JPS50159693A - - Google Patents

Info

Publication number
JPS50159693A
JPS50159693A JP50050844A JP5084475A JPS50159693A JP S50159693 A JPS50159693 A JP S50159693A JP 50050844 A JP50050844 A JP 50050844A JP 5084475 A JP5084475 A JP 5084475A JP S50159693 A JPS50159693 A JP S50159693A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50050844A
Other languages
Japanese (ja)
Other versions
JPS5744035B2 (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS50159693A publication Critical patent/JPS50159693A/ja
Publication of JPS5744035B2 publication Critical patent/JPS5744035B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10W20/4484—
    • H10W90/401—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/825—Apparatus per se, device per se, or process of making or operating same
    • Y10S505/883—Housing and mounting assembly with plural diverse electrical components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49009—Dynamoelectric machine
    • Y10T29/49012—Rotor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Containers, Films, And Cooling For Superconductive Devices (AREA)
JP50050844A 1974-05-30 1975-04-28 Expired JPS5744035B2 (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/474,639 US3949274A (en) 1974-05-30 1974-05-30 Packaging and interconnection for superconductive circuitry

Publications (2)

Publication Number Publication Date
JPS50159693A true JPS50159693A (cg-RX-API-DMAC10.html) 1975-12-24
JPS5744035B2 JPS5744035B2 (cg-RX-API-DMAC10.html) 1982-09-18

Family

ID=23884405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50050844A Expired JPS5744035B2 (cg-RX-API-DMAC10.html) 1974-05-30 1975-04-28

Country Status (7)

Country Link
US (1) US3949274A (cg-RX-API-DMAC10.html)
JP (1) JPS5744035B2 (cg-RX-API-DMAC10.html)
CA (1) CA1024660A (cg-RX-API-DMAC10.html)
DE (1) DE2459532C2 (cg-RX-API-DMAC10.html)
FR (1) FR2273377B1 (cg-RX-API-DMAC10.html)
GB (1) GB1500313A (cg-RX-API-DMAC10.html)
IT (1) IT1034377B (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58129616A (ja) * 1982-01-29 1983-08-02 Hitachi Ltd 低温動作形計算機

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4216523A (en) * 1977-12-02 1980-08-05 Rca Corporation Modular printed circuit board
US4266282A (en) * 1979-03-12 1981-05-05 International Business Machines Corporation Vertical semiconductor integrated circuit chip packaging
US4237522A (en) * 1979-06-29 1980-12-02 International Business Machines Corporation Chip package with high capacitance, stacked vlsi/power sheets extending through slots in substrate
US4502098A (en) * 1981-02-10 1985-02-26 Brown David F Circuit assembly
GB2123216B (en) * 1982-06-19 1985-12-18 Ferranti Plc Electrical circuit assemblies
DE3321321A1 (de) * 1982-06-19 1983-12-22 Ferranti plc, Gatley, Cheadle, Cheshire Elektrische schaltungsanordnung
US4528530A (en) * 1982-09-24 1985-07-09 International Business Machines Corporation Low temperature electronic package having a superconductive interposer for interconnecting strip type circuits
DE8428437U1 (de) * 1984-09-27 1986-01-30 Robert Bosch Gmbh, 7000 Stuttgart Schaltungshybrid für elektronische Schaltungen
US5031072A (en) * 1986-08-01 1991-07-09 Texas Instruments Incorporated Baseboard for orthogonal chip mount
US4922378A (en) * 1986-08-01 1990-05-01 Texas Instruments Incorporated Baseboard for orthogonal chip mount
DE3640072A1 (de) * 1986-11-24 1988-06-01 Rolf Tiedeken Elektronisches datenspeicherorgan, welches eine anzahl von statischen ram-chips aufweist
DE3703364A1 (de) * 1987-02-04 1988-08-18 Atron Electronic Gmbh Anordnung einer leiterplattenbestueckung
DE3735455A1 (de) * 1987-03-18 1988-09-29 Telefonbau & Normalzeit Gmbh Elektrische bauelemente
GB2211662B (en) * 1988-01-16 1991-01-16 Int Computers Ltd Multichip carriers
US5025306A (en) * 1988-08-09 1991-06-18 Texas Instruments Incorporated Assembly of semiconductor chips
US4992908A (en) * 1989-07-24 1991-02-12 Grumman Aerospace Corporation Integrated circuit module
US5317477A (en) * 1992-06-30 1994-05-31 International Business Machines Corporation High density interconnection assembly
EP0586888B1 (en) * 1992-08-05 2001-07-18 Fujitsu Limited Three-dimensional multichip module
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US6205654B1 (en) * 1992-12-11 2001-03-27 Staktek Group L.P. Method of manufacturing a surface mount package
US5514907A (en) * 1995-03-21 1996-05-07 Simple Technology Incorporated Apparatus for stacking semiconductor chips
US5950303A (en) * 1998-04-03 1999-09-14 The United States Of America As Represented By The Secretary Of The Air Force Method and fixturing to perform two side laminations of stacked substrates forming 3-D modules
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6608763B1 (en) 2000-09-15 2003-08-19 Staktek Group L.P. Stacking system and method
US20020085796A1 (en) * 2001-01-04 2002-07-04 Opticnet, Inc. Self-aligned electrical interconnect for two assembled perpendicular semiconductor chips
US6462408B1 (en) 2001-03-27 2002-10-08 Staktek Group, L.P. Contact member stacking system and method
DE10255848B4 (de) * 2002-11-29 2008-04-30 Qimonda Ag Halbleiterbauelement und Verfahren zu seiner Herstellung sowie Hauptplatine mit diesem Halbleiterbauelement
US7005584B2 (en) * 2004-02-13 2006-02-28 Honeywell International Inc. Compact navigation device assembly
US7298625B1 (en) * 2007-01-17 2007-11-20 Inventec Corporation Expansion structure of memory module slot
US8692366B2 (en) 2010-09-30 2014-04-08 Analog Device, Inc. Apparatus and method for microelectromechanical systems device packaging
US8836132B2 (en) 2012-04-03 2014-09-16 Analog Devices, Inc. Vertical mount package and wafer level packaging therefor
US9475694B2 (en) 2013-01-14 2016-10-25 Analog Devices Global Two-axis vertical mount package assembly
US10825821B2 (en) 2015-12-18 2020-11-03 International Business Machines Corporation Cooling and power delivery for a wafer level computing board
US11647678B2 (en) 2016-08-23 2023-05-09 Analog Devices International Unlimited Company Compact integrated device packages
US10629574B2 (en) 2016-10-27 2020-04-21 Analog Devices, Inc. Compact integrated device packages
US10697800B2 (en) 2016-11-04 2020-06-30 Analog Devices Global Multi-dimensional measurement using magnetic sensors and related systems, methods, and integrated circuits
US11628275B2 (en) 2018-01-31 2023-04-18 Analog Devices, Inc. Electronic devices

