JPS51144582A - Heat sink for thyristor - Google Patents
Heat sink for thyristorInfo
- Publication number
- JPS51144582A JPS51144582A JP6105676A JP6105676A JPS51144582A JP S51144582 A JPS51144582 A JP S51144582A JP 6105676 A JP6105676 A JP 6105676A JP 6105676 A JP6105676 A JP 6105676A JP S51144582 A JPS51144582 A JP S51144582A
- Authority
- JP
- Japan
- Prior art keywords
- thyristor
- heat sink
- sink
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19752523232 DE2523232C3 (en) | 1975-05-26 | 1975-05-26 | Cooling box for a liquid-cooled thyristor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS51144582A true JPS51144582A (en) | 1976-12-11 |
Family
ID=5947434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6105676A Pending JPS51144582A (en) | 1975-05-26 | 1976-05-26 | Heat sink for thyristor |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS51144582A (en) |
BE (1) | BE842143A (en) |
DE (1) | DE2523232C3 (en) |
FR (1) | FR2312858A1 (en) |
SE (1) | SE7602758L (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2617776A1 (en) * | 1976-04-23 | 1977-10-27 | Siemens Ag | COOLER FOR A THYRISTOR |
DE2640000C2 (en) * | 1976-09-04 | 1986-09-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Cylindrical cooling box with opposing inlet and outlet openings for liquid-cooled power semiconductor components and a method for producing the same |
DE2926342C2 (en) * | 1979-06-29 | 1982-10-28 | Siemens AG, 1000 Berlin und 8000 München | Cooling box for disk-shaped semiconductor components |
JPS5610948A (en) * | 1979-07-06 | 1981-02-03 | Hitachi Ltd | Water cooling fin for semiconductor element |
DE2934549A1 (en) * | 1979-08-03 | 1981-02-19 | Bbc Brown Boveri & Cie | Cooling system for semiconductor body - has parallel layers of channels between opposed turbulence and collector chambers inside housing |
DE3238516C2 (en) * | 1982-10-18 | 1986-07-10 | Siemens AG, 1000 Berlin und 8000 München | Liquid-cooled thyristor module |
DE3709006C1 (en) * | 1987-03-19 | 1988-07-28 | Licentia Gmbh | Electrically insulating heat tube |
DE3719028A1 (en) * | 1987-06-06 | 1988-12-22 | Asea Brown Boveri | Container seal for cooling boiling liquids |
DE3719637A1 (en) * | 1987-06-12 | 1988-12-29 | Asea Brown Boveri | Boiling-cooling device for semiconductor elements |
DE3908996C2 (en) * | 1989-03-18 | 1993-09-30 | Abb Patent Gmbh | Method of manufacturing a liquid heat sink |
JPH04305963A (en) * | 1991-04-02 | 1992-10-28 | Hitachi Ltd | Cooling device for semiconductor devices |
JPH0637219A (en) * | 1992-07-16 | 1994-02-10 | Fuji Electric Co Ltd | Cooling unit for power semiconductor device |
DE4302816C2 (en) * | 1993-01-28 | 1996-08-08 | Aeg Westinghouse Transport | Arrangement for cooling pressure contactable power disc semiconductors |
DE19640488C2 (en) * | 1996-09-30 | 2001-12-13 | Fraunhofer Ges Forschung | Method of manufacturing a ceramic cooling element |
-
1975
- 1975-05-26 DE DE19752523232 patent/DE2523232C3/en not_active Expired
-
1976
- 1976-02-27 SE SE7602758A patent/SE7602758L/en not_active Application Discontinuation
- 1976-05-12 FR FR7614273A patent/FR2312858A1/en not_active Withdrawn
- 1976-05-24 BE BE167269A patent/BE842143A/en unknown
- 1976-05-26 JP JP6105676A patent/JPS51144582A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
BE842143A (en) | 1976-09-16 |
DE2523232B2 (en) | 1978-07-27 |
FR2312858A1 (en) | 1976-12-24 |
DE2523232C3 (en) | 1979-04-05 |
DE2523232A1 (en) | 1976-12-02 |
SE7602758L (en) | 1976-11-27 |
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