SE7602758L - COOLING BODY FOR TYRISTOR - Google Patents

COOLING BODY FOR TYRISTOR

Info

Publication number
SE7602758L
SE7602758L SE7602758A SE7602758A SE7602758L SE 7602758 L SE7602758 L SE 7602758L SE 7602758 A SE7602758 A SE 7602758A SE 7602758 A SE7602758 A SE 7602758A SE 7602758 L SE7602758 L SE 7602758L
Authority
SE
Sweden
Prior art keywords
tyristor
cooling body
cooling
Prior art date
Application number
SE7602758A
Other languages
Unknown language ( )
Swedish (sv)
Inventor
T Salaki
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE7602758L publication Critical patent/SE7602758L/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SE7602758A 1975-05-26 1976-02-27 COOLING BODY FOR TYRISTOR SE7602758L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752523232 DE2523232C3 (en) 1975-05-26 1975-05-26 Cooling box for a liquid-cooled thyristor

Publications (1)

Publication Number Publication Date
SE7602758L true SE7602758L (en) 1976-11-27

Family

ID=5947434

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7602758A SE7602758L (en) 1975-05-26 1976-02-27 COOLING BODY FOR TYRISTOR

Country Status (5)

Country Link
JP (1) JPS51144582A (en)
BE (1) BE842143A (en)
DE (1) DE2523232C3 (en)
FR (1) FR2312858A1 (en)
SE (1) SE7602758L (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2617776A1 (en) * 1976-04-23 1977-10-27 Siemens Ag COOLER FOR A THYRISTOR
DE2640000C2 (en) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Cylindrical cooling box with opposing inlet and outlet openings for liquid-cooled power semiconductor components and a method for producing the same
DE2926342C2 (en) * 1979-06-29 1982-10-28 Siemens AG, 1000 Berlin und 8000 München Cooling box for disk-shaped semiconductor components
JPS5610948A (en) * 1979-07-06 1981-02-03 Hitachi Ltd Water cooling fin for semiconductor element
DE2934549A1 (en) * 1979-08-03 1981-02-19 Bbc Brown Boveri & Cie Cooling system for semiconductor body - has parallel layers of channels between opposed turbulence and collector chambers inside housing
DE3238516C2 (en) * 1982-10-18 1986-07-10 Siemens AG, 1000 Berlin und 8000 München Liquid-cooled thyristor module
DE3709006C1 (en) * 1987-03-19 1988-07-28 Licentia Gmbh Electrically insulating heat tube
DE3719028A1 (en) * 1987-06-06 1988-12-22 Asea Brown Boveri Container seal for cooling boiling liquids
DE3719637A1 (en) * 1987-06-12 1988-12-29 Asea Brown Boveri Boiling-cooling device for semiconductor elements
DE3908996C2 (en) * 1989-03-18 1993-09-30 Abb Patent Gmbh Method of manufacturing a liquid heat sink
JPH04305963A (en) * 1991-04-02 1992-10-28 Hitachi Ltd Cooling device for semiconductor devices
JPH0637219A (en) * 1992-07-16 1994-02-10 Fuji Electric Co Ltd Cooling unit for power semiconductor device
DE4302816C2 (en) * 1993-01-28 1996-08-08 Aeg Westinghouse Transport Arrangement for cooling pressure contactable power disc semiconductors
DE19640488C2 (en) * 1996-09-30 2001-12-13 Fraunhofer Ges Forschung Method of manufacturing a ceramic cooling element

Also Published As

Publication number Publication date
FR2312858A1 (en) 1976-12-24
DE2523232B2 (en) 1978-07-27
BE842143A (en) 1976-09-16
JPS51144582A (en) 1976-12-11
DE2523232C3 (en) 1979-04-05
DE2523232A1 (en) 1976-12-02

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