CH576204A5 - - Google Patents

Info

Publication number
CH576204A5
CH576204A5 CH433975A CH433975A CH576204A5 CH 576204 A5 CH576204 A5 CH 576204A5 CH 433975 A CH433975 A CH 433975A CH 433975 A CH433975 A CH 433975A CH 576204 A5 CH576204 A5 CH 576204A5
Authority
CH
Switzerland
Application number
CH433975A
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH576204A5 publication Critical patent/CH576204A5/xx

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
CH433975A 1974-04-08 1975-04-07 CH576204A5 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2417031A DE2417031A1 (de) 1974-04-08 1974-04-08 Thyristorsaeule

Publications (1)

Publication Number Publication Date
CH576204A5 true CH576204A5 (ja) 1976-05-31

Family

ID=5912457

Family Applications (1)

Application Number Title Priority Date Filing Date
CH433975A CH576204A5 (ja) 1974-04-08 1975-04-07

Country Status (5)

Country Link
US (1) US4023616A (ja)
JP (1) JPS50143031A (ja)
CH (1) CH576204A5 (ja)
DE (1) DE2417031A1 (ja)
SE (1) SE7503836L (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3307703A1 (de) * 1983-03-04 1984-09-06 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Dosen-siedekuehleinrichtung fuer leistungshalbleiterelemente
US4559580A (en) * 1983-11-04 1985-12-17 Sundstrand Corporation Semiconductor package with internal heat exchanger
DE3444173C2 (de) * 1984-12-04 1994-05-19 Bbc Brown Boveri & Cie Siedekühleinrichtung für Leistungshalbleiterelemente
FR2588072B1 (fr) * 1985-09-30 1987-12-11 Jeumont Schneider Installation de dissipation pour elements semi-conducteurs de puissance
US5283464A (en) * 1989-06-08 1994-02-01 The Furukawa Electric Co., Ltd. Electrically insulated heat pipe type cooling apparatus for semiconductor
US5043797A (en) * 1990-04-03 1991-08-27 General Electric Company Cooling header connection for a thyristor stack
JP2928603B2 (ja) * 1990-07-30 1999-08-03 キヤノン株式会社 Ｘ線露光装置用ウエハ冷却装置
DE59303632D1 (de) * 1992-08-04 1996-10-10 Abb Patent Gmbh Spannverband mit Halbleiterzellen und Kühldosen
FR2746177B1 (fr) * 1996-03-14 2000-04-07 Dispositif de refroidissement utilisant un refrigerant en ebullition et se condensant
FR2748888B1 (fr) * 1996-05-14 1998-06-19 Gec Alsthom Transport Sa Dispositif a elements semi-conducteurs de puissance
WO1998011767A1 (en) * 1996-09-16 1998-03-19 Abb Power T & D Company Inc. Solid state switching device arrangement for silicon transfer switch
US6367543B1 (en) 2000-12-11 2002-04-09 Thermal Corp. Liquid-cooled heat sink with thermal jacket
WO2003087695A1 (fr) * 2002-04-16 2003-10-23 Yoshiro Miyazaki Conduit calorique vibratoire a auto-excitation et calculateur le contenant
US7017655B2 (en) 2003-12-18 2006-03-28 Modine Manufacturing Co. Forced fluid heat sink
US20090108441A1 (en) * 2007-10-31 2009-04-30 General Electric Company Semiconductor clamp system
TWM347807U (en) * 2008-05-14 2008-12-21 Kuen Bao Electric Co Ltd Cooling system with high power thyristors
CN104934390B (zh) * 2015-06-24 2018-07-13 国家电网公司 一种用于110kV晶闸管阀体的水冷散热装置
CN104917499B (zh) * 2015-06-24 2019-02-05 国家电网公司 一种110kV等级晶闸管阀体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL96632C (ja) * 1955-07-06
GB882788A (en) * 1958-07-05 1961-11-22 Reinold Hagen Process and apparatus for manufacturing bottles and the like neck-provided articles from thermoplastic material
US3204157A (en) * 1960-08-30 1965-08-31 Welduction Corp Crystal diode heat dissipating mounting
CH498488A (de) * 1969-04-30 1970-10-31 Bbc Brown Boveri & Cie Kühleinrichtung insbesondere für Halbleiterelemente und Elektronenröhren
SE340321B (ja) * 1970-03-23 1971-11-15 Asea Ab
DE2204589A1 (de) * 1972-02-01 1973-08-16 Siemens Ag Kuehlanordnung fuer flache halbleiterbauelemente
JPS52606Y2 (ja) * 1972-05-06 1977-01-08

Also Published As

Publication number Publication date
JPS50143031A (ja) 1975-11-18
SE7503836L (sv) 1975-10-09
DE2417031A1 (de) 1975-10-16
US4023616A (en) 1977-05-17

Similar Documents

Publication Publication Date Title
AU474179B2 (ja)
AU465373B2 (ja)
AR203034Q (ja)
AU7034374A (ja)
AU7099174A (ja)
AU7474774A (ja)
CS164199B1 (ja)
BG20649A1 (ja)
BG20742A1 (ja)
AU480759A (ja)
AU481044A (ja)
AU481101A (ja)
BE836964A (ja)
BE837371A (ja)
BG19702A1 (ja)
BG19966A1 (ja)
BG20052A1 (ja)
BG20191A1 (ja)
BG20211A1 (ja)
BG20418A1 (ja)
AU479634A (ja)
BG20473A1 (ja)
BG20638A1 (ja)
BG20647A1 (ja)
BG21665A1 (ja)

Legal Events

Date Code Title Description
PL Patent ceased
PL Patent ceased