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2904768A (en) * 1955-04-13 1959-09-15 Hughes Aircraft Co Circuit connector for printed circuit boards
US3340440A (en) * 1966-03-15 1967-09-05 Jerry B Minter Multi-circuit separable connector for printed circuit boards and the like
US3406368A (en) * 1966-05-16 1968-10-15 Solitron Devices Interconnection system
US3614541A (en) * 1969-04-08 1971-10-19 North American Rockwell Package for an electronic assembly
US3671812A (en) * 1970-07-01 1972-06-20 Martin Marietta Corp High density packaging of electronic components in three-dimensional modules
DE2330161A1 (de) * 1973-06-08 1974-12-19 Minnesota Mining & Mfg Verbesserte schaltkreise und verfahren zu deren herstellung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58129616A (ja) * 1982-01-29 1983-08-02 Hitachi Ltd 低温動作形計算機

Also Published As

Publication number Publication date
FR2273377B1 (cg-RX-API-DMAC10.html) 1978-05-19
FR2273377A1 (cg-RX-API-DMAC10.html) 1975-12-26
CA1024660A (en) 1978-01-17
JPS5744035B2 (cg-RX-API-DMAC10.html) 1982-09-18
US3949274A (en) 1976-04-06
IT1034377B (it) 1979-09-10
GB1500313A (en) 1978-02-08
DE2459532C2 (de) 1985-03-14
DE2459532A1 (de) 1975-12-11

Similar Documents

Publication Publication Date Title
FR2273377B1 (cg-RX-API-DMAC10.html)
FR2257496B3 (cg-RX-API-DMAC10.html)
FI750444A7 (cg-RX-API-DMAC10.html)
DK91075A (cg-RX-API-DMAC10.html)
FR2257571A1 (cg-RX-API-DMAC10.html)
FI751503A7 (cg-RX-API-DMAC10.html)
DK90975A (cg-RX-API-DMAC10.html)
DK532074A (cg-RX-API-DMAC10.html)
AR203034Q (cg-RX-API-DMAC10.html)
AR198841Q (cg-RX-API-DMAC10.html)
CS172070B1 (cg-RX-API-DMAC10.html)
AU479769A (cg-RX-API-DMAC10.html)
BG19837A1 (cg-RX-API-DMAC10.html)
DD116907A5 (cg-RX-API-DMAC10.html)
DD115322A1 (cg-RX-API-DMAC10.html)
AU479931A (cg-RX-API-DMAC10.html)
AU480264A (cg-RX-API-DMAC10.html)
AU479802A (cg-RX-API-DMAC10.html)
BG19643A1 (cg-RX-API-DMAC10.html)
CH605570A5 (cg-RX-API-DMAC10.html)
AU479777A (cg-RX-API-DMAC10.html)
BG19638A1 (cg-RX-API-DMAC10.html)
AU480465A (cg-RX-API-DMAC10.html)
CH586605A5 (cg-RX-API-DMAC10.html)
CH575039B5 (cg-RX-API-DMAC10.html)