JPS5434142B2 - - Google Patents

Info

Publication number
JPS5434142B2
JPS5434142B2 JP10993873A JP10993873A JPS5434142B2 JP S5434142 B2 JPS5434142 B2 JP S5434142B2 JP 10993873 A JP10993873 A JP 10993873A JP 10993873 A JP10993873 A JP 10993873A JP S5434142 B2 JPS5434142 B2 JP S5434142B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10993873A
Other languages
Japanese (ja)
Other versions
JPS5060772A (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10993873A priority Critical patent/JPS5434142B2/ja
Publication of JPS5060772A publication Critical patent/JPS5060772A/ja
Publication of JPS5434142B2 publication Critical patent/JPS5434142B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP10993873A 1973-09-29 1973-09-29 Expired JPS5434142B2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10993873A JPS5434142B2 (cs) 1973-09-29 1973-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10993873A JPS5434142B2 (cs) 1973-09-29 1973-09-29

Publications (2)

Publication Number Publication Date
JPS5060772A JPS5060772A (cs) 1975-05-24
JPS5434142B2 true JPS5434142B2 (cs) 1979-10-25

Family

ID=14522902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10993873A Expired JPS5434142B2 (cs) 1973-09-29 1973-09-29

Country Status (1)

Country Link
JP (1) JPS5434142B2 (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996018284A1 (en) * 1994-12-05 1996-06-13 Teledyne Industries, Inc. Fabrication multilayer combined rigid/flex printed circuit board

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2561692B2 (ja) * 1988-03-24 1996-12-11 日立化成工業株式会社 片面プリント配線板の製造方法
JPH01287989A (ja) * 1988-05-14 1989-11-20 Matsushita Electric Works Ltd プリントの配線板の製造方法
US4918812A (en) * 1988-06-29 1990-04-24 International Business Machines Corporation Processing of cores for circuit boards or cards
JP3029487B2 (ja) * 1991-05-13 2000-04-04 住友ベークライト株式会社 銅張積層板の製造方法
JP2009253219A (ja) * 2008-04-10 2009-10-29 Denka Agsp Kk 配線基板の製造方法
TWI460076B (zh) * 2010-10-01 2014-11-11 Elite Material Co Ltd A substrate manufacturing method and a structure for simplifying the process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996018284A1 (en) * 1994-12-05 1996-06-13 Teledyne Industries, Inc. Fabrication multilayer combined rigid/flex printed circuit board

Also Published As

Publication number Publication date
JPS5060772A (cs) 1975-05-24

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