JPS5113614B2 - - Google Patents
Info
- Publication number
- JPS5113614B2 JPS5113614B2 JP47028271A JP2827172A JPS5113614B2 JP S5113614 B2 JPS5113614 B2 JP S5113614B2 JP 47028271 A JP47028271 A JP 47028271A JP 2827172 A JP2827172 A JP 2827172A JP S5113614 B2 JPS5113614 B2 JP S5113614B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Weting (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47028271A JPS5113614B2 (en:Method) | 1972-03-21 | 1972-03-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47028271A JPS5113614B2 (en:Method) | 1972-03-21 | 1972-03-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4896075A JPS4896075A (en:Method) | 1973-12-08 |
| JPS5113614B2 true JPS5113614B2 (en:Method) | 1976-05-01 |
Family
ID=12243905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47028271A Expired JPS5113614B2 (en:Method) | 1972-03-21 | 1972-03-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5113614B2 (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3046192U (ja) * | 1997-08-11 | 1998-02-24 | 株式会社金子製作所 | コンクリート製品用の鉄筋構造 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724655B2 (en:Method) * | 1972-05-24 | 1982-05-25 | ||
| JPS5613026B2 (en:Method) * | 1973-09-10 | 1981-03-25 | ||
| JP4461651B2 (ja) * | 2001-07-23 | 2010-05-12 | 住友金属鉱山株式会社 | リードフレームの製造方法 |
| JP4457532B2 (ja) * | 2001-07-23 | 2010-04-28 | 住友金属鉱山株式会社 | リードフレームの製造方法 |
| JP4507473B2 (ja) * | 2001-08-07 | 2010-07-21 | 住友金属鉱山株式会社 | リードフレームの製造方法 |
| JP4427933B2 (ja) * | 2001-07-23 | 2010-03-10 | 住友金属鉱山株式会社 | リードフレームの製造方法 |
| JP2009054690A (ja) * | 2007-08-24 | 2009-03-12 | Denso Corp | リードフレーム構造体 |
| JP6366034B2 (ja) * | 2014-07-15 | 2018-08-01 | 大口マテリアル株式会社 | 半導体装置用リードフレーム及びその製造方法 |
| JP6593842B2 (ja) * | 2016-03-16 | 2019-10-23 | 大口マテリアル株式会社 | Ｌｅｄパッケージ並びに多列型ｌｅｄ用リードフレーム及びその製造方法 |
-
1972
- 1972-03-21 JP JP47028271A patent/JPS5113614B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3046192U (ja) * | 1997-08-11 | 1998-02-24 | 株式会社金子製作所 | コンクリート製品用の鉄筋構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4896075A (en:Method) | 1973-12-08 |