JPS5057381A - - Google Patents

Info

Publication number
JPS5057381A
JPS5057381A JP10630673A JP10630673A JPS5057381A JP S5057381 A JPS5057381 A JP S5057381A JP 10630673 A JP10630673 A JP 10630673A JP 10630673 A JP10630673 A JP 10630673A JP S5057381 A JPS5057381 A JP S5057381A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10630673A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10630673A priority Critical patent/JPS5057381A/ja
Publication of JPS5057381A publication Critical patent/JPS5057381A/ja
Pending legal-status Critical Current

Links

JP10630673A 1973-09-19 1973-09-19 Pending JPS5057381A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10630673A JPS5057381A (en) 1973-09-19 1973-09-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10630673A JPS5057381A (en) 1973-09-19 1973-09-19

Publications (1)

Publication Number Publication Date
JPS5057381A true JPS5057381A (en) 1975-05-19

Family

ID=14430305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10630673A Pending JPS5057381A (en) 1973-09-19 1973-09-19

Country Status (1)

Country Link
JP (1) JPS5057381A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50159255A (en) * 1974-06-11 1975-12-23
JPS5199972A (en) * 1975-02-28 1976-09-03 Nippon Electric Co HANDOTA ISOCHI
JPS5216971A (en) * 1975-07-30 1977-02-08 Hitachi Ltd Base plate heat treatment method and wafer for semiconductor
JPS55153347A (en) * 1979-05-18 1980-11-29 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacture of semiconductor device
JPS5685838A (en) * 1979-12-15 1981-07-13 Toshiba Corp Substrate for semiconductor device and manufacture of the same
JPS57153445A (en) * 1981-03-17 1982-09-22 Nec Corp Sos semiconductor substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3655439A (en) * 1968-06-19 1972-04-11 Siemens Ag Method of producing thin layer components with at least one insulating intermediate layer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3655439A (en) * 1968-06-19 1972-04-11 Siemens Ag Method of producing thin layer components with at least one insulating intermediate layer

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50159255A (en) * 1974-06-11 1975-12-23
JPS5615578B2 (en) * 1974-06-11 1981-04-10
JPS5199972A (en) * 1975-02-28 1976-09-03 Nippon Electric Co HANDOTA ISOCHI
JPS5216971A (en) * 1975-07-30 1977-02-08 Hitachi Ltd Base plate heat treatment method and wafer for semiconductor
JPS55153347A (en) * 1979-05-18 1980-11-29 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacture of semiconductor device
JPS5685838A (en) * 1979-12-15 1981-07-13 Toshiba Corp Substrate for semiconductor device and manufacture of the same
JPS57153445A (en) * 1981-03-17 1982-09-22 Nec Corp Sos semiconductor substrate

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