JPS5036599A - - Google Patents
Info
- Publication number
- JPS5036599A JPS5036599A JP8684173A JP8684173A JPS5036599A JP S5036599 A JPS5036599 A JP S5036599A JP 8684173 A JP8684173 A JP 8684173A JP 8684173 A JP8684173 A JP 8684173A JP S5036599 A JPS5036599 A JP S5036599A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Epoxy Resins (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8684173A JPS5036599A (ja) | 1973-08-03 | 1973-08-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8684173A JPS5036599A (ja) | 1973-08-03 | 1973-08-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5036599A true JPS5036599A (ja) | 1975-04-05 |
Family
ID=13898027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8684173A Pending JPS5036599A (ja) | 1973-08-03 | 1973-08-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5036599A (ja) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4832591A (ja) * | 1971-08-30 | 1973-04-28 | ||
| JPS5749621A (en) * | 1980-09-09 | 1982-03-23 | Hitachi Ltd | Preparation of heat-resistant resin |
| JPS57197892A (en) * | 1981-05-29 | 1982-12-04 | Mitsubishi Gas Chemical Co | Copper-coated laminated plate for bonding chip |
| JPS60130666A (ja) * | 1983-12-17 | 1985-07-12 | Toshiba Chem Corp | フレキシブル印刷配線板用接着剤組成物 |
| JPH01125224A (ja) * | 1987-07-06 | 1989-05-17 | Matsushita Electric Works Ltd | 電気絶縁用積層板及び電子部品封止材料 |
| JPH02311550A (ja) * | 1989-05-25 | 1990-12-27 | Mitsubishi Electric Corp | 積層板用樹脂組成物 |
| JP2011195476A (ja) * | 2010-03-18 | 2011-10-06 | Hitachi Chem Co Ltd | ビスマレイミド誘導体とその製造方法、並びに熱硬化性樹脂組成物、プリプレグ及び積層板 |
| JP2018059100A (ja) * | 2016-10-05 | 2018-04-12 | 明和化成株式会社 | マレイミド樹脂及びその製造方法、マレイミド樹脂組成物及び硬化物 |
-
1973
- 1973-08-03 JP JP8684173A patent/JPS5036599A/ja active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4832591A (ja) * | 1971-08-30 | 1973-04-28 | ||
| JPS5749621A (en) * | 1980-09-09 | 1982-03-23 | Hitachi Ltd | Preparation of heat-resistant resin |
| JPS6312898B2 (ja) * | 1980-09-09 | 1988-03-23 | Hitachi Ltd | |
| JPS57197892A (en) * | 1981-05-29 | 1982-12-04 | Mitsubishi Gas Chemical Co | Copper-coated laminated plate for bonding chip |
| JPH0245348B2 (ja) * | 1981-05-29 | 1990-10-09 | Mitsubishi Gas Chemical Co | |
| JPS60130666A (ja) * | 1983-12-17 | 1985-07-12 | Toshiba Chem Corp | フレキシブル印刷配線板用接着剤組成物 |
| JPH0376351B2 (ja) * | 1983-12-17 | 1991-12-05 | Toshiba Chem Prod | |
| JPH01125224A (ja) * | 1987-07-06 | 1989-05-17 | Matsushita Electric Works Ltd | 電気絶縁用積層板及び電子部品封止材料 |
| JPH0562591B2 (ja) * | 1987-07-06 | 1993-09-08 | Matsushita Electric Works Ltd | |
| JPH02311550A (ja) * | 1989-05-25 | 1990-12-27 | Mitsubishi Electric Corp | 積層板用樹脂組成物 |
| JP2011195476A (ja) * | 2010-03-18 | 2011-10-06 | Hitachi Chem Co Ltd | ビスマレイミド誘導体とその製造方法、並びに熱硬化性樹脂組成物、プリプレグ及び積層板 |
| JP2018059100A (ja) * | 2016-10-05 | 2018-04-12 | 明和化成株式会社 | マレイミド樹脂及びその製造方法、マレイミド樹脂組成物及び硬化物 |