FR2312858A1 - Boitier de refroidissement destine a un thyristor - Google Patents

Boitier de refroidissement destine a un thyristor

Info

Publication number
FR2312858A1
FR2312858A1 FR7614273A FR7614273A FR2312858A1 FR 2312858 A1 FR2312858 A1 FR 2312858A1 FR 7614273 A FR7614273 A FR 7614273A FR 7614273 A FR7614273 A FR 7614273A FR 2312858 A1 FR2312858 A1 FR 2312858A1
Authority
FR
France
Prior art keywords
outer ring
recesses
thyristor
exchange cylinder
opposite sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7614273A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2312858A1 publication Critical patent/FR2312858A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR7614273A 1975-05-26 1976-05-12 Boitier de refroidissement destine a un thyristor Withdrawn FR2312858A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752523232 DE2523232C3 (de) 1975-05-26 1975-05-26 Kühldose für einen flussigkeitsgekfihlten Thyristor

Publications (1)

Publication Number Publication Date
FR2312858A1 true FR2312858A1 (fr) 1976-12-24

Family

ID=5947434

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7614273A Withdrawn FR2312858A1 (fr) 1975-05-26 1976-05-12 Boitier de refroidissement destine a un thyristor

Country Status (5)

Country Link
JP (1) JPS51144582A (fr)
BE (1) BE842143A (fr)
DE (1) DE2523232C3 (fr)
FR (1) FR2312858A1 (fr)
SE (1) SE7602758L (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0021269A2 (fr) * 1979-06-29 1981-01-07 Siemens Aktiengesellschaft Boîte de refroidissement pour composants semiconducteurs en forme de disque

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2617776A1 (de) * 1976-04-23 1977-10-27 Siemens Ag Kuehldose fuer einen thyristor
DE2640000C2 (de) * 1976-09-04 1986-09-18 Brown, Boveri & Cie Ag, 6800 Mannheim Zylindrische Kühldose mit gegenüberliegenden Ein- und Ausflußöffnungen für flüssigkeitsgekühlte Leistungshalbleiterbauelemente und Verfahren zur Herstellung derselben
JPS5610948A (en) * 1979-07-06 1981-02-03 Hitachi Ltd Water cooling fin for semiconductor element
DE2934549A1 (de) * 1979-08-03 1981-02-19 Bbc Brown Boveri & Cie Kuehlkoerper, insbesondere fluessigkeitskuehlkoerper fuer hochleistungs- halbleiterelemente
DE3238516C2 (de) * 1982-10-18 1986-07-10 Siemens AG, 1000 Berlin und 8000 München Flüssigkeitsgekühlter Thyristorbaustein
DE3709006C1 (en) * 1987-03-19 1988-07-28 Licentia Gmbh Electrically insulating heat tube
DE3719028A1 (de) * 1987-06-06 1988-12-22 Asea Brown Boveri Behaelterdichtung fuer siedefluessigkeitskuehlung
DE3719637A1 (de) * 1987-06-12 1988-12-29 Asea Brown Boveri Siedekuehleinrichtung fuer halbleiterelemente
DE3908996C2 (de) * 1989-03-18 1993-09-30 Abb Patent Gmbh Verfahren zur Herstellung eines Flüssigkeitskühlkörpers
JPH04305963A (ja) * 1991-04-02 1992-10-28 Hitachi Ltd 半導体素子の冷却装置
JPH0637219A (ja) * 1992-07-16 1994-02-10 Fuji Electric Co Ltd パワー半導体装置の冷却装置
DE4302816C2 (de) * 1993-01-28 1996-08-08 Aeg Westinghouse Transport Anordnung zur Kühlung von druckkontaktierbaren Leistungs-Scheibenhalbleitern
DE19640488C2 (de) * 1996-09-30 2001-12-13 Fraunhofer Ges Forschung Verfahren zur Herstellung eines keramischen Kühlelements

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0021269A2 (fr) * 1979-06-29 1981-01-07 Siemens Aktiengesellschaft Boîte de refroidissement pour composants semiconducteurs en forme de disque
EP0021269A3 (fr) * 1979-06-29 1983-08-17 Siemens Aktiengesellschaft Boíte de refroidissement pour composants semiconducteurs en forme de disque

Also Published As

Publication number Publication date
DE2523232C3 (de) 1979-04-05
BE842143A (fr) 1976-09-16
DE2523232A1 (de) 1976-12-02
DE2523232B2 (de) 1978-07-27
SE7602758L (sv) 1976-11-27
JPS51144582A (en) 1976-12-11

Similar Documents

Publication Publication Date Title
FR2312858A1 (fr) Boitier de refroidissement destine a un thyristor
ES436532A1 (es) Un metodo de construir matrices para uso en la fabricacion de elementos de intercambio de calor isotensos.
FR2321675A1 (fr) Collecteur perfectionne pour echangeur de chaleur
FR2174494A5 (fr)
ES408786A1 (es) Una disposicion de bomba centrifuga.
FR2086289A1 (en) Heat exchanger baffle plate
JPS5523822A (en) Cup-stack type heat exchanger
JPS5367152A (en) Heat-pipe heat exchanger and production thereof
FR2373768A1 (fr) Echangeur de chaleur pour le refroidissement d'un fluide liquide ou gazeux
SE7900566L (sv) Kylkanaler och sett for framstellning av dessa
GB1253984A (en) Reaction apparatus
FR2092687A1 (en) Tube and plate heat exchanger
JPS5274153A (en) Heat exchanger
FR2447530A1 (fr) Echangeur de chaleur a tubes en plomb
FR2277295A1 (fr) Installation d'echange de chaleur
JPS531360A (en) Indirect heat exchanger
SU401885A1 (ru) Радиационный теплообменник
JPS55131688A (en) Heat exchanger
ES369037A1 (es) Procedimiento y aparato para refrigerar fluidos calientes.
SU836501A1 (ru) Кожухотрубный теплообменник
JPS56142389A (en) Heat transfer device
FR2429403A1 (fr) Echangeur de chaleur perfectionne
FR2020979A1 (en) Spiral chamber heat exchangers
JPS5646993A (en) Heat-exchanger
JPS57142489A (en) High fin tube for use in heat exchanger

Legal Events

Date Code Title Description
ST Notification of lapse