JPS5211869A - Cooling body - Google Patents

Cooling body

Info

Publication number
JPS5211869A
JPS5211869A JP8342176A JP8342176A JPS5211869A JP S5211869 A JPS5211869 A JP S5211869A JP 8342176 A JP8342176 A JP 8342176A JP 8342176 A JP8342176 A JP 8342176A JP S5211869 A JPS5211869 A JP S5211869A
Authority
JP
Japan
Prior art keywords
cooling body
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8342176A
Other languages
Japanese (ja)
Inventor
Ueruna Heruman Hansu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS5211869A publication Critical patent/JPS5211869A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Details Of Measuring And Other Instruments (AREA)
JP8342176A 1975-07-14 1976-07-13 Cooling body Pending JPS5211869A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752531450 DE2531450A1 (en) 1975-07-14 1975-07-14 Semiconductor element heat sink - is block shaped and has lateral cooling ribs divided into groups by transverse slot

Publications (1)

Publication Number Publication Date
JPS5211869A true JPS5211869A (en) 1977-01-29

Family

ID=5951500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8342176A Pending JPS5211869A (en) 1975-07-14 1976-07-13 Cooling body

Country Status (2)

Country Link
JP (1) JPS5211869A (en)
DE (1) DE2531450A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521451U (en) * 1991-08-28 1993-03-19 昭和アルミニウム株式会社 Heat sink
JP2008193007A (en) * 2007-02-07 2008-08-21 Sankyo Material Inc Heat sink made of aluminum extruded material
JP2009088056A (en) * 2007-09-28 2009-04-23 Sankyo Material Inc Fin processing method for heat sink made of extruded aluminum material
JP2009290014A (en) * 2008-05-29 2009-12-10 Showa Denko Kk Method of manufacturing heat sink
JP2010225621A (en) * 2009-03-19 2010-10-07 Sankyo Material Inc Fin processing method for heat sink made of extruded aluminum material
JP2013223983A (en) * 2012-04-23 2013-10-31 Sato Holdings Corp Thermal printer
JP2014204045A (en) * 2013-04-08 2014-10-27 株式会社Uacj Cooler
JP2018062298A (en) * 2016-10-14 2018-04-19 株式会社デンソー Air conditioning device and method for manufacturing the same

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH618290A5 (en) * 1977-08-16 1980-07-15 Bbc Brown Boveri & Cie Semiconductor valve cooler with conducting elements for a coolant flow and use of these semiconductor valve coolers.
JP3236137B2 (en) * 1993-07-30 2001-12-10 富士通株式会社 Semiconductor element cooling device
DE9319259U1 (en) * 1993-12-15 1994-03-24 Siemens AG, 80333 München Heatsink
US6634421B2 (en) 2000-03-10 2003-10-21 Satcon Technology Corporation High performance cold plate for electronic cooling
US6273186B1 (en) 2000-03-13 2001-08-14 Satcon Technology Corporation Low-cost, high density, staggered pin fin array
US7017655B2 (en) 2003-12-18 2006-03-28 Modine Manufacturing Co. Forced fluid heat sink
US7159649B2 (en) 2004-03-11 2007-01-09 Thermal Corp. Air-to-air heat exchanger
KR20150013764A (en) 2012-05-14 2015-02-05 베르-헬라 테르모콘트롤 게엠베하 Electrical vehicle heater, in particular for vehicles having a hybrid drive or having an electric drive

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521451U (en) * 1991-08-28 1993-03-19 昭和アルミニウム株式会社 Heat sink
JP2008193007A (en) * 2007-02-07 2008-08-21 Sankyo Material Inc Heat sink made of aluminum extruded material
JP2009088056A (en) * 2007-09-28 2009-04-23 Sankyo Material Inc Fin processing method for heat sink made of extruded aluminum material
JP2009290014A (en) * 2008-05-29 2009-12-10 Showa Denko Kk Method of manufacturing heat sink
JP2010225621A (en) * 2009-03-19 2010-10-07 Sankyo Material Inc Fin processing method for heat sink made of extruded aluminum material
JP2013223983A (en) * 2012-04-23 2013-10-31 Sato Holdings Corp Thermal printer
JP2014204045A (en) * 2013-04-08 2014-10-27 株式会社Uacj Cooler
JP2018062298A (en) * 2016-10-14 2018-04-19 株式会社デンソー Air conditioning device and method for manufacturing the same

Also Published As

Publication number Publication date
DE2531450A1 (en) 1977-01-20

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