JPS5060772A - - Google Patents
Info
- Publication number
- JPS5060772A JPS5060772A JP10993873A JP10993873A JPS5060772A JP S5060772 A JPS5060772 A JP S5060772A JP 10993873 A JP10993873 A JP 10993873A JP 10993873 A JP10993873 A JP 10993873A JP S5060772 A JPS5060772 A JP S5060772A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10993873A JPS5434142B2 (cs) | 1973-09-29 | 1973-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10993873A JPS5434142B2 (cs) | 1973-09-29 | 1973-09-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5060772A true JPS5060772A (cs) | 1975-05-24 |
| JPS5434142B2 JPS5434142B2 (cs) | 1979-10-25 |
Family
ID=14522902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10993873A Expired JPS5434142B2 (cs) | 1973-09-29 | 1973-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5434142B2 (cs) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01243491A (ja) * | 1988-03-24 | 1989-09-28 | Hitachi Chem Co Ltd | 片面銅張積層板の製造方法 |
| JPH01287989A (ja) * | 1988-05-14 | 1989-11-20 | Matsushita Electric Works Ltd | プリントの配線板の製造方法 |
| JPH0233998A (ja) * | 1988-06-29 | 1990-02-05 | Internatl Business Mach Corp <Ibm> | 回路板のためのコアを処理する方法 |
| US5286330A (en) * | 1991-05-13 | 1994-02-15 | Sumitomo Bakelite Company Limited | Method of producing copper-clad laminated board |
| JP2009253219A (ja) * | 2008-04-10 | 2009-10-29 | Denka Agsp Kk | 配線基板の製造方法 |
| TWI460076B (zh) * | 2010-10-01 | 2014-11-11 | Elite Material Co Ltd | A substrate manufacturing method and a structure for simplifying the process |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5505321A (en) * | 1994-12-05 | 1996-04-09 | Teledyne Industries, Inc. | Fabrication multilayer combined rigid/flex printed circuit board |
-
1973
- 1973-09-29 JP JP10993873A patent/JPS5434142B2/ja not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01243491A (ja) * | 1988-03-24 | 1989-09-28 | Hitachi Chem Co Ltd | 片面銅張積層板の製造方法 |
| JPH01287989A (ja) * | 1988-05-14 | 1989-11-20 | Matsushita Electric Works Ltd | プリントの配線板の製造方法 |
| JPH0233998A (ja) * | 1988-06-29 | 1990-02-05 | Internatl Business Mach Corp <Ibm> | 回路板のためのコアを処理する方法 |
| US5286330A (en) * | 1991-05-13 | 1994-02-15 | Sumitomo Bakelite Company Limited | Method of producing copper-clad laminated board |
| JP2009253219A (ja) * | 2008-04-10 | 2009-10-29 | Denka Agsp Kk | 配線基板の製造方法 |
| TWI460076B (zh) * | 2010-10-01 | 2014-11-11 | Elite Material Co Ltd | A substrate manufacturing method and a structure for simplifying the process |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5434142B2 (cs) | 1979-10-25 |