JPS5026292Y1 - - Google Patents

Info

Publication number
JPS5026292Y1
JPS5026292Y1 JP1968005484U JP548468U JPS5026292Y1 JP S5026292 Y1 JPS5026292 Y1 JP S5026292Y1 JP 1968005484 U JP1968005484 U JP 1968005484U JP 548468 U JP548468 U JP 548468U JP S5026292 Y1 JPS5026292 Y1 JP S5026292Y1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1968005484U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1968005484U priority Critical patent/JPS5026292Y1/ja
Priority to US792992*A priority patent/US3581166A/en
Priority to NL696901301A priority patent/NL146330B/xx
Priority to GB4479/69A priority patent/GB1191093A/en
Priority to FR696901677A priority patent/FR2000900B1/fr
Priority to DE19691904118 priority patent/DE1904118B2/de
Publication of JPS5026292Y1 publication Critical patent/JPS5026292Y1/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1968005484U 1968-01-29 1968-01-29 Expired JPS5026292Y1 (OSRAM)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP1968005484U JPS5026292Y1 (OSRAM) 1968-01-29 1968-01-29
US792992*A US3581166A (en) 1968-01-29 1969-01-22 Gold-aluminum leadout structure of a semiconductor device
NL696901301A NL146330B (nl) 1968-01-29 1969-01-27 Halfgeleiderinrichting aangebracht op een metalen plaat van een isolerend lichaam, verder voorzien van aansluitgeleiders.
GB4479/69A GB1191093A (en) 1968-01-29 1969-01-27 Improvement of the Electrode Lead-Out Structure of a Semiconductor Device
FR696901677A FR2000900B1 (OSRAM) 1968-01-29 1969-01-28
DE19691904118 DE1904118B2 (de) 1968-01-29 1969-01-28 Elektrodenanschluss fuer ein integriertes halbleiterbauelement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1968005484U JPS5026292Y1 (OSRAM) 1968-01-29 1968-01-29

Publications (1)

Publication Number Publication Date
JPS5026292Y1 true JPS5026292Y1 (OSRAM) 1975-08-06

Family

ID=11612505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1968005484U Expired JPS5026292Y1 (OSRAM) 1968-01-29 1968-01-29

Country Status (6)

Country Link
US (1) US3581166A (OSRAM)
JP (1) JPS5026292Y1 (OSRAM)
DE (1) DE1904118B2 (OSRAM)
FR (1) FR2000900B1 (OSRAM)
GB (1) GB1191093A (OSRAM)
NL (1) NL146330B (OSRAM)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3675090A (en) * 1968-11-04 1972-07-04 Energy Conversion Devices Inc Film deposited semiconductor devices
US3872583A (en) * 1972-07-10 1975-03-25 Amdahl Corp LSI chip package and method
IN148328B (OSRAM) * 1977-04-18 1981-01-17 Rca Corp
DE2809883A1 (de) * 1977-10-14 1979-04-19 Plessey Inc Anschlussleiterrahmen fuer gehaeuse von halbleiterbauelementen
US4246697A (en) 1978-04-06 1981-01-27 Motorola, Inc. Method of manufacturing RF power semiconductor package
JPS59125644A (ja) * 1982-12-29 1984-07-20 Fujitsu Ltd 半導体装置
KR960000706B1 (ko) * 1993-07-12 1996-01-11 한국전기통신공사 전력소자용 플라스틱 패키지 구조 및 그 제조방법
JPH0799368A (ja) * 1993-09-29 1995-04-11 Mitsubishi Electric Corp 光半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271635A (en) * 1963-05-06 1966-09-06 Rca Corp Semiconductor devices with silver-gold lead wires attached to aluminum contacts
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng

Also Published As

Publication number Publication date
DE1904118A1 (de) 1969-08-28
US3581166A (en) 1971-05-25
NL146330B (nl) 1975-06-16
FR2000900B1 (OSRAM) 1973-05-25
FR2000900A1 (OSRAM) 1969-09-19
DE1904118B2 (de) 1972-06-22
GB1191093A (en) 1970-05-06
NL6901301A (OSRAM) 1969-07-31

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