JPS5050667A - - Google Patents

Info

Publication number
JPS5050667A
JPS5050667A JP10078273A JP10078273A JPS5050667A JP S5050667 A JPS5050667 A JP S5050667A JP 10078273 A JP10078273 A JP 10078273A JP 10078273 A JP10078273 A JP 10078273A JP S5050667 A JPS5050667 A JP S5050667A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10078273A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10078273A priority Critical patent/JPS5050667A/ja
Priority to DE19742442780 priority patent/DE2442780B2/de
Publication of JPS5050667A publication Critical patent/JPS5050667A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Reinforced Plastic Materials (AREA)
JP10078273A 1973-09-08 1973-09-08 Pending JPS5050667A (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10078273A JPS5050667A (de) 1973-09-08 1973-09-08
DE19742442780 DE2442780B2 (de) 1973-09-08 1974-09-06 Verfahren zur Herstellung von gedruckten Schaltungs-Mehrschichtenplatten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10078273A JPS5050667A (de) 1973-09-08 1973-09-08

Publications (1)

Publication Number Publication Date
JPS5050667A true JPS5050667A (de) 1975-05-07

Family

ID=14283020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10078273A Pending JPS5050667A (de) 1973-09-08 1973-09-08

Country Status (2)

Country Link
JP (1) JPS5050667A (de)
DE (1) DE2442780B2 (de)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50145860A (de) * 1974-05-14 1975-11-22
JPS62104196A (ja) * 1985-10-31 1987-05-14 日東紡績株式会社 多層用プリント配線基板
JPS6390531A (ja) * 1986-10-03 1988-04-21 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPS6429799U (de) * 1987-08-17 1989-02-22
JPH01189998A (ja) * 1988-01-26 1989-07-31 Matsushita Electric Works Ltd Ｌｃｒ多層板
JPH01189997A (ja) * 1988-01-26 1989-07-31 Matsushita Electric Works Ltd 多層板
JPH02281692A (ja) * 1989-04-21 1990-11-19 Matsushita Electric Works Ltd 多層配線板

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4036801A1 (de) * 1990-11-19 1992-05-21 Huels Troisdorf Verfahren zur kontinuierlichen herstellung von kupferkaschierten basismaterialtafeln
DE4036802A1 (de) * 1990-11-19 1992-05-21 Huels Troisdorf Verfahren zur herstellung von kupferkaschierten basismaterialtafeln

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50145860A (de) * 1974-05-14 1975-11-22
JPS5517520B2 (de) * 1974-05-14 1980-05-12
JPS62104196A (ja) * 1985-10-31 1987-05-14 日東紡績株式会社 多層用プリント配線基板
JPH0243357B2 (de) * 1985-10-31 1990-09-28
JPS6390531A (ja) * 1986-10-03 1988-04-21 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPS6429799U (de) * 1987-08-17 1989-02-22
JPH01189998A (ja) * 1988-01-26 1989-07-31 Matsushita Electric Works Ltd Ｌｃｒ多層板
JPH01189997A (ja) * 1988-01-26 1989-07-31 Matsushita Electric Works Ltd 多層板
JPH02281692A (ja) * 1989-04-21 1990-11-19 Matsushita Electric Works Ltd 多層配線板

Also Published As

Publication number Publication date
DE2442780A1 (de) 1975-03-13
DE2442780B2 (de) 1978-08-17

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