JPS50119729A - - Google Patents

Info

Publication number
JPS50119729A
JPS50119729A JP50023377A JP2337775A JPS50119729A JP S50119729 A JPS50119729 A JP S50119729A JP 50023377 A JP50023377 A JP 50023377A JP 2337775 A JP2337775 A JP 2337775A JP S50119729 A JPS50119729 A JP S50119729A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50023377A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS50119729A publication Critical patent/JPS50119729A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
JP50023377A 1974-02-26 1975-02-24 Pending JPS50119729A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US445970A US3878061A (en) 1974-02-26 1974-02-26 Master matrix for making multiple copies

Publications (1)

Publication Number Publication Date
JPS50119729A true JPS50119729A (ja) 1975-09-19

Family

ID=23770859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50023377A Pending JPS50119729A (ja) 1974-02-26 1975-02-24

Country Status (3)

Country Link
US (1) US3878061A (ja)
JP (1) JPS50119729A (ja)
DE (1) DE2507102A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7267756B2 (en) 2002-02-20 2007-09-11 Sumitomo Electric Industries, Ltd. Fine electroforming mold and manufacturing method thereof
WO2010137568A1 (ja) * 2009-05-25 2010-12-02 三井金属鉱業株式会社 基材付孔あき金属箔、基材付孔あき金属箔の製造方法、孔あき金属箔及び孔あき金属箔の製造方法
JP2015030881A (ja) * 2013-08-02 2015-02-16 株式会社オプトニクス精密 開口プレート
JP2020500263A (ja) * 2016-11-03 2020-01-09 ティージーオー テック．コーポレイション 母板、母板の製造方法、マスクの製造方法及びｏｌｅｄ画素蒸着方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2416186C3 (de) * 1974-04-03 1978-12-21 Siemens Ag, 1000 Berlin Und 8000 Muenchen Maske zur Strukturierung dünner Schichten
US4080267A (en) * 1975-12-29 1978-03-21 International Business Machines Corporation Method for forming thick self-supporting masks
JPS5562732A (en) * 1978-11-06 1980-05-12 Chiyou Lsi Gijutsu Kenkyu Kumiai Preparation of aperture stop
US4762595A (en) * 1984-04-30 1988-08-09 Ppg Industries, Inc. Electroforming elements
US4549939A (en) * 1984-04-30 1985-10-29 Ppg Industries, Inc. Photoelectroforming mandrel and method of electroforming
US4772760A (en) * 1987-04-28 1988-09-20 Ppg Industries, Inc. Nonorthogonal EMP shielding elements
US4845310A (en) * 1987-04-28 1989-07-04 Ppg Industries, Inc. Electroformed patterns for curved shapes
US5277783A (en) * 1991-05-15 1994-01-11 Brother Kogyo Kabushiki Kaisha Manufacturing method for orifice plate
FR2746678B1 (fr) * 1996-03-26 1998-07-03 Commissariat Energie Atomique Procede de realisation d'un depot sur un support amovible, et depot realise sur un support
FR2764386B1 (fr) * 1997-06-06 1999-07-16 Commissariat Energie Atomique Support d'electrodes comportant au moins une electrode recouverte par un depot et systeme de lecture de ce support
JP4024464B2 (ja) * 2000-09-12 2007-12-19 富士フイルム株式会社 磁気転写装置
JP5294288B1 (ja) * 2012-10-30 2013-09-18 株式会社Ｌｅａｐ 樹脂基板を用い、電気鋳造によりコイル素子を製造する方法
CN104756209A (zh) * 2012-10-30 2015-07-01 株式会社Leap 线圈元件的制造方法
US20190252614A1 (en) * 2016-11-03 2019-08-15 Tgo Tech. Corporation Mother plate, method for manufacturing mother plate, method for manufacturing mask, and oled pixel deposition method
KR102246536B1 (ko) * 2017-07-04 2021-04-30 주식회사 오럼머티리얼 마스크 및 마스크의 제조 방법
WO2019009526A1 (ko) * 2017-07-04 2019-01-10 주식회사 티지오테크 마스크 및 마스크의 제조 방법, 모판
KR102055405B1 (ko) * 2017-07-24 2020-01-22 주식회사 티지오테크 모판 및 모판의 제조 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2805986A (en) * 1952-01-11 1957-09-10 Harold B Law Method of making fine mesh screens
US2765230A (en) * 1953-02-25 1956-10-02 Buckbee Mears Co Method of forming matrices for the electrodeposition of grids
US3703450A (en) * 1971-04-01 1972-11-21 Dynamics Res Corp Method of making precision conductive mesh patterns

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7267756B2 (en) 2002-02-20 2007-09-11 Sumitomo Electric Industries, Ltd. Fine electroforming mold and manufacturing method thereof
WO2010137568A1 (ja) * 2009-05-25 2010-12-02 三井金属鉱業株式会社 基材付孔あき金属箔、基材付孔あき金属箔の製造方法、孔あき金属箔及び孔あき金属箔の製造方法
JP2015030881A (ja) * 2013-08-02 2015-02-16 株式会社オプトニクス精密 開口プレート
JP2020500263A (ja) * 2016-11-03 2020-01-09 ティージーオー テック．コーポレイション 母板、母板の製造方法、マスクの製造方法及びｏｌｅｄ画素蒸着方法

Also Published As

Publication number Publication date
US3878061A (en) 1975-04-15
DE2507102A1 (de) 1975-08-28

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