JPS5010698B1 - - Google Patents

Info

Publication number
JPS5010698B1
JPS5010698B1 JP11900570A JP11900570A JPS5010698B1 JP S5010698 B1 JPS5010698 B1 JP S5010698B1 JP 11900570 A JP11900570 A JP 11900570A JP 11900570 A JP11900570 A JP 11900570A JP S5010698 B1 JPS5010698 B1 JP S5010698B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11900570A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11900570A priority Critical patent/JPS5010698B1/ja
Priority to GB5939371A priority patent/GB1316030A/en
Priority to DE19712163985 priority patent/DE2163985A1/de
Publication of JPS5010698B1 publication Critical patent/JPS5010698B1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP11900570A 1970-12-26 1970-12-26 Pending JPS5010698B1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP11900570A JPS5010698B1 (de) 1970-12-26 1970-12-26
GB5939371A GB1316030A (en) 1970-12-26 1971-12-21 Etchant for chemical dissolution of copper
DE19712163985 DE2163985A1 (de) 1970-12-26 1971-12-22 Verfahren zum chemischen Lösen von Kupfer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11900570A JPS5010698B1 (de) 1970-12-26 1970-12-26

Publications (1)

Publication Number Publication Date
JPS5010698B1 true JPS5010698B1 (de) 1975-04-23

Family

ID=14750622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11900570A Pending JPS5010698B1 (de) 1970-12-26 1970-12-26

Country Status (3)

Country Link
JP (1) JPS5010698B1 (de)
DE (1) DE2163985A1 (de)
GB (1) GB1316030A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019013160A1 (ja) * 2017-07-14 2019-01-17 メルテックス株式会社 銅エッチング液

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS526853B2 (de) * 1972-12-22 1977-02-25
IT1083401B (it) * 1977-05-27 1985-05-21 Alfachimici Spa Soluzione acida per l'attacco selettivo del rame
DE4024909A1 (de) * 1990-08-06 1992-02-13 Kernforschungsz Karlsruhe Selektive alkalische aetzloesung fuer kupfer oder kupferlegierungen
US5855805A (en) * 1996-08-08 1999-01-05 Fmc Corporation Microetching and cleaning of printed wiring boards
CN1865366B (zh) * 2005-05-16 2010-12-15 3M创新有限公司 提高有机聚合物涂层对铜表面附着力的方法和组合物
CN115613032A (zh) * 2022-10-11 2023-01-17 苏州华星光电技术有限公司 蚀刻液
CN117328066B (zh) * 2023-10-07 2024-03-22 江苏贺鸿电子有限公司 一种线路板用粗化微蚀剂及其制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019013160A1 (ja) * 2017-07-14 2019-01-17 メルテックス株式会社 銅エッチング液

Also Published As

Publication number Publication date
GB1316030A (en) 1973-05-09
DE2163985A1 (de) 1972-07-13

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