|
DE2705158C2
(de)
|
1977-02-04 |
1986-02-27 |
Schering AG, 1000 Berlin und 4709 Bergkamen |
Verfahren zum Teilgalvanisieren
|
|
US4186062A
(en)
*
|
1978-07-13 |
1980-01-29 |
Micro-Plate, Inc. |
Continuous tab plater and method
|
|
JPS5696098A
(en)
*
|
1979-12-29 |
1981-08-03 |
Electroplating Eng Of Japan Co |
Plating apparatus
|
|
US4294789A
(en)
*
|
1980-09-08 |
1981-10-13 |
Gte Products Corporation |
Plating mask fabricating process
|
|
US4294681A
(en)
*
|
1980-09-08 |
1981-10-13 |
Gte Products Corporation |
Molded selective plating mask
|
|
US4294680A
(en)
*
|
1980-09-08 |
1981-10-13 |
Gte Products Corporation |
Apparatus for selective metal plating
|
|
US4294669A
(en)
*
|
1980-09-08 |
1981-10-13 |
Gte Products Corporation |
Process for plating selected metal areas
|
|
US4374004A
(en)
*
|
1981-06-29 |
1983-02-15 |
Northern Telecom Limited |
Method and apparatus for surface-treating predetermined areas of a surface of a body
|
|
US4364801A
(en)
*
|
1981-06-29 |
1982-12-21 |
Northern Telecom Limited |
Method of an apparatus for selectively surface-treating preselected areas on a body
|
|
DE3378981D1
(en)
*
|
1982-10-05 |
1989-02-23 |
Owen S G Ltd |
Selective plating
|
|
EP0107931B1
(en)
*
|
1982-10-05 |
1989-01-18 |
S.G. Owen (Northampton) Limited |
Selective plating
|
|
US4539090A
(en)
*
|
1984-04-27 |
1985-09-03 |
Francis William L |
Continuous electroplating device
|
|
US4605483A
(en)
*
|
1984-11-06 |
1986-08-12 |
Michaelson Henry W |
Electrode for electro-plating non-continuously conductive surfaces
|
|
DE3624249A1
(de)
*
|
1986-07-18 |
1988-01-28 |
Odiso & Engelhardt Gmbh & Co K |
Vorrichtung zum erzeugen eines elektrolytischen metallniederschlages auf metallenen gegenstaenden an vorbestimmten stellen
|
|
AT388073B
(de)
*
|
1986-12-10 |
1989-04-25 |
Voest Alpine Ag |
Einrichtung zum abdecken von teilen von leiterplatten
|
|
US4898653A
(en)
*
|
1988-09-26 |
1990-02-06 |
The Dow Chemical Company |
Combination electrolysis cell seal member and membrane tentering means
|
|
JPH0781199B2
(ja)
*
|
1989-11-30 |
1995-08-30 |
大同メタル工業株式会社 |
半割型すべり軸受中間製品の表面処理方法およびその装置
|
|
US5200048A
(en)
*
|
1989-11-30 |
1993-04-06 |
Daido Metal Company Ltd. |
Electroplating apparatus for plating half bearings
|
|
GB2259307B
(en)
*
|
1991-09-04 |
1995-04-12 |
Standards Inst Singapore |
A process for depositing gold on the surface of an article of tin or a tin based alloy
|
|
JP3200468B2
(ja)
*
|
1992-05-21 |
2001-08-20 |
日本エレクトロプレイテイング・エンジニヤース株式会社 |
ウエーハ用めっき装置
|
|
EP0597428B1
(en)
*
|
1992-11-09 |
1997-07-30 |
Canon Kabushiki Kaisha |
Anodization apparatus with supporting device for substrate to be treated
|
|
US5824199A
(en)
*
|
1993-11-22 |
1998-10-20 |
E. I. Du Pont De Nemours And Company |
Electrochemical cell having an inflatable member
|
|
WO1995020064A1
(en)
*
|
1994-01-24 |
1995-07-27 |
Berg N Edward |
Uniform electroplating of printed circuit boards
|
|
JP3377849B2
(ja)
*
|
1994-02-02 |
2003-02-17 |
日本エレクトロプレイテイング・エンジニヤース株式会社 |
ウエーハ用メッキ装置
|
|
AU4662097A
(en)
*
|
1996-10-01 |
1998-04-24 |
Symyx Technologies, Inc. |
Potential masking systems and methods for combinitorial library synthesis
|
|
CA2572503A1
(en)
*
|
1997-04-04 |
1998-10-15 |
University Of Southern California |
