JPS5057381A - - Google Patents
Info
- Publication number
- JPS5057381A JPS5057381A JP10630673A JP10630673A JPS5057381A JP S5057381 A JPS5057381 A JP S5057381A JP 10630673 A JP10630673 A JP 10630673A JP 10630673 A JP10630673 A JP 10630673A JP S5057381 A JPS5057381 A JP S5057381A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10630673A JPS5057381A (en) | 1973-09-19 | 1973-09-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10630673A JPS5057381A (en) | 1973-09-19 | 1973-09-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5057381A true JPS5057381A (en) | 1975-05-19 |
Family
ID=14430305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10630673A Pending JPS5057381A (en) | 1973-09-19 | 1973-09-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5057381A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50159255A (en) * | 1974-06-11 | 1975-12-23 | ||
JPS5199972A (en) * | 1975-02-28 | 1976-09-03 | Nippon Electric Co | HANDOTA ISOCHI |
JPS5216971A (en) * | 1975-07-30 | 1977-02-08 | Hitachi Ltd | Base plate heat treatment method and wafer for semiconductor |
JPS55153347A (en) * | 1979-05-18 | 1980-11-29 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Manufacture of semiconductor device |
JPS5685838A (en) * | 1979-12-15 | 1981-07-13 | Toshiba Corp | Substrate for semiconductor device and manufacture of the same |
JPS57153445A (en) * | 1981-03-17 | 1982-09-22 | Nec Corp | Sos semiconductor substrate |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3655439A (en) * | 1968-06-19 | 1972-04-11 | Siemens Ag | Method of producing thin layer components with at least one insulating intermediate layer |
-
1973
- 1973-09-19 JP JP10630673A patent/JPS5057381A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3655439A (en) * | 1968-06-19 | 1972-04-11 | Siemens Ag | Method of producing thin layer components with at least one insulating intermediate layer |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50159255A (en) * | 1974-06-11 | 1975-12-23 | ||
JPS5615578B2 (en) * | 1974-06-11 | 1981-04-10 | ||
JPS5199972A (en) * | 1975-02-28 | 1976-09-03 | Nippon Electric Co | HANDOTA ISOCHI |
JPS5216971A (en) * | 1975-07-30 | 1977-02-08 | Hitachi Ltd | Base plate heat treatment method and wafer for semiconductor |
JPS55153347A (en) * | 1979-05-18 | 1980-11-29 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Manufacture of semiconductor device |
JPS5685838A (en) * | 1979-12-15 | 1981-07-13 | Toshiba Corp | Substrate for semiconductor device and manufacture of the same |
JPS57153445A (en) * | 1981-03-17 | 1982-09-22 | Nec Corp | Sos semiconductor substrate |