JPS5075771A - - Google Patents

Info

Publication number
JPS5075771A
JPS5075771A JP49113976A JP11397674A JPS5075771A JP S5075771 A JPS5075771 A JP S5075771A JP 49113976 A JP49113976 A JP 49113976A JP 11397674 A JP11397674 A JP 11397674A JP S5075771 A JPS5075771 A JP S5075771A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49113976A
Other versions
JPS5653213B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5075771A publication Critical patent/JPS5075771A/ja
Publication of JPS5653213B2 publication Critical patent/JPS5653213B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/314—Inorganic layers
    • H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
    • H01L21/3165—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation
    • H01L21/31654—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of semiconductor materials, e.g. the body itself
    • H01L21/31658—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of semiconductor materials, e.g. the body itself by thermal oxidation, e.g. of SiGe
    • H01L21/31662—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of semiconductor materials, e.g. the body itself by thermal oxidation, e.g. of SiGe of silicon in uncombined form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
    • H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
    • H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02255—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/116—Oxidation, differential
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/141—Self-alignment coat gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Bipolar Transistors (AREA)
  • Element Separation (AREA)
  • Electrodes Of Semiconductors (AREA)
JP11397674A 1973-10-31 1974-10-04 Expired JPS5653213B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US411518A US3899372A (en) 1973-10-31 1973-10-31 Process for controlling insulating film thickness across a semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS5075771A true JPS5075771A (ja) 1975-06-21
JPS5653213B2 JPS5653213B2 (ja) 1981-12-17

Family

ID=23629264

Family Applications (2)

Application Number Title Priority Date Filing Date
JP11397674A Expired JPS5653213B2 (ja) 1973-10-31 1974-10-04
JP12074180A Granted JPS5635427A (en) 1973-10-31 1980-09-02 Method of manufacturing semiconductor device

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP12074180A Granted JPS5635427A (en) 1973-10-31 1980-09-02 Method of manufacturing semiconductor device

Country Status (6)

Country Link
US (1) US3899372A (ja)
JP (2) JPS5653213B2 (ja)
DE (1) DE2445879C2 (ja)
FR (1) FR2250199B1 (ja)
GB (1) GB1481196A (ja)
IT (1) IT1022974B (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5228276A (en) * 1975-06-30 1977-03-03 Ibm Method of producing semiconductor device
JPS5550641A (en) * 1978-10-05 1980-04-12 Nec Corp Semiconductor device
JPS5651870A (en) * 1979-10-05 1981-05-09 Oki Electric Ind Co Ltd Manufacture of complementary type mos semiconductor device
JP2010516322A (ja) * 2007-01-22 2010-05-20 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ロボット・クリーニングヘッド

