JPS504554B1 - - Google Patents
Info
- Publication number
- JPS504554B1 JPS504554B1 JP45106701A JP10670170A JPS504554B1 JP S504554 B1 JPS504554 B1 JP S504554B1 JP 45106701 A JP45106701 A JP 45106701A JP 10670170 A JP10670170 A JP 10670170A JP S504554 B1 JPS504554 B1 JP S504554B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US88425869A | 1969-12-11 | 1969-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS504554B1 true JPS504554B1 (enExample) | 1975-02-20 |
Family
ID=25384280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45106701A Pending JPS504554B1 (enExample) | 1969-12-11 | 1970-12-02 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3586917A (enExample) |
| JP (1) | JPS504554B1 (enExample) |
| BE (1) | BE760031A (enExample) |
| DE (1) | DE2061179A1 (enExample) |
| FR (1) | FR2069787A5 (enExample) |
| GB (1) | GB1302920A (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2062666A1 (de) * | 1970-12-19 | 1972-07-06 | Bbc Brown Boveri & Cie | Aus Bausteinen aufgebaute Stromrichteranlage |
| US3793603A (en) * | 1972-07-17 | 1974-02-19 | Ferraz & Cie Lucien | Fuse cartridges |
| US4001711A (en) * | 1974-08-05 | 1977-01-04 | Motorola, Inc. | Radio frequency power amplifier constructed as hybrid microelectronic unit |
| US4266089A (en) * | 1978-09-14 | 1981-05-05 | Isotronics, Incorporated | All metal flat package having excellent heat transfer characteristics |
| US4266090A (en) * | 1978-09-14 | 1981-05-05 | Isotronics, Incorporated | All metal flat package |
| FR2470445A1 (fr) * | 1979-11-21 | 1981-05-29 | Thomson Csf | Dispositif de mise en parallele de transistors bipolaires de puissance en tres haute frequence et amplificateur utilisant ce dispositif |
| JPS5874399U (ja) * | 1981-11-13 | 1983-05-19 | アルプス電気株式会社 | 電気部品の取付構造 |
| FR2522203A1 (fr) * | 1982-02-24 | 1983-08-26 | Sintra Alcatel Sa | Traversee electrique de boitier de circuit hybride et connecteurs complementaires |
| FR2564243B1 (fr) * | 1984-05-11 | 1987-02-20 | Europ Composants Electron | Boitier a dissipation thermique d'encapsulation de circuits electriques |
| US4562512A (en) * | 1984-07-23 | 1985-12-31 | Sundstrand Corporation | Multiple semiconductor containing package having a heat sink core |
| DE3506172A1 (de) * | 1985-02-22 | 1986-09-04 | Telefunken electronic GmbH, 7100 Heilbronn | Bauelementgehaeuse |
| DE3766384D1 (de) * | 1986-02-25 | 1991-01-10 | Nec Corp | Fluessigkeitskuehlungssystem fuer integrierte schaltungschips. |
| US4805420A (en) * | 1987-06-22 | 1989-02-21 | Ncr Corporation | Cryogenic vessel for cooling electronic components |
| US5008492A (en) * | 1989-10-20 | 1991-04-16 | Hughes Aircraft Company | High current feedthrough package |
| US5131272A (en) * | 1990-03-15 | 1992-07-21 | Harris Corporation | Portable deployable automatic test system |
| US5099393A (en) * | 1991-03-25 | 1992-03-24 | International Business Machines Corporation | Electronic package for high density applications |
| US5059129A (en) * | 1991-03-25 | 1991-10-22 | International Business Machines Corporation | Connector assembly including bilayered elastomeric member |
| US5521427A (en) * | 1992-12-18 | 1996-05-28 | Lsi Logic Corporation | Printed wiring board mounted semiconductor device having leadframe with alignment feature |
| US5465481A (en) * | 1993-10-04 | 1995-11-14 | Motorola, Inc. | Method for fabricating a semiconductor package |
| USD356995S (en) | 1994-04-12 | 1995-04-04 | Vlt Corporation | Configurable, modular power supply |
| JPH08136105A (ja) * | 1994-11-11 | 1996-05-31 | Fanuc Ltd | インバータ用筐体 |
| DE19511755C1 (de) * | 1995-03-30 | 1996-08-22 | Framatome Connectors Int | Multiplex-Steuerung von Komponenten bzw. Untersystemen in Kraftfahrzeugen |
| US5736787A (en) * | 1996-07-11 | 1998-04-07 | Larimer; William R. | Transistor package structured to provide heat dissipation enabling use of silicon carbide transistors and other high power semiconductor devices |
| US6270262B1 (en) | 1999-11-10 | 2001-08-07 | Harris Corporation | Optical interconnect module |
| US6404628B1 (en) * | 2000-07-21 | 2002-06-11 | General Motors Corporation | Integrated power electronics cooling housing |
| DE102008007346A1 (de) * | 2008-02-04 | 2009-08-06 | Robert Bosch Gmbh | Metallisches Gehäuseteil und Verfahren zur Herstellung des Gehäuseteiles |
| US20150252666A1 (en) | 2014-03-05 | 2015-09-10 | Baker Hughes Incorporated | Packaging for electronics in downhole assemblies |
| JP6450612B2 (ja) * | 2015-03-11 | 2019-01-09 | 日本特殊陶業株式会社 | 電子部品装置およびその製造方法 |
| FR3087617B1 (fr) | 2018-10-17 | 2023-10-27 | Valeo Systemes De Controle Moteur | Equipement electronique pour vehicule |
-
0
- BE BE760031D patent/BE760031A/xx unknown
-
1969
- 1969-12-11 US US884258A patent/US3586917A/en not_active Expired - Lifetime
-
1970
- 1970-11-20 FR FR7041809A patent/FR2069787A5/fr not_active Expired
- 1970-12-02 JP JP45106701A patent/JPS504554B1/ja active Pending
- 1970-12-04 GB GB5784170A patent/GB1302920A/en not_active Expired
- 1970-12-11 DE DE19702061179 patent/DE2061179A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US3586917A (en) | 1971-06-22 |
| BE760031A (fr) | 1971-05-17 |
| GB1302920A (enExample) | 1973-01-10 |
| FR2069787A5 (enExample) | 1971-09-03 |
| DE2061179A1 (de) | 1971-06-16 |