JPS51115659A - Method of and device for electrically connecting componets one to the other - Google Patents

Method of and device for electrically connecting componets one to the other

Info

Publication number
JPS51115659A
JPS51115659A JP51027036A JP2703676A JPS51115659A JP S51115659 A JPS51115659 A JP S51115659A JP 51027036 A JP51027036 A JP 51027036A JP 2703676 A JP2703676 A JP 2703676A JP S51115659 A JPS51115659 A JP S51115659A
Authority
JP
Japan
Prior art keywords
componets
electrically connecting
electrically
connecting componets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP51027036A
Other languages
English (en)
Other versions
JPS6015160B2 (ja
Inventor
Nikora Jieraaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of JPS51115659A publication Critical patent/JPS51115659A/ja
Publication of JPS6015160B2 publication Critical patent/JPS6015160B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP51027036A 1975-03-12 1976-03-12 電気回路を形成する方法およびその装置 Expired JPS6015160B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR7507726A FR2304247A1 (fr) 1975-03-12 1975-03-12 Procede et dispositif d'interconnexion de composants electroniques
FR7507726 1975-03-12

Publications (2)

Publication Number Publication Date
JPS51115659A true JPS51115659A (en) 1976-10-12
JPS6015160B2 JPS6015160B2 (ja) 1985-04-17

Family

ID=9152470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51027036A Expired JPS6015160B2 (ja) 1975-03-12 1976-03-12 電気回路を形成する方法およびその装置

Country Status (5)

Country Link
JP (1) JPS6015160B2 (ja)
DE (1) DE2610283C2 (ja)
FR (1) FR2304247A1 (ja)
GB (1) GB1504252A (ja)
IT (1) IT1057575B (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5558573A (en) * 1978-10-25 1980-05-01 Hitachi Ltd Manufacture of mis semiconductor device
JPS56119700U (ja) * 1979-09-28 1981-09-11
JPS57162387A (en) * 1981-03-30 1982-10-06 Fujitsu Ltd Wire bonding device
JPS6398920A (ja) * 1986-10-15 1988-04-30 文化自動車工業株式会社 ワイヤハ−ネス製造装置
JPS6398919A (ja) * 1986-10-15 1988-04-30 文化自動車工業株式会社 ワイヤハ−ネス製造装置
JPS63136420A (ja) * 1986-11-28 1988-06-08 文化自動車工業株式会社 布線装置

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ZA775455B (en) * 1977-08-09 1978-07-26 Kollmorgen Tech Corp Improved methods and apparatus for making scribed circuit boards
DE3035090C2 (de) * 1979-09-28 1995-01-26 Cii Honeywell Bull Vorrichtung zur Verdrahtung von Substratoberflächen
DE3051232C2 (de) * 1979-09-28 1995-02-23 Cii Honeywell Bull Vorrichtung zur Verdrahtung von insbesondere bestückten Substratoberflächen
US4450623A (en) * 1981-12-18 1984-05-29 Kollmorgen Technologies Corporation Process for the manufacture of circuit boards
DE3313456C2 (de) * 1982-05-10 1984-02-16 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Impuls-Lötverfahren
DD216357A1 (de) * 1983-06-29 1984-12-05 Mikroelektronik Zt Forsch Tech Vorrichtung zum automatischen kontaktieren und schneiden elektrischer leiter
DE3408338A1 (de) * 1984-03-07 1985-09-12 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zum verlegen eines schaltdrahtes auf einer traegerplatte
GB8517703D0 (en) * 1985-07-12 1985-08-21 Golten D Surface mounted assemblies
US4693778A (en) * 1985-07-19 1987-09-15 Kollmorgen Technologies Corporation Apparatus for making scribed circuit boards and circuit board modifications
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
US4642321A (en) * 1985-07-19 1987-02-10 Kollmorgen Technologies Corporation Heat activatable adhesive for wire scribed circuits
US4818322A (en) * 1985-07-19 1989-04-04 Kollmorgen Technologies Corporation Method for scribing conductors via laser
FR2585210B1 (fr) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp Procede de fabrication de plaquettes a circuits d'interconnexion
US4864723A (en) * 1986-07-01 1989-09-12 Preleg, Inc. Electrical circuit modification method
US4918260A (en) * 1985-07-26 1990-04-17 Preleg, Inc. Adhesive-coated wire and method and printed circuit board using same
CA1260157A (en) * 1985-07-26 1989-09-26 Preleg, Inc. Electrical circuit fabrication apparatus and method
US5340946A (en) * 1985-12-20 1994-08-23 Advanced Interconnection Technology, Inc. Heat activatable adhesive for wire scribed circuits
ES2004620A6 (es) * 1987-05-25 1989-01-16 C G Sistemas Electronicos S A Boquilla para implantacion o reposicion de pistas en placas de circuitos impreso
DE102006037093B3 (de) * 2006-08-07 2008-03-13 Reinhard Ulrich Fügeverfahren und Vorrichtung zum Verlegen von dünnem Draht
DE102007037165A1 (de) 2007-08-07 2009-02-12 Mühlbauer Ag Verfahren und Vorrichtung zum Verlegen von dünnem Draht
CN114012269B (zh) * 2020-07-16 2024-05-14 绵阳伟成科技有限公司 一种装夹机构、激光破皮机及破皮方法
CN118336405B (zh) * 2024-05-27 2024-09-03 中国水利水电第四工程局有限公司 一种自然接地体连接接头及其加工装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3353263A (en) * 1964-08-17 1967-11-21 Texas Instruments Inc Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor
JPS5550399B1 (ja) * 1970-03-05 1980-12-17

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5558573A (en) * 1978-10-25 1980-05-01 Hitachi Ltd Manufacture of mis semiconductor device
JPS56119700U (ja) * 1979-09-28 1981-09-11
JPS6311760Y2 (ja) * 1979-09-28 1988-04-05
JPS57162387A (en) * 1981-03-30 1982-10-06 Fujitsu Ltd Wire bonding device
JPS6398920A (ja) * 1986-10-15 1988-04-30 文化自動車工業株式会社 ワイヤハ−ネス製造装置
JPS6398919A (ja) * 1986-10-15 1988-04-30 文化自動車工業株式会社 ワイヤハ−ネス製造装置
JPS63136420A (ja) * 1986-11-28 1988-06-08 文化自動車工業株式会社 布線装置

Also Published As

Publication number Publication date
DE2610283C2 (de) 1986-05-07
FR2304247B1 (ja) 1979-06-08
GB1504252A (en) 1978-03-15
IT1057575B (it) 1982-03-30
FR2304247A1 (fr) 1976-10-08
DE2610283A1 (de) 1976-09-23
JPS6015160B2 (ja) 1985-04-17

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