JPS5092830A - - Google Patents

Info

Publication number
JPS5092830A
JPS5092830A JP304374A JP304374A JPS5092830A JP S5092830 A JPS5092830 A JP S5092830A JP 304374 A JP304374 A JP 304374A JP 304374 A JP304374 A JP 304374A JP S5092830 A JPS5092830 A JP S5092830A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP304374A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP304374A priority Critical patent/JPS5092830A/ja
Publication of JPS5092830A publication Critical patent/JPS5092830A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
JP304374A 1973-12-20 1973-12-20 Pending JPS5092830A (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP304374A JPS5092830A (de) 1973-12-20 1973-12-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP304374A JPS5092830A (de) 1973-12-20 1973-12-20

Publications (1)

Publication Number Publication Date
JPS5092830A true JPS5092830A (de) 1975-07-24

Family

ID=11546272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP304374A Pending JPS5092830A (de) 1973-12-20 1973-12-20

Country Status (1)

Country Link
JP (1) JPS5092830A (de)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4217183A (en) * 1979-05-08 1980-08-12 International Business Machines Corporation Method for locally enhancing electroplating rates
JPS55148757A (en) * 1979-05-08 1980-11-19 Ibm Selective plating method without using electricity
JPS5864368A (ja) * 1981-10-12 1983-04-16 Inoue Japax Res Inc 化学メツキ方法
JPS58500634A (ja) * 1981-05-01 1983-04-21 ウエスタ−ン エレクトリツク カムパニ−,インコ−ポレ−テツド 半導体表面上への金属の放射線誘起堆積
JPS58500920A (ja) * 1981-06-11 1983-06-02 ウエスタ−ン エレクトリツク カムパニ−,インコ−ポレ−テツド 金メツキプロセス
JPS60197879A (ja) * 1984-03-22 1985-10-07 Nippon Steel Corp 耐食性のすぐれたステンレス鋼の製造法
JPS61231184A (ja) * 1985-04-08 1986-10-15 Hitachi Ltd 局所加工装置
JP2005060828A (ja) * 2003-07-28 2005-03-10 Masaya Ichimura 光析出による金メッキ法及び金メッキ膜形成装置
JP2007519548A (ja) * 2004-02-02 2007-07-19 マクシモブスキ、セルゲイ・ニコラエビッチ シート材料上に金属化画像を生成するための方法、及び前記方法を実施するための装置

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5943987B2 (ja) * 1979-05-08 1984-10-25 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション エネルギ−・ビ−ム熱による選択的メッキ方法
JPS55148757A (en) * 1979-05-08 1980-11-19 Ibm Selective plating method without using electricity
US4239789A (en) * 1979-05-08 1980-12-16 International Business Machines Corporation Maskless method for electroless plating patterns
US4217183A (en) * 1979-05-08 1980-08-12 International Business Machines Corporation Method for locally enhancing electroplating rates
JPS58500634A (ja) * 1981-05-01 1983-04-21 ウエスタ−ン エレクトリツク カムパニ−,インコ−ポレ−テツド 半導体表面上への金属の放射線誘起堆積
JPS58500920A (ja) * 1981-06-11 1983-06-02 ウエスタ−ン エレクトリツク カムパニ−,インコ−ポレ−テツド 金メツキプロセス
JPS5864368A (ja) * 1981-10-12 1983-04-16 Inoue Japax Res Inc 化学メツキ方法
JPH0213027B2 (de) * 1981-10-12 1990-04-03 Inoue Japax Res
JPS60197879A (ja) * 1984-03-22 1985-10-07 Nippon Steel Corp 耐食性のすぐれたステンレス鋼の製造法
JPS61231184A (ja) * 1985-04-08 1986-10-15 Hitachi Ltd 局所加工装置
JP2005060828A (ja) * 2003-07-28 2005-03-10 Masaya Ichimura 光析出による金メッキ法及び金メッキ膜形成装置
US7641944B2 (en) 2003-07-28 2010-01-05 Kabushiki Kaisha Tokai Rika Denki Seisakusho Method for forming gold plating
JP4521228B2 (ja) * 2003-07-28 2010-08-11 正也 市村 光析出による金メッキ法及び金メッキ膜形成装置
JP2007519548A (ja) * 2004-02-02 2007-07-19 マクシモブスキ、セルゲイ・ニコラエビッチ シート材料上に金属化画像を生成するための方法、及び前記方法を実施するための装置

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