JPS50143031A - - Google Patents

Info

Publication number
JPS50143031A
JPS50143031A JP50042135A JP4213575A JPS50143031A JP S50143031 A JPS50143031 A JP S50143031A JP 50042135 A JP50042135 A JP 50042135A JP 4213575 A JP4213575 A JP 4213575A JP S50143031 A JPS50143031 A JP S50143031A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50042135A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS50143031A publication Critical patent/JPS50143031A/ja
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
JP50042135A 1974-04-08 1975-04-07 Pending JPS50143031A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2417031A DE2417031A1 (de) 1974-04-08 1974-04-08 Thyristorsaeule

Publications (1)

Publication Number Publication Date
JPS50143031A true JPS50143031A (ja) 1975-11-18

Family

ID=5912457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50042135A Pending JPS50143031A (ja) 1974-04-08 1975-04-07

Country Status (5)

Country Link
US (1) US4023616A (ja)
JP (1) JPS50143031A (ja)
CH (1) CH576204A5 (ja)
DE (1) DE2417031A1 (ja)
SE (1) SE7503836L (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3307703A1 (de) * 1983-03-04 1984-09-06 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Dosen-siedekuehleinrichtung fuer leistungshalbleiterelemente
US4559580A (en) * 1983-11-04 1985-12-17 Sundstrand Corporation Semiconductor package with internal heat exchanger
DE3444173C2 (de) * 1984-12-04 1994-05-19 Bbc Brown Boveri & Cie Siedekühleinrichtung für Leistungshalbleiterelemente
FR2588072B1 (fr) * 1985-09-30 1987-12-11 Jeumont Schneider Installation de dissipation pour elements semi-conducteurs de puissance
US5283464A (en) * 1989-06-08 1994-02-01 The Furukawa Electric Co., Ltd. Electrically insulated heat pipe type cooling apparatus for semiconductor
US5043797A (en) * 1990-04-03 1991-08-27 General Electric Company Cooling header connection for a thyristor stack
JP2928603B2 (ja) * 1990-07-30 1999-08-03 キヤノン株式会社 Ｘ線露光装置用ウエハ冷却装置
DE59303632D1 (de) * 1992-08-04 1996-10-10 Abb Patent Gmbh Spannverband mit Halbleiterzellen und Kühldosen
FR2746177B1 (fr) * 1996-03-14 2000-04-07 Dispositif de refroidissement utilisant un refrigerant en ebullition et se condensant
FR2748888B1 (fr) * 1996-05-14 1998-06-19 Gec Alsthom Transport Sa Dispositif a elements semi-conducteurs de puissance
WO1998011767A1 (en) * 1996-09-16 1998-03-19 Abb Power T & D Company Inc. Solid state switching device arrangement for silicon transfer switch
US6367543B1 (en) 2000-12-11 2002-04-09 Thermal Corp. Liquid-cooled heat sink with thermal jacket
WO2003087695A1 (fr) * 2002-04-16 2003-10-23 Yoshiro Miyazaki Conduit calorique vibratoire a auto-excitation et calculateur le contenant
US7017655B2 (en) 2003-12-18 2006-03-28 Modine Manufacturing Co. Forced fluid heat sink
US20090108441A1 (en) * 2007-10-31 2009-04-30 General Electric Company Semiconductor clamp system
TWM347807U (en) * 2008-05-14 2008-12-21 Kuen Bao Electric Co Ltd Cooling system with high power thyristors
CN104917499B (zh) * 2015-06-24 2019-02-05 国家电网公司 一种110kV等级晶闸管阀体
CN104934390B (zh) * 2015-06-24 2018-07-13 国家电网公司 一种用于110kV晶闸管阀体的水冷散热装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4911870U (ja) * 1972-05-06 1974-01-31

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL208738A (ja) * 1955-07-06
GB882788A (en) * 1958-07-05 1961-11-22 Reinold Hagen Process and apparatus for manufacturing bottles and the like neck-provided articles from thermoplastic material
US3204157A (en) * 1960-08-30 1965-08-31 Welduction Corp Crystal diode heat dissipating mounting
CH498488A (de) * 1969-04-30 1970-10-31 Bbc Brown Boveri & Cie Kühleinrichtung insbesondere für Halbleiterelemente und Elektronenröhren
SE340321B (ja) * 1970-03-23 1971-11-15 Asea Ab
DE2204589A1 (de) * 1972-02-01 1973-08-16 Siemens Ag Kuehlanordnung fuer flache halbleiterbauelemente

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4911870U (ja) * 1972-05-06 1974-01-31

Also Published As

Publication number Publication date
CH576204A5 (ja) 1976-05-31
SE7503836L (sv) 1975-10-09
DE2417031A1 (de) 1975-10-16
US4023616A (en) 1977-05-17

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