JPS5010636B2 - - Google Patents

Info

Publication number
JPS5010636B2
JPS5010636B2 JP6297771A JP6297771A JPS5010636B2 JP S5010636 B2 JPS5010636 B2 JP S5010636B2 JP 6297771 A JP6297771 A JP 6297771A JP 6297771 A JP6297771 A JP 6297771A JP S5010636 B2 JPS5010636 B2 JP S5010636B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6297771A
Other languages
Japanese (ja)
Other versions
JPS4829899A (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6297771A priority Critical patent/JPS5010636B2/ja
Publication of JPS4829899A publication Critical patent/JPS4829899A/ja
Publication of JPS5010636B2 publication Critical patent/JPS5010636B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Epoxy Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
JP6297771A 1971-08-20 1971-08-20 Expired JPS5010636B2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6297771A JPS5010636B2 (enrdf_load_html_response) 1971-08-20 1971-08-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6297771A JPS5010636B2 (enrdf_load_html_response) 1971-08-20 1971-08-20

Publications (2)

Publication Number Publication Date
JPS4829899A JPS4829899A (enrdf_load_html_response) 1973-04-20
JPS5010636B2 true JPS5010636B2 (enrdf_load_html_response) 1975-04-23

Family

ID=13215912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6297771A Expired JPS5010636B2 (enrdf_load_html_response) 1971-08-20 1971-08-20

Country Status (1)

Country Link
JP (1) JPS5010636B2 (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6231042U (enrdf_load_html_response) * 1985-08-12 1987-02-24
EP2546275A2 (en) 2002-09-05 2013-01-16 Daicel Chemical Industries, Ltd. Curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic parts, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation.

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030059618A1 (en) 2001-03-23 2003-03-27 Hideyuke Takai Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can
JP5226162B2 (ja) * 2001-05-14 2013-07-03 株式会社ダイセル 液状エポキシ樹脂組成物及びその用途
EP1726588A4 (en) * 2004-03-18 2009-05-20 Daicel Chem HIGHLY EXCLUSIVE ALICYCLIC EPOXY COMPOUND, PROCESS FOR THE PRODUCTION THEREOF, HARDENABLE EPOXY RESIN COMPOSITION, CURED PRODUCTS THEREOF PRODUCED, AND APPLICATION
JP4688503B2 (ja) 2005-01-07 2011-05-25 ダイセル化学工業株式会社 高純度脂環式ジエポキシ化合物およびその製造方法
EP2014634A4 (en) * 2006-04-18 2012-10-31 Daicel Chem PROCESS FOR THE PREPARATION OF CYCLIC OLEFINES
CN111566554B (zh) * 2018-03-07 2023-07-18 Jsr株式会社 液晶取向剂、液晶取向膜、液晶元件及其制造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6231042U (enrdf_load_html_response) * 1985-08-12 1987-02-24
EP2546275A2 (en) 2002-09-05 2013-01-16 Daicel Chemical Industries, Ltd. Curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic parts, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation.
EP2546275A3 (en) * 2002-09-05 2013-05-22 Daicel Chemical Industries, Ltd. Curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic parts, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation.

Also Published As

Publication number Publication date
JPS4829899A (enrdf_load_html_response) 1973-04-20

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