
DE3238516C2 (de) * 1982-10-18 1986-07-10 Siemens AG, 1000 Berlin und 8000 München Flüssigkeitsgekühlter Thyristorbaustein
DE3709006C1 (en) * 1987-03-19 1988-07-28 Licentia Gmbh Electrically insulating heat tube
DE3719028A1 (de) * 1987-06-06 1988-12-22 Asea Brown Boveri Behaelterdichtung fuer siedefluessigkeitskuehlung
DE3719637A1 (de) * 1987-06-12 1988-12-29 Asea Brown Boveri Siedekuehleinrichtung fuer halbleiterelemente
DE3908996C2 (de) * 1989-03-18 1993-09-30 Abb Patent Gmbh Verfahren zur Herstellung eines Flüssigkeitskühlkörpers
JPH04305963A (ja) * 1991-04-02 1992-10-28 Hitachi Ltd 半導体素子の冷却装置
JPH0637219A (ja) * 1992-07-16 1994-02-10 Fuji Electric Co Ltd パワー半導体装置の冷却装置
DE4302816C2 (de) * 1993-01-28 1996-08-08 Aeg Westinghouse Transport Anordnung zur Kühlung von druckkontaktierbaren Leistungs-Scheibenhalbleitern
DE19640488C2 (de) * 1996-09-30 2001-12-13 Fraunhofer Ges Forschung Verfahren zur Herstellung eines keramischen Kühlelements

Also Published As

Publication number Publication date
DE2523232C3 (de) 1979-04-05
FR2312858A1 (fr) 1976-12-24
DE2523232B2 (de) 1978-07-27
SE7602758L (sv) 1976-11-27
BE842143A (fr) 1976-09-16
DE2523232A1 (de) 1976-12-02

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