JPS501313U - - Google Patents

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Publication number
JPS501313U
JPS501313U JP4972373U JP4972373U JPS501313U JP S501313 U JPS501313 U JP S501313U JP 4972373 U JP4972373 U JP 4972373U JP 4972373 U JP4972373 U JP 4972373U JP S501313 U JPS501313 U JP S501313U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4972373U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4972373U priority Critical patent/JPS501313U/ja
Publication of JPS501313U publication Critical patent/JPS501313U/ja
Pending legal-status Critical Current

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JP4972373U 1973-04-27 1973-04-27 Pending JPS501313U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4972373U JPS501313U (ja) 1973-04-27 1973-04-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4972373U JPS501313U (ja) 1973-04-27 1973-04-27

Publications (1)

Publication Number Publication Date
JPS501313U true JPS501313U (ja) 1975-01-08

Family

ID=28191965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4972373U Pending JPS501313U (ja) 1973-04-27 1973-04-27

Country Status (1)

Country Link
JP (1) JPS501313U (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5314491A (en) * 1976-07-26 1978-02-09 Nec Corp Apparatus for grinding double surfaces
JPS5349396A (en) * 1976-10-18 1978-05-04 Nec Corp Both-side polishing machine
JPS54122086A (en) * 1978-03-16 1979-09-21 Nippon Telegr & Teleph Corp <Ntt> Simultaneous working method for both surfaces of wafer
JPS54122087A (en) * 1978-03-16 1979-09-21 Nippon Telegr & Teleph Corp <Ntt> Simultaneous working method for both surfaces of wafer
JPS5743429A (en) * 1980-08-28 1982-03-11 Toshiba Corp Manufacture of semiconductor device
JPH03221368A (ja) * 1989-11-10 1991-09-30 Fujikoshi Kikai Kogyo Kk ウエハー加工装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5314491A (en) * 1976-07-26 1978-02-09 Nec Corp Apparatus for grinding double surfaces
JPS608185B2 (ja) * 1976-07-26 1985-03-01 日本電気株式会社 両面研磨装置
JPS5349396A (en) * 1976-10-18 1978-05-04 Nec Corp Both-side polishing machine
JPS6028634B2 (ja) * 1976-10-18 1985-07-05 日本電気株式会社 両面研摩装置
JPS54122086A (en) * 1978-03-16 1979-09-21 Nippon Telegr & Teleph Corp <Ntt> Simultaneous working method for both surfaces of wafer
JPS54122087A (en) * 1978-03-16 1979-09-21 Nippon Telegr & Teleph Corp <Ntt> Simultaneous working method for both surfaces of wafer
JPS5735575B2 (ja) * 1978-03-16 1982-07-29
JPS5743429A (en) * 1980-08-28 1982-03-11 Toshiba Corp Manufacture of semiconductor device
JPH038111B2 (ja) * 1980-08-28 1991-02-05 Tokyo Shibaura Electric Co
JPH03221368A (ja) * 1989-11-10 1991-09-30 Fujikoshi Kikai Kogyo Kk ウエハー加工装置

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