JPS5081475A - - Google Patents

Info

Publication number
JPS5081475A
JPS5081475A JP48131074A JP13107473A JPS5081475A JP S5081475 A JPS5081475 A JP S5081475A JP 48131074 A JP48131074 A JP 48131074A JP 13107473 A JP13107473 A JP 13107473A JP S5081475 A JPS5081475 A JP S5081475A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48131074A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48131074A priority Critical patent/JPS5081475A/ja
Publication of JPS5081475A publication Critical patent/JPS5081475A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP48131074A 1973-11-19 1973-11-19 Pending JPS5081475A (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48131074A JPS5081475A (enrdf_load_stackoverflow) 1973-11-19 1973-11-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48131074A JPS5081475A (enrdf_load_stackoverflow) 1973-11-19 1973-11-19

Publications (1)

Publication Number Publication Date
JPS5081475A true JPS5081475A (enrdf_load_stackoverflow) 1975-07-02

Family

ID=15049372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48131074A Pending JPS5081475A (enrdf_load_stackoverflow) 1973-11-19 1973-11-19

Country Status (1)

Country Link
JP (1) JPS5081475A (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111151A (en) * 1979-02-20 1980-08-27 Nec Corp Integrated circuit device
JPS5731166A (en) * 1980-07-31 1982-02-19 Fujitsu Ltd Semiconductor device
JPS57106230U (enrdf_load_stackoverflow) * 1980-12-22 1982-06-30
JPS57160155A (en) * 1981-03-27 1982-10-02 Mitsubishi Electric Corp Multi-layer semiconductor integrated circuit
JPS5837947A (ja) * 1981-08-31 1983-03-05 Toshiba Corp 半導体装置
JPS5892230A (ja) * 1981-11-27 1983-06-01 Mitsubishi Electric Corp 半導体装置
JPS5892258A (ja) * 1981-11-27 1983-06-01 Mitsubishi Electric Corp 集積回路素子
JPS59143354A (ja) * 1983-02-04 1984-08-16 Mitsubishi Electric Corp 半導体集積回路装置
JP2002217357A (ja) * 2001-01-19 2002-08-02 Kyocera Corp 半導体装置
JP2015153985A (ja) * 2014-02-18 2015-08-24 株式会社デンソー 半導体パッケージ

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111151A (en) * 1979-02-20 1980-08-27 Nec Corp Integrated circuit device
JPS5731166A (en) * 1980-07-31 1982-02-19 Fujitsu Ltd Semiconductor device
JPS57106230U (enrdf_load_stackoverflow) * 1980-12-22 1982-06-30
JPS57160155A (en) * 1981-03-27 1982-10-02 Mitsubishi Electric Corp Multi-layer semiconductor integrated circuit
JPS5837947A (ja) * 1981-08-31 1983-03-05 Toshiba Corp 半導体装置
JPS5892230A (ja) * 1981-11-27 1983-06-01 Mitsubishi Electric Corp 半導体装置
JPS5892258A (ja) * 1981-11-27 1983-06-01 Mitsubishi Electric Corp 集積回路素子
JPS59143354A (ja) * 1983-02-04 1984-08-16 Mitsubishi Electric Corp 半導体集積回路装置
JP2002217357A (ja) * 2001-01-19 2002-08-02 Kyocera Corp 半導体装置
JP2015153985A (ja) * 2014-02-18 2015-08-24 株式会社デンソー 半導体パッケージ

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