Method for electrochemical fabrication including enhanced data manipulation
|
|
US20030104481A1
(en)
*
|
1997-09-30 |
2003-06-05 |
Symyx Technologies |
Potential masking systems and methods for combinatorial library synthesis
|
|
US5961807A
(en)
*
|
1997-10-31 |
1999-10-05 |
General Electric Company |
Multipart electrical seal and method for electrically isolating a metallic projection
|
|
US6228233B1
(en)
*
|
1998-11-30 |
2001-05-08 |
Applied Materials, Inc. |
Inflatable compliant bladder assembly
|
|
US6423636B1
(en)
*
|
1999-11-19 |
2002-07-23 |
Applied Materials, Inc. |
Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer
|
|
US9614266B2
(en)
|
2001-12-03 |
2017-04-04 |
Microfabrica Inc. |
Miniature RF and microwave components and methods for fabricating such components
|
|
US7259640B2
(en)
|
2001-12-03 |
2007-08-21 |
Microfabrica |
Miniature RF and microwave components and methods for fabricating such components
|
|
US10416192B2
(en)
|
2003-02-04 |
2019-09-17 |
Microfabrica Inc. |
Cantilever microprobes for contacting electronic components
|
|
US8613846B2
(en)
*
|
2003-02-04 |
2013-12-24 |
Microfabrica Inc. |
Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
|
|
US9671429B2
(en)
|
2003-05-07 |
2017-06-06 |
University Of Southern California |
Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
|
|
TWI297045B
(en)
*
|
2003-05-07 |
2008-05-21 |
Microfabrica Inc |
Methods and apparatus for forming multi-layer structures using adhered masks
|
|
US10297421B1
(en)
|
2003-05-07 |
2019-05-21 |
Microfabrica Inc. |
Plasma etching of dielectric sacrificial material from reentrant multi-layer metal structures
|
|
EP1903129A1
(en)
*
|
2003-11-20 |
2008-03-26 |
Process Automation International Limited |
A liquid delivery system for an electroplating apparatus, an electroplating apparatus with such a liquid delivery system, and a method of operating an electroplating apparatus
|
|
CN100523309C
(zh)
*
|
2003-12-25 |
2009-08-05 |
亚洲电镀器材有限公司 |
电镀设备液体输送系统，有该系统的电镀设备及其操作方法
|
|
US10641792B2
(en)
|
2003-12-31 |
2020-05-05 |
University Of Southern California |
Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
|
|
US20050227049A1
(en)
*
|
2004-03-22 |
2005-10-13 |
Boyack James R |
Process for fabrication of printed circuit boards
|
|
US7655126B2
(en)
*
|
2006-03-27 |
2010-02-02 |
Federal Mogul World Wide, Inc. |
Fabrication of topical stopper on MLS gasket by active matrix electrochemical deposition
|
|
US20080127490A1
(en)
*
|
2006-12-01 |
2008-06-05 |
Lotes Co., Ltd. |
Manufacture process of connector
|
|
ITVR20090114A1
(it)
*
|
2009-07-24 |
2011-01-25 |
Gianfranco Natali |
Maschera di schermatura per la placcatura galvanica selettiva di oggetti, in particolare filtri per telecomunicazioni
|
|
US9583125B1
(en)
*
|
2009-12-16 |
2017-02-28 |
Magnecomp Corporation |
Low resistance interface metal for disk drive suspension component grounding
|
|
US20140197027A1
(en)
*
|
2013-01-11 |
2014-07-17 |
Ming-Hong Kuo |
Electroplating aid board and electroplating device using same
|
|
US11262383B1
(en)
|
2018-09-26 |
2022-03-01 |
Microfabrica Inc. |
Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
|
|
CN117552071B
(zh)
*
|
2024-01-11 |
2024-03-29 |
宁波惠金理化电子有限公司 |
一种五金电镀设备及其使用方法
|