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968562A (en) * 1971-11-25 1976-07-13 U.S. Philips Corporation Method of manufacturing a semiconductor device
DE2409910C3 (de) * 1974-03-01 1979-03-15 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen einer Halbleiteranordnung
JPS51114079A (en) * 1975-03-31 1976-10-07 Fujitsu Ltd Construction of semiconductor memory device
US4056825A (en) * 1975-06-30 1977-11-01 International Business Machines Corporation FET device with reduced gate overlap capacitance of source/drain and method of manufacture
US4049477A (en) * 1976-03-02 1977-09-20 Hewlett-Packard Company Method for fabricating a self-aligned metal oxide field effect transistor
DE2803431A1 (de) * 1978-01-26 1979-08-02 Siemens Ag Verfahren zur herstellung von mos-transistoren
US4151010A (en) * 1978-06-30 1979-04-24 International Business Machines Corporation Forming adjacent impurity regions in a semiconductor by oxide masking
US4304042A (en) * 1978-11-13 1981-12-08 Xerox Corporation Self-aligned MESFETs having reduced series resistance
US4492717A (en) * 1981-07-27 1985-01-08 International Business Machines Corporation Method for forming a planarized integrated circuit
DE3318213A1 (de) * 1983-05-19 1984-11-22 Deutsche Itt Industries Gmbh, 7800 Freiburg Verfahren zum herstellen eines integrierten isolierschicht-feldeffekttransistors mit zur gateelektrode selbstausgerichteten kontakten
US4635344A (en) * 1984-08-20 1987-01-13 Texas Instruments Incorporated Method of low encroachment oxide isolation of a semiconductor device
US4737828A (en) * 1986-03-17 1988-04-12 General Electric Company Method for gate electrode fabrication and symmetrical and non-symmetrical self-aligned inlay transistors made therefrom
JP2609619B2 (ja) * 1987-08-25 1997-05-14 三菱電機株式会社 半導体装置
US5817581A (en) * 1995-04-21 1998-10-06 International Business Machines Corporation Process for the creation of a thermal SiO2 layer with extremely uniform layer thickness
US6214127B1 (en) 1998-02-04 2001-04-10 Micron Technology, Inc. Methods of processing electronic device workpieces and methods of positioning electronic device workpieces within a workpiece carrier
US6440382B1 (en) * 1999-08-31 2002-08-27 Micron Technology, Inc. Method for producing water for use in manufacturing semiconductors
CN102034706B (zh) * 2009-09-29 2012-03-21 上海华虹Nec电子有限公司 控制硅锗合金刻面生长效果的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1103542A (en) * 1963-08-23 1968-02-14 Plessey Uk Ltd Improvements in or relating to semiconductor devices
US3473093A (en) * 1965-08-18 1969-10-14 Ibm Semiconductor device having compensated barrier zones between n-p junctions
US3534234A (en) * 1966-12-15 1970-10-13 Texas Instruments Inc Modified planar process for making semiconductor devices having ultrafine mesa type geometry
US3756876A (en) * 1970-10-27 1973-09-04 Cogar Corp Fabrication process for field effect and bipolar transistor devices
JPS5415663B2 (ja) * 1971-12-29 1979-06-16

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PHILIPS RES. REPTS#V25=1970 *
PHILIPS RES. REPTS#V26=1971 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5228276A (en) * 1975-06-30 1977-03-03 Ibm Method of producing semiconductor device
JPS5550641A (en) * 1978-10-05 1980-04-12 Nec Corp Semiconductor device
JPS5651870A (en) * 1979-10-05 1981-05-09 Oki Electric Ind Co Ltd Manufacture of complementary type mos semiconductor device
JP2010516322A (ja) * 2007-01-22 2010-05-20 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ロボット・クリーニングヘッド

Also Published As

Publication number Publication date
FR2250199B1 (ja) 1978-12-29
US3899372A (en) 1975-08-12
JPS5635427A (en) 1981-04-08
JPS5745059B2 (ja) 1982-09-25
GB1481196A (en) 1977-07-27
IT1022974B (it) 1978-04-20
DE2445879C2 (de) 1982-06-09
JPS5653213B2 (ja) 1981-12-17
DE2445879A1 (de) 1975-05-07
FR2250199A1 (ja) 1975-05-30

Similar Documents

Publication Publication Date Title
AR201758A1 (ja)
AU476761B2 (ja)
AU465372B2 (ja)
AR201235Q (ja)
AR201231Q (ja)
AU474593B2 (ja)
AU474511B2 (ja)
AU474838B2 (ja)
AU465453B2 (ja)
AU465434B2 (ja)
AU471343B2 (ja)
AU450229B2 (ja)
AU476714B2 (ja)
AR201229Q (ja)
AU466283B2 (ja)
AU476696B2 (ja)
AU472848B2 (ja)
AR199451A1 (ja)
AU477823B2 (ja)
AU461342B2 (ja)
AU471461B2 (ja)
AR200256A1 (ja)
AU476873B1 (ja)
AR210729A1 (ja)
AU477824B2 (ja)